Printed circuit board and camera device comprising same

Patent metadata

Field	Value
Publication number	US-12144103-B2
Application number	US-201917252172-A
Country	US
Kind code	B2
Filing date	Jun 14, 2019
Priority date	Jun 15, 2018
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.

First claim

The invention claimed is:

1. A circuit board comprising:
a substrate;
a heat dissipation via passing through at least a portion of the substrate;
a through via passing through a portion of the substrate and spaced apart from the heat dissipation via in a horizontal direction;
a pad disposed on the substrate and overlapping with the heat dissipation via in a vertical direction and not overlapping with the through via in the vertical direction;
a first connection part disposed on the pad;
a first element mounted on the first connection part,
a second connection part disposed on the pad and spaced apart from the first connection part in the horizontal direction; and
a second element mounted on the second connection part,
wherein the first element includes a first region overlapping the pad in the vertical direction and a second region non-overlapping with the pad in the vertical direction,
wherein a part of the second region of the first element overlaps the through via in the vertical direction,
wherein the pad includes an overlap region overlapping the heat dissipation via in the vertical direction and a non-overlapping region not overlapping with the heat dissipation via in the vertical direction, and
wherein the first and second connection parts are disposed on the non-overlapping region of the pad.

2. The circuit board of claim 1 ,
wherein an entire region of the second element is overlapped with the pad in the vertical direction.

3. The circuit board of claim 1 , wherein the second region does not overlap the heat dissipation via.

4. The circuit board of claim 1 , wherein the heat dissipation via comprises a plurality of heat dissipation via parts spaced apart from each other in the horizontal direction, and
wherein the plurality of heat dissipation via parts are commonly connected to the pad.

5. The circuit board of claim 4 , wherein each of the plurality of heat dissipation via parts has a first width smaller in a first horizontal direction than a second width in a second horizontal direction different from the first horizontal direction.

6. The circuit board of claim 4 , wherein the plurality of heat dissipation via parts have a surface area of 10% or more of a surface area of the pad.

7. The circuit board of claim 5 , wherein widths of the through via in the first and second horizontal directions are smaller than the second width.

8. The circuit board of claim 1 , wherein the substrate comprises a first insulating layer and a second insulating layer,
wherein the heat dissipation via includes a first heat dissipation via passing through the first insulating layer, and a second heat dissipation via passing through the second insulating layer, and
wherein the first heat dissipation via overlaps the second heat dissipation via in the vertical direction.

9. The circuit board of claim 2 , wherein the first element includes a driver element; and
wherein the second element includes a vertical cavity type surface-emission laser element.

10. The circuit board of claim 2 , wherein the first element comprises a ground terminal overlapping the first connection part in the vertical direction, and
wherein the ground terminal is connected to the second element through the pad.

11. The circuit board of claim 9 , wherein the second element includes a cathode electrode,
wherein the second connection part is disposed between the cathode electrode and the pad, and
wherein the cathode electrode and a ground terminal are connected to each other through the pad.

12. The circuit board of claim 11 , wherein an upper surface of the overlap region of the pad includes a concave portion provided in a region overlapping the heat dissipation via in the vertical direction.

Assignees

• Lg Innotek Co Ltd

Inventors

• Yoo Do Hyuk
• Lee Hee Jung
• Han Young Ju
• Lee Young Il

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W40/228 Primary

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H05K1/112

  directly combined with via connections · CPC title

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title