Method and apparatus for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser

Patent metadata

Field	Value
Publication number	US-12130554-B2
Application number	US-202418404934-A
Country	US
Kind code	B2
Filing date	Jan 5, 2024
Priority date	Oct 26, 2021
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

A method and an apparatus for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser. The method of the present application uses a parallel interpenetrating algorithm. Firstly, a multi-beam solid light spot for writing is generated based on a writing light spatial light modulator; a multi-beam hollow light spot for inhibition is generated based on an inhibition optical spatial light modulator; the multi-beam solid light spot is combined with the multi-beam hollow light spot to generate a modulated multi-beam light spot; a writing waveform is output based on a multichannel acousto-optic modulator, a displacement stage moves at a constant speed until writing of a whole column of areas is completed, an optical switch is turned off, and the displacement stage conducts one-time stepping movement; the process is not stopped until all patterns are written.

First claim

What is claimed is:

1. A method for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser, comprising:
step a) generating a beam of writing light laser based on a writing light laser;
step b) generating multiple writing light beams propagating in different diffraction directions based on a writing light optical diffractometer;
step c) generating a beam of inhibited light laser based on an inhibited light laser;
step d) generating multiple inhibited light beams propagating in different diffraction directions based on an inhibited light optical diffractometer;
step e) combining the writing light beams and the inhibited light beams based on a dichroic mirror to form modulated multiple beams;
step f) modulating an arrangement direction of the multiple beams based on an image rotator;
step g) moving at a constant speed in a longitudinal direction based on a displacement stage;
step h) transversely high-speed-scanning the multiple beams based on a rotating mirror;
step i) outputting a multichannel writing waveform based on a multichannel high-speed optical switch;
step j) the displacement stage moving at a constant speed until writing of a whole column of areas is completed, turning off an optical switch, and step-moving the displacement stage for one time; and
step k) repeating the steps e)-j) until all patterns are written.

2. The method for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser according to claim 1 , wherein in the step f), a modulation angle θ r satisfies:
n×N beams ×δd+δd=D| sin θ r |+D |cos θ r |·δd/L max

where the modulation angle θ r is defined as an included angle between a scanning direction of the rotating mirror and the arrangement direction of the multiple beams; n is an integer, representing that a first beam reaches a designated position after n times of scanning, δd is a line spacing, representing a distance between the designated position and a first writing position of a last beam of the multiple beams, N beams represents a number of the multiple beams, being an integer; D represents a distance between two adjacent beams of the multiple beams; L max represents a maximum length that the rotating mirror reaches in a single scanning on a focal plane of an objective lens.

3. The method for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser according to claim 1 , wherein in the step g), a moving direction is perpendicular to a scanning direction of the rotating mirror, with moving speed vs satisfying:
v s =δd/L max ·v PLS
where v PLS represents a scanning speed of the rotating mirror.

4. The method for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser according to claim 1 , wherein in the step i), the output multichannel writing waveform satisfies the parallel interpenetrating algorithm, and comprises:
sub-step i1) outputting only a writing waveform of a N beams th beam;
sub-step i2) starting to output a writing waveform of a N beams −1 th beam after n times of scanning;
sub-step i3) starting to output a writing waveform of a N beams −2 th beam after n times of scanning; and
sub-step i4) repeating the steps i2)-i3) until all beam waveforms start to be output.

5. The method of direct writing photoetching by parallel interpenetrating super-resolution high-speed laser according to claim 1 , wherein in the step j), a moving direction of step-moving the displacement stage for one time is parallel to a writing direction of the rotating mirror, with a moving distance L step satisfying:
L step =L max −L useless
L useless =L out +D×N beams |cos θ r |

where L useless represents an invalid writing area, a first term L out represents an invalid writing length caused by cutting a light spot by the edge of the rotating mirror, and a second term D×N beams |cos θ r | represents an invalid writing length caused by inclination of the multiple beams.

6. An apparatus for implementing the method according to claim 1 , comprising:
a writing light laser configured to emit writing laser;
a writing light group velocity dispersion compensation unit configured to offsetting a positive group velocity dispersion generated by writing light beams in subsequent optical path propagation;
a writing light beam expanding and shaping apparatus configured to generating high-quality, beam-expanded and collimated writing light beams;
a writing light optical diffractometer configured to generate high-throughput parallel writing light beams;
a writing light multichannel high-speed optical switch apparatus configured to independently control on-off of each sub-beam in the high-throughput parallel writing light beams;
an inhibited light laser configured to emit inhibited light laser;
an inhibited light beam expanding and shaping apparatus configured to generating high-quality, beam-expanded and collimated inhibited light;
an inhibited light optical diffractometer configured to generate high-throughput parallel inhibited light beams;
an inhibited light multichannel high-speed optical switch apparatus configured to independently control on-off of each sub-beam in the high-throughput parallel inhibited light beams;
an image rotator apparatus configured to continuously adjust an arrangement direction of the multiple beams and a scanning direction of a rotating mirror;
a high-speed rotating mirror configured to horizontally parallel-scan the high-throughput parallel writing light beams;
a scanning lens system configured to focus high-throughput parallel writing light beams on a photoetching sample; and
a sample translation movement mechanism configured to vertically step-move and large-range-three-dimensional move the photoetching sample.

7. The apparatus according to claim 6 , wherein the group velocity dispersion compensation unit comprises a group velocity dispersion compensation element, a plurality of reflecting mirrors and a one-dimensional displacement stage, wherein an optical diffractometer comprises a spatial light modulator (SLM), a digital micromirror device (DMD) and a diffractive optical element (DOE), wherein the multichannel high-speed optical switch apparatus is a multichannel acousto-optic modulator, wherein the scanning lens system comprises a scanning lens, a field lens and an objective lens, and a combination comprising at least one of the above three lenses, wherein the sample translation movement mechanism comprises: a piezoelectric displacement stage, an air bearing displacement stage, a mechanical electric displacement stage, a manual displacement stage, and a combination comprising at least one of the above three stages, wherein the image rotator apparatus comprises a Dowell prism and a three-sided reflecting mirror.

8. The apparatus according to claim 7 , wherein the group velocity dispersion compensation element comprises a grating and a prism.

Assignees

• Zhejiang Lab
• Univ Zhejiang

Inventors

• Kuang Cuifang
• Wang Hongqing
• Wang Ziang
• Yang Zhenyao
• Tang Mengbo
• Zhan Lanxin
• Zhang Xiaoyi
• Wen Jisen
• Liu Xu

Classifications

• G03F7/704

  Scanned exposure beam, e.g. raster-, rotary- and vector scanning (mask projection exposure involving relative movement of patterned beam and workpiece during imaging G03F7/70358) · CPC title

• G03F7/70391

  Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays · CPC title

• G03F7/70191

  Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like · CPC title

• G03F7/70366

  Rotary scanning · CPC title

• G03F7/2053 Primary

  using a laser (ablative removal B41C) · CPC title