Soldering module
US-2017209949-A1 · Jul 27, 2017 · US
Soldering systems having a nozzle exchange unit including a nitrogen inlet and hood
US12128505B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12128505-B2 |
| Application number | US-202117369717-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 7, 2021 |
| Priority date | Jul 8, 2020 |
| Publication date | Oct 29, 2024 |
| Grant date | Oct 29, 2024 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A soldering system comprising a solder pot and a nozzle exchange unit. The solder pot is configured to detachably couple to a solder nozzle during a soldering operation. The nozzle exchange unit is arranged to: store a plurality of solder nozzles; detach a first nozzle from the nozzle coupling; and attach a stored second nozzle to the nozzle coupling.
First claim
Opening claim text (preview).
What is claimed is: 1. A soldering system comprising: a solder pot comprising a nozzle coupling configured to detachably receive one of a plurality of solder nozzles for directing solder during a soldering operation; and a nozzle exchange unit arranged to: store the plurality of solder nozzles; detach a first nozzle of the plurality of solder nozzles from the nozzle coupling; and attach a stored second nozzle of the plurality of solder nozzles to the nozzle coupling, wherein the nozzle exchange unit comprises a nitrogen inlet and a hood configured such that the plurality of solder nozzles are stored in a nitrogen environment within the hood. 2. The soldering system according to claim 1 , wherein the solder pot further comprises a nozzle coupling arranged to detachably receive one of the plurality of solder nozzle nozzles. 3. The soldering system according to claim 2 , wherein the nozzle coupling comprises a bayonet connection configured to couple to a corresponding portion of an attached one of the plurality of solder nozzles. 4. The soldering system according to claim 1 , wherein the first nozzle of the plurality of solder nozzles comprises an inlet for receiving a liquidus solder and an outlet for dispensing liquidus solder therefrom. 5. The soldering system according to claim 1 , wherein the solder pot further comprises a liquidus solder source configured to deliver liquidus solder to the first nozzle during a soldering operation. 6. The soldering system according to claim 1 , further comprising at least one actuator configured to effect relative movement between the solder pot and the nozzle exchange unit. 7. The soldering system according to claim 1 , further comprising translation means configured to effect relative movement between the solder pot and a component to be soldered along or about at least one axis.
Assignees
Inventors
Classifications
Solder baths · CPC title
Printed circuits · CPC title
- B23K1/0016Primary
Soldering of electronic components · CPC title
Soldering by means of dipping in molten solder · CPC title
Auxiliary devices therefor · CPC title
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Frequently asked questions
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- What does patent US12128505B2 cover?
- A soldering system comprising a solder pot and a nozzle exchange unit. The solder pot is configured to detachably couple to a solder nozzle during a soldering operation. The nozzle exchange unit is arranged to: store a plurality of solder nozzles; detach a first nozzle from the nozzle coupling; and attach a stored second nozzle to the nozzle coupling.
- Who is the assignee on this patent?
- Illinois Tool Works
- What technology area does this patent fall under?
- Primary CPC classification B23K1/0016. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 29 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).