Substrate cleaning device, substrate processing apparatus, break-in device, method for estimating number of fine particles adhering to substrate, method for determining degree of contamination of substrate cleaning member, and method for determining break-in processing

Patent metadata

Field	Value
Publication number	US-12128449-B2
Application number	US-202217839382-A
Country	US
Kind code	B2
Filing date	Jun 13, 2022
Priority date	Jun 15, 2021
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member; and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.

First claim

What is claimed is:

1. A substrate cleaning device comprising:
a substrate holder configured to hold a substrate;
a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle;
a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and perform self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle;
a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member; and
a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid;
a first pipe configured to guide the waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member to the measurement module;
a three-way valve provided in the first pipe; and
a second pipe configured to supply flushing water to the measurement module via the three-way valve.

2. The substrate cleaning device according to claim 1 , wherein the physical property value includes at least one of a number of fine particles, a pH value, an electrical conductivity, and a total organic carbon concentration.

3. The substrate cleaning device according to claim 1 , wherein the controller determines an operating condition for self-cleaning based on the physical property value of the waste liquid.

4. The substrate cleaning device according to claim 1 , wherein the controller determines an operating condition for substrate cleaning based on the physical property value of the waste liquid.

5. The substrate cleaning device according to claim 1 , wherein the controller determines a timing to replace the substrate cleaning member based on the physical property value of the waste liquid.

6. A substrate processing apparatus comprising:
a substrate polishing device that polishes a substrate, using a suspension; and
the substrate cleaning device according claim 1 .

Assignees

• Ebara Corp

Inventors

• Takahashi Hiroki
• Kondo Daichi
• Imamura Yu

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title