Arc lamp with forming gas for thermal processing systems

Patent metadata

Field	Value
Publication number	US-12119216-B2
Application number	US-202318336552-A
Country	US
Kind code	B2
Filing date	Jun 16, 2023
Priority date	Nov 24, 2020
Publication date	Oct 15, 2024
Grant date	Oct 15, 2024

Abstract

Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.

First claim

What is claimed is:

1. A thermal processing system, comprising:
a processing chamber configured to thermally treat a workpiece; and
an arc lamp heat source, the arc lamp heat source comprising:
a plurality of electrodes configured to generate a plasma in a forming gas, wherein the plurality of electrodes comprises a tip and a heat sink at least partially around the tip, the heat sink comprises an inner portion and an outer portion, wherein the inner portion and the outer portion comprise different materials; and
the forming gas comprises a mixture of a hydrogen gas and an inert gas with the hydrogen gas in the mixture having a concentration less than 4% by volume, the hydrogen gas introduced into the arc lamp prior to generating the plasma.

2. The thermal processing system of claim 1 , wherein the forming gas is premixed.

3. The thermal processing system of claim 2 , wherein the arc lamp heat source further comprises:
a circulation system configured to circulate the forming gas in the arc lamp heat source; and
a gas supply configured to provide the forming gas to the circulation system.

4. The thermal processing system of claim 1 , wherein the arc lamp heat source is configured such that the forming gas enters the arc lamp heat source at a first electrode of the plurality of electrodes, and the forming gas is exhausted at a second electrode of the plurality of electrodes.

5. The thermal processing system of claim 1 , wherein the arc lamp heat source is coupled to a water loop configured to circulating water through the arc lamp heat source during operation of the arc lamp heat source such that a water wall is formed in the arc lamp heat source.

6. The thermal processing system of claim 5 , wherein during an arc discharge between the plurality of electrodes, the hydrogen gas of the forming gas reacts with free oxygen dissociated from the water wall to reduce oxidation of the plurality of electrodes.

7. The thermal processing system of claim 5 , wherein the arc lamp heat source further comprises a quartz tube.

8. The thermal processing system of claim 5 , wherein the water forming the water wall is injected perpendicular to a center axis of the arc lamp heat source such that a centrifugal action generates a water vortex to form the water wall.

9. The thermal processing system of claim 8 , wherein the arc lamp heat source is configured such that the forming gas rotates in a same direction as the water wall relative to the center axis of the arc lamp heat source during operation of the arc lamp heat source.

10. The thermal processing system of claim 1 , wherein the tip of at least one of the plurality of electrodes comprises hafnium alloy.

11. The thermal processing system of claim 10 , wherein the hafnium alloy comprises hafnium, carbon, and nitrogen.

12. The thermal processing system of claim 1 , wherein the tip of at least one of the plurality of electrodes comprises tantalum hafnium carbide.

13. The thermal processing system of claim 1 , wherein the heat sink comprises silver.

14. The thermal processing system of claim 1 , wherein the heat sink comprises diamond-copper sintering material.

15. The thermal processing system of claim 1 , wherein the heat sink comprises an inner portion of diamond-copper sintering material and an outer portion of silver or copper.

16. The thermal processing system of claim 1 , wherein the hydrogen gas is H 2 .

17. The thermal processing system of claim 1 , wherein the hydrogen gas is D 2 .

18. The thermal processing system of claim 1 , wherein the inert gas is one or more of argon gas, helium gas, neon gas, or xenon gas.

19. The thermal processing system of claim 1 , wherein the concentration of the hydrogen gas in the mixture is less than about 3% by volume.

20. An arc lamp, comprising:
a tube;
one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp; and
a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets, the forming gas introduced into the arc lamp prior to generating the plasma, wherein the plurality of electrodes comprise:
a tip where the tip of at least one of the plurality of electrodes comprises hafnium alloy or tantalum hafnium carbide; and
a heat sink around the tip, the heat sink comprises an inner portion and an outer portion, wherein the inner portion and the outer portion comprise different materials; and

the forming gas comprises one or more inert gases.

21. The arc lamp of claim 20 , wherein the hafnium alloy comprises hafnium, carbon, and nitrogen.

22. The arc lamp of claim 20 , wherein the heat sink comprises silver.

23. The arc lamp of claim 20 , wherein the heat sink comprises diamond-copper sintering material.

24. The arc lamp of claim 20 , wherein the inner portion of the heat sink comprises diamond-copper sintering material and the outer portion of the heat sink comprises of silver or copper.

Assignees

• Beijing E Town Semiconductor Tech Co Ltd
• Mattson Tech Inc

Inventors

• Yang Michael X
• Bremensdorfer Rolf
• Camm Dave
• Cibere Joseph
• Hezler Dieter
• Ma Shawming
• Yang Yun

Classifications

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H01J61/12

  Selection of substances for gas fillings; Specified operating pressure or temperature · CPC title

• H01J61/28

  Means for producing, introducing, or replenishing gas or vapour during operation of the lamp · CPC title

• H01J61/526 Primary

  heating or cooling of electrodes · CPC title

• H05H1/48

  using an arc (H05H1/26 takes precedence) · CPC title