TiCN having reduced growth defects by means of HiPIMS
US-11542587-B2 · Jan 3, 2023 · US
US12110580B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12110580-B2 |
| Application number | US-202218148197-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 29, 2022 |
| Priority date | Apr 22, 2016 |
| Publication date | Oct 8, 2024 |
| Grant date | Oct 8, 2024 |
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A method for applying a coating having at least one TiCN layer to a surface of a substrate to be coated by means of high power impulse magnetron sputtering (HIPIMS), wherein, to deposit the at least one TiCN layer, at least one Ti target is used as the Ti source for producing the TiCN layer, said target being sputtered in a reactive atmosphere by means of a HIPIMS process in a coating chamber, wherein the reactive atmosphere comprises at least one inert gas, preferably argon, and at least nitrogen gas as the reactive gas, wherein: the reactive atmosphere additionally contains, as a second reactive gas, a gas containing carbon, preferably CH4, used as the source of carbon to produce the TiCN layer wherein, while depositing the TiCN layer, a bipolar bias voltage is applied to the substrate to be coated, or at least one graphite target is used as the source of carbon for producing the TiCN layer, said target being used for sputtering in the coating chamber using a HIPIMS process with the reactive atmosphere having only nitrogen gas as the reactive gas, wherein the Ti targets are preferably operated by means of a first power supply device or a first power supply unit and the graphite targets are operated with pulsed power by means of a second power supply device or a second power supply unit.
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The invention claimed is: 1. A method for depositing a coating having at least one titanium carbonitride (TiCN) layer on a surface of a substrate by means of high power impulse magnetron sputtering (HiPIMS), wherein, to reduce growth defects during deposition of the at least one TiCN layer on the surface, the method comprises: depositing the TiCN layer with a HiPIMS process by sputtering at least one target comprising Ti and at least one target comprising carbon in a reactive atmosphere in a coating chamber, wherein the at least one target comprising Ti is used as the source of Ti for producing the TiCN layer, wherein the at least one target comprising carbon is used as the source of carbon for producing the TiCN layer, and wherein the reactive atmosphere has an inert gas and only nitrogen gas as a reactive gas. 2. The method of claim 1 , wherein the at least one target comprising Ti is operated via a first power supply device or a first power supply unit, and/or the at least one target comprising carbon is operated with pulsed power via a second power supply device or a second power supply unit. 3. The method of claim 2 , wherein the at least one target comprising Ti is a metallic target consisting of Ti. 4. The method of claim 3 , wherein the at least one target comprising carbon is a target consisting of graphite. 5. The method of claim 3 , wherein the at least one target comprising carbon is a target made of a composite material. 6. The method of claim 5 , wherein the target made of the composite material consists of one carbide and at least one metal. 7. The method of claim 2 , wherein the at least one target comprising Ti is a ceramic target consisting of TiC. 8. The method of claim 7 , wherein the at least one target comprising carbon is a target consisting of graphite. 9. The method of claim 7 , wherein the at least one target comprising carbon is a target made of a composite material. 10. The method of claim 9 , wherein the target made of the composite material consists of one carbide and at least one metal. 11. The method of claim 2 , wherein the at least one target comprising carbon is a target consisting of graphite. 12. The method of claim 2 , wherein the at least one target comprising carbon is a target made of a composite material. 13. The method of claim 12 , wherein the target made of the composite material consists of one carbide and at least one metal.
Material · CPC title
using more than one target (C23C14/56 takes precedence) · CPC title
using pulsed power to the target · CPC title
using substrate bias · CPC title
Carbonitrides · CPC title
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