Annealing device and annealing method

Patent metadata

Field	Value
Publication number	US-12106983-B2
Application number	US-202117336932-A
Country	US
Kind code	B2
Filing date	Jun 2, 2021
Priority date	Dec 3, 2018
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

There is provided an annealing device including a heating unit that heats a surface of an annealing object to temporarily melt an outer layer portion, a sensor that detects thermal radiation light from the annealing object heated by the heating unit, and a processing unit that estimates an annealing result of the annealing object on the basis of a waveform showing a temporal change in an intensity of the thermal radiation light detected by the sensor.

First claim

What is claimed is:

1. An annealing device comprising:
a heating unit that heats a surface of an annealing object to temporarily melt an outer layer portion;
a sensor that detects thermal radiation light from the annealing object heated by the heating unit; and
a processing unit that estimates an annealing result of the annealing object on a basis of a waveform showing a temporal change in an intensity of the thermal radiation light detected by the sensor,
wherein the waveform includes a peak corresponding to a start of melting and a peak corresponding to complete solidification, and
the processing unit estimates a melting depth of the outer layer portion of the annealing object on a basis of a melting time from the peak to the peak.

2. The annealing device according to claim 1 ,
wherein the processing unit obtains a melting time of the outer layer portion of the annealing object on a basis of a characteristic shape of the waveform showing the temporal change in the intensity of the thermal radiation light detected by the sensor.

3. An annealing device comprising:
a heating unit that heats a surface of an annealing object to temporarily melt an outer layer portion;
a sensor that detects thermal radiation light from the annealing object heated by the heating unit; and
a processing unit that estimates an annealing result of the annealing object on a basis of a waveform showing a temporal change in an intensity of the thermal radiation light detected by the sensor,
wherein the processing unit estimates a melting depth of the outer layer portion of the annealing object on a basis of an area of the waveform showing the temporal change in the intensity of the thermal radiation light detected by the sensor.

4. The annealing device according to claim 2 , further comprising:
a display unit that displays an image,
wherein the heating unit moves a heating spot on the surface of the annealing object, and
the processing unit associates a position in the surface of the annealing object with the estimated melting depth and displays a distribution of the melting depth on the display unit.

5. The annealing device according to claim 1 ,
wherein the processing unit determines a quality of the annealing result on a basis of the intensity of the thermal radiation light detected by the sensor.

6. An annealing method comprising:
heating a part of a surface of an annealing object to melt an outer layer portion; and
estimating an annealing result of the annealing object on a basis of a waveform showing a temporal change in an intensity of thermal radiation light from a heated spot of the annealing object,
wherein the waveform includes a peak corresponding to a start of melting and a peak corresponding to complete solidification, and
the annealing method further comprises:
estimating a melting depth of the outer layer portion of the annealing object on a basis of a melting time from the peak to the peak.

Assignees

• Sumitomo Heavy Industries

Inventors

• Tanaka Teppei

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H10P34/42

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title