LED display unit group and display panel

Patent metadata

Field	Value
Publication number	US-12100690-B2
Application number	US-201917281433-A
Country	US
Kind code	B2
Filing date	Sep 26, 2019
Priority date	Aug 10, 2018
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

Provided is an LED display unit group, comprising: an insulation substrate, a front circuit board, and a back circuit board. The front circuit board is divided into pixel areas arranged in an array of 2m rows and 2n columns. Each pixel area comprises three A-electrode pads, three LED light-emitting chips of different light emission colors, and B-electrode pads corresponding to the three LED light-emitting chips. In each pixel area, the electrode A of each LED light-emitting chip is electrically connected to a corresponding A-electrode pad, and the electrode B of each LED light-emitting chip is electrically connected to a corresponding B-electrode pad. In the same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other. In the same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of the same light emission color are electrically connected to each other.

First claim

What is claimed is:

1. A light emitting diode (LED) display unit group, comprising: an insulation substrate, a front circuit board disposed on a front surface of the insulation substrate, and a back circuit board disposed on a back surface of the insulation substrate;
wherein the insulation substrate is provided with metal vias for connecting the front circuit board and the back circuit board;
wherein the front circuit board is divided into pixel areas arranged in an array of 2m rows and 2n columns, and each of the pixel areas comprises a first A-electrode pad, a second A-electrode pad, and a third A-electrode pad, three LED light-emitting chips of different light emission colors, and B-electrode pads corresponding to the three LED light-emitting chips of different light emission colors; wherein the three LED light-emitting chips of different light emission colors are a first LED light-emitting chip, a second LED light-emitting chip, and a third LED light-emitting chip, respectively, each of the three LED light-emitting chips comprises an electrode A and an electrode B, a polarity of the electrode A is opposite to a polarity of the electrode B, n is a positive integer greater than or equal to 1, and m is a positive integer greater than or equal to 1;
in each of the pixel areas, the electrode A of each of the three LED light-emitting chips is electrically connected to a corresponding A-electrode pad, and the electrode B of each of the three LED light-emitting chips is electrically connected to a corresponding B-electrode pad;
in a same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other; and
in a same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of a same light emission color are electrically connected to each other;
wherein the back circuit board comprises 6m A-electrode pins and 2n common B-electrode pins;
in a same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of a same light emission color are electrically connected to each other and are electrically connected through at least one of the metal vias to an A-electrode pin corresponding to the LED light-emitting chips of the same light emission color in the row of pixel areas; and
in a same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other and are electrically connected through at least one of the metal vias to a common B-electrode pin corresponding to the column of pixel areas:
wherein the back surface of the insulation substrate is provided with an insulation layer covering back surface metal wires on the back circuit board and the metal vias electrically connected to the back surface metal wires;
wherein the back surface of the insulation substrate is provided with second identification marks for identifying polarities of pins;
wherein the insulation layer comprises two insulation materials of different colors, and a boundary line of the two insulation materials of different colors divides the insulation layer into two different colored portions to form the second identification marks.

2. The LED display unit group of claim 1 , wherein a thickness of the front circuit board ranges 0.1 mm to 0.3 mm.

3. The LED display unit group of claim 1 , wherein in each of the pixel areas, the B-electrode pads corresponding to the three LED light-emitting chips are different portions of a first metal pad, and the electrode B of each of the three LED light-emitting chips is electrically connected to a corresponding one portion among the different portions of the first metal pad.

4. The LED display unit group of claim 1 , wherein in a same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are different portions of a second metal pad, and the electrode B of each of all the LED light-emitting chips is electrically connected to a corresponding one portion among the different portions of the second metal pad.

5. The LED display unit group of claim 3 , wherein n=1, and m=1;
in a same column of pixel areas, all B-electrode pads are arranged in a “1” shape along a column direction, two columns of B-electrode pads are disposed in edge areas on two opposite sides of the front circuit board, and A-electrode pads are disposed between the two columns of B-electrode pads.

6. The LED display unit group of claim 5 , wherein in a same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of a same light emission color are different portions of a third metal pad, and the third metal pad is disposed along a row direction.

7. The LED display unit group of claim 4 , wherein the second metal pad is directly electrically connected to the common B-electrode pin corresponding to the column of pixel areas through at least one of the metal vias.

8. The LED display unit group of claim 6 , wherein the third metal pad is directly electrically connected to a corresponding A-electrode pin through at least one of the metal vias, or the third metal pad extends to the back circuit board through at least one of the metal vias and is electrically connected to a corresponding A-electrode pin through a metal wire on the back circuit board.

9. The LED display unit group of claim 1 , wherein the front surface of the insulation substrate is provided with a first identification mark for position identification.

10. The LED display unit group of claim 1 , wherein an ink layer is provided between adjacent rows of pixel areas; or an ink layer is provided between adjacent columns of pixel areas; or an ink layer is provided between adjacent rows of pixel areas and an ink layer is provided between adjacent columns of pixel areas.

11. The LED display unit group of claim 1 , wherein the three LED light-emitting chips of different light emission colors comprise a red LED light-emitting chip, a green LED light-emitting chip, and a blue LED light-emitting chip.

Assignees

• Foshan Nationstar Optoelectronics Co Ltd

Inventors

• Gu Feng
• Liu Chuanbiao
• Qin Kuai
• Fan Kailiang

Classifications

• H10W46/301

  for alignment · CPC title

• H10W46/00 Primary

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• G09F9/3026

  Video wall, i.e. stackable semiconductor matrix display modules (video wall control systems G06F3/1446, G09G2300/026) · CPC title