Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9178115B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178115-B2 |
| Application number | US-201313762719-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 8, 2013 |
| Priority date | Feb 10, 2012 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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A semiconductor light emitting apparatus includes a substrate. A plurality of first electrode wirings are formed on the surface of the substrate. At least one second electrode wiring is formed on the surface of the substrate. A light emitting section is connected between a corresponding one of the plurality of first electrode wirings and the at least one second electrode wiring. The light emitting section includes a plurality of light emitting elements.
Opening claim text (preview).
What is claimed is: 1. A semiconductor light emitting apparatus, comprising: a substrate; a plurality of first electrode wirings formed on a surface of the substrate; at least one second electrode wiring formed on the surface of the substrate; and a light emitting section connected between a corresponding one of the plurality of first electrode wirings and the at least one second electrode wiring, the light emitting section including a plurality of light emitting elements co…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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