Methods of making a self-assembled slow-wave structures

US12091746B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12091746-B2
Application numberUS-202117507034-A
CountryUS
Kind codeB2
Filing dateOct 21, 2021
Priority dateOct 1, 2019
Publication dateSep 17, 2024
Grant dateSep 17, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Traveling-wave tube amplifiers for high-frequency signals, including terahertz signals, and methods for making a slow-wave structure for the traveling-wave tube amplifiers are provided. The slow-wave structures include helical conductors that are self-assembled via the release and relaxation of strained films from a sacrificial growth substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of making a slow-wave structure, the method comprising: forming a dielectric support membrane on a device substrate; forming a sacrificial film on a portion of a surface of the dielectric support membrane; forming a scaffold film comprising a strained dielectric material on a portion of a surface of the sacrificial film; forming a plurality of parallel, electrically conductive strips on the scaffold film, each of the electrically conductive strips having a leading end and a trailing end, wherein an edge of the scaffold film or the trailing ends of the electrically conductive strips are attached to the dielectric support membrane; selectively removing the sacrificial film underlying the scaffold film, wherein the scaffold film relaxes and rolls into a cylinder, bringing the electrically conducting strips into an end-to-end arrangement that forms a helix on an interior surface of the cylinder; electroplating a surface of the helix with an electrically conductive material; forming a first electrically conductive contact in electrical communication with a first end of the helix; and forming a second electrically conductive contact in electrical communication with a second end of the helix. 2. The method of claim 1 , further comprising selectively removing a portion of the device substrate below the cylinder, such that the portion of the dielectric support membrane to which the cylinder is tethered is suspended over the device substrate. 3. The method of claim 1 , wherein the scaffold film comprises silicon nitride, silicon oxide, aluminum oxide, or diamond. 4. The method of claim 3 , wherein the dielectric support membrane comprises diamond or silicon nitride. 5. The method of claim 4 , wherein the electrically conductive strips are made from a material that can be electroplated. 6. The method of claim 5 , wherein the electrically conductive strips comprise gold, copper, or silver. 7. The method of claim 1 , wherein the scaffold film comprises silicon nitride, the dielectric support membrane comprises diamond, and the electrically conductive strips comprise gold. 8. The method of claim 7 , wherein the helix has an inner diameter in a range from 1 μm to 50 μm. 9. The method of claim 1 , wherein the helix has an inner diameter in a range from 1 μm to 50 μm.

Assignees

Inventors

Classifications

  • Coating on selected surface areas, e.g. using masks · CPC title

  • Manufacturing processes or apparatus therefore · CPC title

  • H01J9/14Primary

    of non-emitting electrodes · CPC title

  • the forward travelling wave being utilised · CPC title

  • Coating · CPC title

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What does patent US12091746B2 cover?
Traveling-wave tube amplifiers for high-frequency signals, including terahertz signals, and methods for making a slow-wave structure for the traveling-wave tube amplifiers are provided. The slow-wave structures include helical conductors that are self-assembled via the release and relaxation of strained films from a sacrificial growth substrate.
Who is the assignee on this patent?
Wisconsin Alumni Res Found, The Regents Of The Univ Of New Mexico
What technology area does this patent fall under?
Primary CPC classification H01J9/14. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 17 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).