Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article

Patent metadata

Field	Value
Publication number	US-12084745-B2
Application number	US-202117192125-A
Country	US
Kind code	B2
Filing date	Mar 4, 2021
Priority date	Oct 25, 2016
Publication date	Sep 10, 2024
Grant date	Sep 10, 2024

Abstract

A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.

First claim

What is claimed is:

1. A method of using a copper alloy powder, the method comprising:
preparing the copper alloy powder;
using the copper alloy powder as a raw material for a laser, electron beam or plasma additively manufactured article; and
heat-treating the laser, electron beam or plasma additively manufactured article such that the laser, electron beam or plasma additively manufactured article has an electrical conductivity of not less than 70% IACS,
wherein
the copper alloy powder is solidified into a predetermine shape by irradiating the copper alloy powder with at least one of the laser, the electron beam or the plasma,
the copper alloy powder consists of
more than 1.00 mass % and not more than 2.80 mass % of chromium;
optionally oxygen in an impurity content; and
a balance of copper.

2. The method of using a copper alloy powder according to claim 1 , wherein
the copper alloy powder contains more than 1.05 mass % and not more than 2.80 mass % of chromium.

3. The method of using a copper alloy powder according to claim 1 , wherein
the copper alloy powder contains more than 1.00 mass % and not more than 2.00 mass % of chromium.

4. The method of using a copper alloy powder according to claim 3 , wherein
the copper alloy powder contains more than 1.05 mass % and not more than 2.00 mass % of chromium.

5. The method of using a copper alloy powder according to claim 1 , wherein
the copper alloy powder contains not less than 1.46 mass % and not more than 2.80 mass % of chromium.

6. The method of using a copper alloy powder according to claim 1 , wherein
the copper alloy powder contains more than 1.00 mass % and not more than 1.22 mass % of chromium.

Assignees

• Daihen Corp
• Osaka Res Inst Ind Science & Tech

Inventors

• Tsubota Ryusuke
• Oka Yohei
• Okamoto Akira
• Nakamoto Takayuki
• SUGAHARA Takahiro
• Shinomiya Naruaki
• Takemura Mamoru
• Uchida Sohei

Classifications

• B22F10/28 Primary

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• C22C9/00

  Alloys based on copper · CPC title

• B22F2003/248

  Thermal after-treatment · CPC title

• B22F3/24

  After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title