Metal powder, method of producing additively-manufactured article, and additively-manufactured article

US10843260B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10843260-B2
Application numberUS-201615151693-A
CountryUS
Kind codeB2
Filing dateMay 11, 2016
Priority dateMay 13, 2015
Publication dateNov 24, 2020
Grant dateNov 24, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of producing an additively-manufactured article, the method comprising: a first step of forming a powder layer consisting of a copper alloy powder, the copper alloy powder consisting of not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, a total content of the chromium and the silicon being not more than 1.00 mass %, and a balance of copper, an element besides the copper, the chromium, and the silicon being less than 0.10 mass %; and a second step of forming a shaped layer by melting and/or sintering the copper alloy powder so that metal particles included in the copper alloy powder fuse directly to each other at a predetermined position in the powder layer, the first step and the second step being successively repeated to stack the shaped layers and produce an additively-manufactured article. 2. The method of producing an additively-manufactured article according to claim 1 , further comprising a heat treatment step of heat-treating the additively-manufactured article. 3. The method of producing an additively-manufactured article according to claim 1 , wherein the copper alloy powder comprises more than 0.51 mass % and not more than 0.94 mass % of chromium; and a balance of copper. 4. The method of producing an additively-manufactured article according to claim 1 , wherein in the second step, the copper alloy powder is melted and/or sintered by irradiating the copper alloy powder with at least one selected from the group consisting of a laser, an electron beam and plasma. 5. A method of producing an additively-manufactured article, the method comprising: a first step of forming a powder layer consisting of a copper alloy powder, the copper alloy powder consisting of not less than 0.22 mass % and not more than 0.94 mass % of chromium, not less than 98.0 mass % of copper, and an impurity element, the impurity element being an element besides the copper and the chromium, the impurity element being less than 0.10 mass %, and a second step of forming a shaped layer by melting and/or sintering the copper alloy powder so that metal particles included in the copper alloy powder fuse directly to each other at a predetermined position in the powder layer, the first step and the second step being successively repeated to stack the shaped layers and produce an additively-manufactured article. 6. The method of producing an additively-manufactured article according to claim 5 , wherein the copper alloy powder comprises not less than 98.5 mass % of copper. 7. The method of producing an additively-manufactured article according to claim 5 , wherein the copper alloy powder comprises not less than 99.0 mass % of copper. 8. The method of producing an additively-manufactured article according to claim 5 , wherein the copper alloy powder comprises more than 0.51 mass % and not more than 0.94 mass % of chromium. 9. The method of producing an additively-manufactured article according to claim 5 , wherein in the second step, the copper alloy powder is melted and/or sintered by irradiating the copper alloy powder with at least one selected from the group consisting of a laser, an electron beam and plasma.

Assignees

Inventors

Classifications

  • B22F1/00Primary

    Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title

  • Metallic powder characterised by the size or surface area of the particles · CPC title

  • Data acquisition or data processing · CPC title

  • by thermal means (control of energy beam parameters for post heating B22F10/364) · CPC title

  • of the atmosphere, e.g. composition or pressure in a building chamber · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10843260B2 cover?
A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufact…
Who is the assignee on this patent?
Daihen Corp, Tech Research Institute Of Osaka Prefecture, Osaka Res Inst Ind Science & Tech
What technology area does this patent fall under?
Primary CPC classification B22F1/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).