Heat transfer interfaces for circuit card assembly (CCA) modules

Patent metadata

Field	Value
Publication number	US-12075587-B2
Application number	US-202217673992-A
Country	US
Kind code	B2
Filing date	Feb 17, 2022
Priority date	Feb 17, 2022
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.

First claim

What is claimed is:

1. An electronic module assembly comprising:
a circuit card assembly (CCA) including heat generating electronic components;
a connector electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA; and
a heatsink mounted to the CCA and connected in thermal communication with the electronic components, wherein a wedge feature is defined along a lateral edge of the heatsink relative to the connector, wherein the wedge feature wedges down in a direction from a top edge of the CCA toward the connector, wherein the wedge feature is defined between two wedge surfaces, wherein each wedge surface is oblique relative to an insertion axis defined by the connector.

2. The assembly as recited in claim 1 , wherein the wedge feature is a first wedge feature, wherein the heatsink includes a second wedge feature defined along a lateral edge of the heatsink opposite the first wedge feature.

3. The assembly as recited in claim 1 , wherein the wedge extends along the full length of the lateral edge of the heatsink.

4. The assembly as recited in claim 1 wherein the wedge feature is defined between two wedge surfaces, wherein each wedge surface is oblique relative to a plane defined by the CCA.

5. The assembly as recited in claim 1 , further comprising a chassis, wherein a rail feature is defined on an inward facing surface of the chassis, and wherein the connector is connected to a corresponding electrical interface in the chassis with the wedge feature engaged with the rail feature to house the CCA and heatsink within the chassis.

6. The assembly as recited in claim 5 , wherein opposed wedge surfaces of the wedge feature are engaged in thermal contact in their entirety with corresponding surfaces of the rail feature for sinking heat from the heat generating electronic components to the chassis.

7. The assembly as recited in claim 6 , wherein the wedge feature and rail feature are configured to guide the connector to connect with the electrical interface of the chassis as the CCA is inserted into the chassis.

8. The assembly as recited in claim 7 , wherein the connector, electrical interface, wedge feature, and rail feature are configured to retain the CCA in place within the chassis.

9. The assembly as recited in claim 5 , wherein the CCA occupies a first bay of the chassis, wherein the chassis includes a second bay with wedge locks configured for retaining a wedge locking CCA in the chassis.

10. The assembly as recited in claim 5 , wherein the CCA occupies a first bay of the chassis, wherein the chassis includes a second bay with a second rail feature configured for retaining a second CCA with a corresponding wedge feature.

11. The assembly as recited in claim 5 , wherein the CCA occupies a bay of the chassis that is configured to receive CCA modules complying with one of 3U, 6U, 9U, and VITA-compliant module envelopes.

12. The assembly as recited in claim 5 , wherein the wedge feature is a first wedge feature and the rail feature is a first rail feature, wherein the heatsink includes a second wedge feature defined along a lateral edge of the heatsink opposite the first wedge feature, wherein the chassis includes a second rail feature defined on an inward facing surface of the chassis opposite the first rail feature, and wherein the second wedge feature is engaged with the second rail feature.

13. The assembly as recited in claim 1 , wherein the connector is a first connector and further comprising at least one additional connector aligned with the first connector for connecting independent functions of the CCA to an electrical interface of a chassis.

Assignees

• Hamilton Sundstrand Corp

Inventors

• Trotman Alexander
• Kamp Josh
• Schwartz Judy
• Defelice Robert
• Doe Jr Michael
• Delugan Anthony Matthew

Classifications

• H05K7/20545 Primary

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/1418

  Card guides, e.g. grooves (H05K7/1425 takes precedence) · CPC title

• H05K7/20436

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title

• H05K7/1404 Primary

  by edge clamping, e.g. wedges · CPC title