Efficient heat transfer from conduction-cooled circuit cards

Patent metadata

Field	Value
Publication number	US-9357670-B2
Application number	US-201414182803-A
Country	US
Kind code	B2
Filing date	Feb 18, 2014
Priority date	Feb 18, 2014
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A conduction-cooled card assembly is disclosed that includes a conduction-cooling frame, a printed wiring board mounted on the frame, and a wedgelock fastener. The conduction-cooling frame has a thermal management interface adapted to transfer heat from the frame to a chassis, and the wedgelock fastener is adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis. The assembly also has one or more of the following characteristics: (a) the thermal management interface of the conduction-cooling frame is made primarily of a first material and a portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of a second material that is softer than the first material, and (b) the wedgelock fastener is made primarily of a first material and a portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of a second material that is softer than the first material. A chassis for conduction-cooled card assemblies is also disclosed which comprises a housing and at least first and second rails within the housing that are adapted to receive a conduction-cooled card assembly therebetween. At least one of the first and second rails is made primarily of a first material and has a surface portion made of a second material that is softer than the first material.

First claim

What is claimed is:

1. A conduction-cooled card assembly, comprising:
a conduction-cooling frame having a thermal management interface adapted to transfer heat from the frame to a chassis;
a printed wiring board mounted on the conduction-cooling frame; and
a wedgelock fastener adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis;
wherein:
the thermal management interface of the conduction-cooling frame is made primarily of a first material, a portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of a second material that is softer than the first material, and the second material is atomically bonded to the first material; or
the wedgelock fastener is made primarily of a first material, a portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of a second material that is softer than the first material, and the second material is atomically bonded to the first material.

2. The conduction-cooled card assembly of claim 1 , wherein the thermal management interface of the conduction-cooling frame is made primarily of the first material, the portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of the second material that is softer than the first material, and the second material is atomically bonded to the first material.

3. The conduction-cooled card assembly of claim 2 , wherein the second material of the thermal management interface is selected from the group consisting of gold, copper, and indium.

4. The conduction-cooled card assembly of claim 3 , wherein the second material of the thermal management interface is explosion bonded to the first material of the thermal management interface.

5. The conduction-cooled card assembly of claim 2 , wherein the second material of the thermal management interface is explosion bonded to the first material of the thermal management interface.

6. The conduction-cooled card assembly of claim 1 , wherein the wedgelock fastener is made primarily of the first material, the portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of the second material that is softer than the first material, and the second material is atomically bonded to the first material.

7. The conduction-cooled card assembly of claim 6 , wherein the second material of the wedgelock fastener is selected from the group consisting of gold, copper, and indium.

8. The conduction-cooled card assembly of claim 7 , wherein the second material of the wedgelock fastener is explosion bonded to the first material of the wedgelock fastener.

9. The conduction-cooled card assembly of claim 6 , wherein the second material of the wedgelock fastener is explosion bonded to the first material of the wedgelock fastener.

10. A method for forming a conduction-cooled card assembly having a conduction-cooling frame having a thermal management interface, comprising:
atomically bonding a second material to a portion of the thermal management interface of the conduction-cooling frame that is made primarily of a first material and is adapted to engage a rail of a chassis in which the assembly is to be installed or a wedgelock fastener, wherein the second material is softer than the first material; or
atomically bonding a second material to a portion of a wedgelock fastener that is made primarily of the first material and is adapted to engage the thermal management interface or a rail of the chassis in which the assembly is to be installed, wherein the second material is softer than the first material.

11. The method of claim 10 , comprising the act of atomically bonding the second material to the portion of the thermal management interface of the conduction-cooling frame that is made primarily of the first material and is adapted to engage the rail of the chassis in which the assembly is to be installed or the wedgelock fastener, wherein the second material is softer than the first material.

12. The method of claim 11 , wherein the second material that is atomically bonded to the portion of the thermal management interface is selected from the group consisting of gold, copper, and indium.

13. The method of claim 12 , wherein the act of atomically bonding is performed using an explosion bonding technique.

14. The method of claim 11 , wherein the act of atomically bonding is performed using an explosion bonding technique.

15. The method of claim 10 , comprising the act of atomically bonding the second material to the portion of the wedgelock fastener that is made primarily of the first material and is adapted to engage the thermal management interface or the rail of the chassis in which the assembly is to be installed, wherein the second material is softer than the first material.

16. The method of claim 15 , wherein the second material that is atomically bonded to the portion of the wedgelock fastener is selected from the group consisting of gold, copper, and indium.

17. The method of claim 15 , wherein the act of atomically bonding is performed using an explosion bonding technique.

18. A chassis for conduction-cooled card assemblies, comprising:
a housing; and
at least first and second rails within the housing that are adapted to receive a conduction-cooled card assembly therebetween, wherein at least one of the first and second rails is made primarily of a first material and has a surface portion made of a second material that is softer than the first material, and wherein the second material is atomically bonded to the first material.

19. The chassis of claim 18 , wherein the second material is selected from the group consisting of gold, copper, and indium.

20. The chassis of claim 18 , wherein the second material is explosion bonded to the first material.

Assignees

• Lockheed Corp

Inventors

• Stutzman Randall J
• Dando Iii Charles H
• Long Clint

Classifications

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• B23K20/002

  specially adapted for particular articles or work (B23K20/129 takes precedence) · CPC title

• B23K20/08

  Explosive welding · CPC title

• H05K7/20 Primary

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H05K7/20545

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title