Resist underlayer film-forming composition including cyclic carbonyl compound

Patent metadata

Field	Value
Publication number	US-12072630-B2
Application number	US-201917055433-A
Country	US
Kind code	B2
Filing date	May 21, 2019
Priority date	May 25, 2018
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

A resist underlayer film-forming composition formed into a flat film which can exhibit high etching resistance, a good dry etching velocity ratio and a good optical constant, has a good covering property even against a so-called step-structure substrate, and has a small film thickness difference after being embedded. Also, a method for producing a polymer suitable for the resist underlayer film-forming composition; a resist underlayer film using the resist underlayer film-forming composition; and a method for manufacturing a semiconductor device. A resist underlayer film-forming composition containing a reaction product of an aromatic compound having 6 to 60 carbon atoms with a carbonyl group in a cyclic carbonyl compound having 3 to 60 carbon atoms and a solvent, wherein the reaction product has such a structure that one of the carbon atoms in the cyclic carbonyl compound links two molecules of the aromatic compound to each other.

First claim

The invention claimed is:

1. A resist underlayer film-forming composition comprising a solvent and a reaction product between a C6-C60 aromatic compound and a carbonyl group of a C3-C60 cyclic carbonyl compound,
the cyclic carbonyl compound containing not less than 5% by mass of heteroatom,
the reaction product being such that one carbon atom in the cyclic carbonyl compound connects two molecules of the aromatic compound,
wherein the cyclic carbonyl compound is represented by the following formula (1):

where:
X is O, NH or CH 2 , and
the ring Y is a 3- to 8-membered ring optionally interrupted with a heteroatom and optionally substituted with a C1-C20 alkyl group optionally substituted with a hydroxyl group, a carbonyl group and optionally interrupted with an oxygen atom or a sulfur atom, a hydroxyl group, an oxo group, a carboxyl group, a cyano group, a nitro group, a sulfo group, a C1-C6 acyl group, a C1-C6 alkoxy group, a C1-C6 alkoxycarbonyl group, an amino group, a glycidyl group, a C6-C20 aryl group, a C2-C10 alkenyl group, or a C2-C10 alkynyl group, or is a coupled ring or condensed ring of such 3- to 8-membered rings.

2. A resist underlayer film-forming composition comprising a solvent and a reaction product between a C6-C60 aromatic compound and a carbonyl group of a C3-C60 cyclic carbonyl compound,
the cyclic carbonyl compound being represented by the following formula (1):

where:
X is CH 2 , and
the ring Y is a 3- to 8-membered ring optionally substituted with a C1-C20 alkyl group optionally substituted with a hydroxyl group, a carbonyl group and optionally interrupted with an oxygen atom or a sulfur atom, a hydroxyl group, an oxo group, a carboxyl group, a cyano group, a nitro group, a sulfo group, a C1-C6 acyl group, a C1-C6 alkoxy group, a C1-C6 alkoxycarbonyl group, an amino group, a glycidyl group, a C6-C20 aryl group, a C2-C10 alkenyl group, or a C2-C10 alkynyl group, or is a coupled ring of such 3- to 8-membered rings.

3. The resist underlayer film-forming composition according to claim 2 , wherein the reaction product is such that one carbon atom in the cyclic carbonyl compound connects two molecules of the aromatic compound.

4. The resist underlayer film-forming composition according to claim 1 , wherein the cyclic carbonyl compound is an alicyclic compound.

5. The resist underlayer film-forming composition according to claim 3 , wherein the cyclic carbonyl compound contains no benzene ring.

6. The resist underlayer film-forming composition according to claim 3 , wherein the aromatic compound contains at least one benzene, naphthalene, anthracene or pyrene ring, or a combination thereof.

7. The resist underlayer film-forming composition according to claim 3 , wherein the aromatic compound contains at least two benzene, naphthalene, anthracene or pyrene rings, or a combination thereof.

8. The resist underlayer film-forming composition according to claim 3 , further comprising a crosslinking agent.

9. The resist underlayer film-forming composition according to claim 3 , further comprising an acid and/or an acid generator.

10. The resist underlayer film-forming composition according to claim 3 , wherein the solvent has a boiling point of not lower than 160° C.

11. A resist underlayer film, which is a baked product of a coating film from the resist underlayer film-forming composition according to claim 1 .

12. A method for manufacturing a semiconductor device, comprising the steps of:
forming a resist underlayer film on a semiconductor substrate using the resist underlayer film-forming composition according to claim 3 ,
forming a resist film thereon,
forming a resist pattern by light or electron beam irradiation and development,
etching the underlayer film through the resist pattern, and
processing the semiconductor substrate through the patterned underlayer film.

13. A method for producing a polymer for use in a resist underlayer film-forming composition, comprising the step of reacting a C6-C60 aromatic compound with a carbonyl group of a C3-C60 cyclic carbonyl compound,
which provides a reaction product in which one carbon atom in the cyclic carbonyl compound connects two molecules of the aromatic compound.

Assignees

• Nissan Chemical Corp

Inventors

• Tokunaga Hikaru
• Ogata Hiroto
• Hashimoto Keisuke
• Nakajima Makoto

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P76/2043

  using an anti-reflective coating · CPC title

• C09D161/18

  Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or their halogen derivatives only · CPC title

• C09D161/12

  with polyhydric phenols · CPC title