Electrically functional polymer microneedle array

Patent metadata

Field	Value
Publication number	US-12070307-B2
Application number	US-202017132165-A
Country	US
Kind code	B2
Filing date	Dec 23, 2020
Priority date	May 16, 2018
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.

First claim

What is claimed is:

1. A method of fabrication of a sensor device, the method comprising:
patterning and structuring a polymer substrate to form:
a set of microneedles that extend, each, from a base surface of the substrate; and
a set of vias extending, each, through a thickness of the substrate, thereby forming a corresponding set of apertures on said base surface, wherein each of the apertures is adjacent to a respective one of the microneedles; and
two electrodes, including a sensing electrode and a reference electrode, each comprising an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface.

2. The method of claim 1 , wherein the electrically conductive material layer is patterned as a layer stack.

3. The method of claim 1 , wherein the vias are formed by a photolithographic patterning process.

4. The method of claim 1 , further including coating opposite sides of the polymer substrate.

5. The method of claim 1 , further including selectively exposing the polymer substrate to a radiation source to allow the microneedle sharpness to increase.

6. A method of fabrication of a sensor device, the method comprising:
patterning electrically conductive material layers onto a sacrificial layer to form an inverse pattern;
complementarily patterning a polymer substrate onto the electrically conductive material layers to form a set of microneedles according to the inverse pattern, whereby each of the microneedles extends from a base surface of the substrate, wherein the polymer substrate is structured so as to exhibit a set of vias that extend, each, through a thickness of the polymer substrate, thereby forming a corresponding set of apertures on said base surface, and wherein each of the apertures is adjacent to a respective one of the microneedles formed; and
removing the sacrificial layer, to release the polymer substrate with the electrically conductive material layers formed thereon, to obtain a sensor device having electrodes formed by said material layers on at least some of the microneedles and neighboring portions of the base surface of the substrate.

7. The method of fabrication according to claim 6 , wherein the method further comprises, prior to patterning the electrically conductive material layers:
obtaining an oxidized silicon substrate with an oxide layer on top of the substrate;
patterning the oxide layer to form openings through residual portions of the oxide layer;
etching the silicon substrate through the openings formed to obtain said inverse pattern, whereby cavities are created, which are shaped complementarily to the microneedles to be subsequently obtained;
removing said residual portions of the oxide layer to obtain the structured mold; and
depositing the sacrificial layer on a structured mold.

8. The method of fabrication according to claim 6 , wherein
complementarily patterning the polymer substrate further comprises selectively exposing the polymer substrate to a radiation source.

9. The method of fabrication according to claim 6 , wherein
the steps of patterning the material layers, complementarily patterning the polymer substrate and removing the sacrificial layer are implemented on a wafer scale.

10. The method of fabrication according to claim 9 , wherein the method further comprises, after removing the sacrificial layer:
splitting the polymer substrate to obtain several sensor devices, each comprising a structured polymer substrate with respective electrodes and sets of microneedles, vias and apertures.

11. The method of fabrication according to claim 10 , wherein the splitting the polymer substrate includes dicing the polymer substrate.

12. The method of fabrication according to claim 10 , wherein edges of each of the several sensor devices are pre-defined during the patterning of the polymer substrate.

13. The method of fabrication according to claim 10 , further including patterning pre-cut lines for splitting the polymer substrate.

14. A method of analysis of a fluid, the method comprising:
providing a sensor device comprising:
a polymer substrate structured so as to form:
a set of microneedles that extend, each, from a base surface of the substrate; and
a set of vias extending, each, through a thickness of the substrate, thereby forming a corresponding set of apertures on said base surface, wherein each of the apertures is adjacent to a respective one of the microneedles; and

two electrodes, including a sensing electrode and a reference electrode, each comprising an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface,

applying the polymer substrate on a body for the microneedles to penetrate into the body and to allow a fluid from the body to contact an exposed surface of the electrodes, and
reading signals obtained from the electrodes.

Assignees

• IBM

Inventors

• Ebejer Neil
• Drechsler Ute
• Ruch Patrick

Classifications

• B81C2201/013

  Etching · CPC title

• B81C2201/056

  Releasing structures at the end of the manufacturing process · CPC title

• B81C2201/0108

  Sacrificial polymer, ashing of organics · CPC title

• B81C2201/0101

  Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning · CPC title

• B81C2201/0147

  Film patterning · CPC title