Method for making electrically conductive three-dimensional structures

Patent metadata

Field	Value
Publication number	US-9330820-B2
Application number	US-201313873961-A
Country	US
Kind code	B2
Filing date	Apr 30, 2013
Priority date	May 26, 2006
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

First claim

The invention claimed is:

1. A method for fabricating a three-dimensional, electrically conductive structure comprising:
providing a mold having at least one microdepression which defines a three-dimensional structure;
depositing and patterning at least one electrically conductive layer within the microdepression of the mold;
filling the microdepression of the mold with at least one substantially electrically non-conductive substrate material;
molding the at least one substrate material to form a substrate on top of the at least one electrically conductive layer while the at least one non-conductive substrate material abuts an outer surface of the at least one electrically conductive layer opposite the mold; and
transferring the at least one electrically conductive layer to the substrate, thereby forming an electrically conductive structure.

2. The method of claim 1 , further comprising removing the electrically conductive structure from the mold.

3. The method of claim 1 , further comprising electroplating onto the electrically conductive layer.

4. The method of claim 1 , wherein the mold comprises a photoresist or polydimethlysiloxane.

5. The method of claim 1 , wherein the substrate material comprises a polymer.

6. The method of claim 1 , wherein the electrically conductive layer comprises nickel, iron, gold, titanium, copper, platinum, palladium, a stainless steel, or an alloy thereof.

7. The method of claim 1 , wherein the patterning comprises selectively removing at least a portion of the electrically conductive layer from an upper surface of at least one protrusion of the mold.

8. The method of claim 1 , wherein the patterning comprises depositing the electrically conductive layer onto protruding and/or recessed surfaces of the mold through a shadow mask or a stencil mask.

9. The method of claim 1 , wherein the at least one microdepression defines a high-aspect ratio three-dimensional structure.

10. The method of claim 1 , wherein the mold further comprises at least one upper protrusion that defines a channel within the three-dimensional structure.

11. A method for fabricating a three-dimensional, electrically conductive structure comprising:
providing a mold having at least one microdepression which defines a three-dimensional structure and at least one upper protrusion which defines a channel within the three-dimensional structure;
depositing and patterning at least one electrically conductive layer within the microdepression of the mold, the patterning comprising selectively removing at least a portion of the electrically conductive layer from an upper surface of the upper protrusion of the mold;
filling the microdepression of the mold with at least one substrate material; and
molding the substrate material to form a substrate structure.

12. The method of claim 11 , further comprising electroplating onto the electrically conductive layer.

13. The method of claim 11 , wherein the mold comprises a photoresist or polydimethlysiloxane.

14. The method of claim 11 , wherein the substrate comprises a polymer.

15. The method of claim 11 , wherein the electrically conductive layer comprises nickel, iron, gold, titanium, copper, platinum, palladium, a stainless steel, or an alloy thereof.

16. The method of claim 11 , wherein the at least one microdepression defines a high-aspect ratio three-dimensional structure.

17. The method of claim 11 , wherein the depositing of at least one electrically conductive layer is achieved using a shadow mask.

18. A method for fabricating a three-dimensional, electrically conductive structure comprising:
providing a mold having at least one microdepression which defines a three-dimensional structure;
filling the microdepression of the mold with at least one substrate material;
molding the substrate material to form a substrate structure;
depositing a conductive seed layer onto the substrate structure;
patterning the conductive seed layer using a selective ablation technique, wherein the patterning comprises selectively removing at least a portion of the conductive seed layer from a lower surface of at least one protrusion of substrate structure; and
electroplating an electrically conductive layer onto the patterned seed layer to form an electrically conductive structure.

19. The method of claim 18 , wherein the mold comprises a photoresist or polydimethlysiloxane.

20. The method of claim 18 , wherein the molding comprises a solvent casting or melt casting technique.

21. The method of claim 18 , wherein the substrate material comprises a polymer.

22. The method of claim 18 , wherein the conductive seed layer comprises an alloy of titanium and copper.

23. The method of claim 18 , wherein the electroplated electrically conductive layer comprises a metal selected from the group consisting of nickel, iron, gold, titanium, copper, platinum, palladium, stainless steels, and alloys thereof.

24. The method of claim 18 , wherein the at least one microdepression defines a high-aspect ratio three-dimensional structure.

25. The method of claim 18 , wherein the mold further comprises at least one upper protrusion that defines a channel within the three-dimensional structure.

26. The method of claim 1 , wherein the electrically conductive structure has an aspect ratio of greater than about 4:1.

27. The method of claim 11 , wherein the electrically conductive structure has an aspect ratio of greater than about 4:1.

28. The method of claim 18 , wherein the electrically conductive structure has an aspect ratio of greater than about 4:1.

29. The method of claim 11 , wherein molding the substrate material to form the substrate structure comprises positioning the at least one substrate material to abut an outer surface of the at least one electrically conductive layer opposite the mold.

30. The method of claim 11 , wherein the substrate material is substantially electrically non-conductive.

31. The method of claim 18 , wherein the substrate material is substantially electrically non-conductive.

Assignees

• Allen Mark G
• Choi Seong-O
• Pauk Jung-Hwan
• Wu Xiaosong
• Zhao Yanzhu
• Yoon Yong-Kyu
• Rajaraman Swaminathan
• Georgia Tech Res Inst

Inventors

• Allen Mark G
• Choi Seong-O
• Pauk Jung-Hwan
• Wu Xiaosong
• Zhao Yanzhu
• Yoon Yong-Kyu
• Rajaraman Swaminathan

Classifications

• A61M37/0015

  by using microneedles · CPC title

• C25D1/10

  Moulds; Masks; Masterforms · CPC title

• C25D5/022

  using masking means · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• A61B5/685 Primary

  Microneedles · CPC title