Conditioning chamber component

Patent metadata

Field	Value
Publication number	US-12064795-B2
Application number	US-202117211518-A
Country	US
Kind code	B2
Filing date	Mar 24, 2021
Priority date	May 3, 2017
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.

First claim

What is claimed is:

1. A method for conditioning a component of a wafer processing chamber, comprising:
placing the component in an ultrasonic conditioning solution in an ultrasonic solution tank;
applying ultrasonic energy through the ultrasonic conditioning solution from a megasonic transducer head to the component to clean the component;
submerging the component in a megasonic conditioning solution in a tank, wherein the submerging the component in the megasonic conditioning solution comprises mounting the component on a mount in the tank;
applying megasonic energy through the megasonic conditioning solution to the component to clean the component; and
flowing the megasonic conditioning solution during the applying megasonic energy; comprising:
flowing the megasonic conditioning solution into the tank at a location below where the component is mounted in the tank, through at least one inlet; and
draining the megasonic conditioning solution from the tank at a location above where the component is mounted in the tank,
wherein at least part of the inlet is under where the component is mounted in the tank;
on a mount in the tank,
wherein the megasonic transducer head is above the component and faces the inlet, wherein the component is between the inlet and the transducer head.

2. The method, as recited in claim 1 , further comprising providing a blasting of the component to clean the component, before placing the component in the ultrasonic conditioning solution.

3. The method, as recited in claim 2 , wherein the blasting comprises blasting the component with solid CO 2 .

4. The method, as recited in claim 2 , further comprising polishing the component before providing the blasting.

5. The method, as recited in claim 4 , further comprising scrubbing the component before providing the blasting.

6. The method, as recited in claim 1 , wherein the applying the megasonic energy uses a scanning megasonic head.

7. The method, as recited in claim 6 , wherein the scanning megasonic head comprises:
at least one megasonic transducer; and
a quartz housing enclosing the at least one megasonic transducer, wherein the at least one megasonic transducer applies megasonic energy to the megasonic conditioning solution through the quartz housing.

8. The method, as recited in claim 1 , further comprising flowing the megasonic conditioning solution during the applying megasonic energy.

9. The method, as recited in claim 8 , wherein the flowing the megasonic conditioning solution, comprises
recirculating the megasonic conditioning solution in the tank, comprising:
flowing the megasonic conditioning solution into the tank;
draining the megasonic conditioning solution from the tank; and
flowing the megasonic conditioning solution back into the tank; and

passing the megasonic conditioning solution through at least one filter after draining the megasonic conditioning solution and before flowing the megasonic conditioning solution back into the tank.

10. The method, as recited in claim 8 , wherein the flowing the megasonic conditioning solution provides a single pass of the megasonic conditioning solution.

11. The method, as recited in claim 1 , wherein the component is a ceramic containing component.

Assignees

• Lam Res Corp

Inventors

• Yasseri Amir A
• Shih Hong
• Daugherty John
• Outka Duane
• Xu Lin
• Avoyan Armen
• La Croix Cliff
• Hundi Girish

Classifications

• H10P72/04

  Apparatus for manufacture or treatment · CPC title

• B08B3/12 Primary

  by sonic or ultrasonic vibrations · CPC title

• B08B3/14

  Removing waste, e.g. labels, from cleaning liquid · CPC title

• B08B3/048 Primary

  Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed · CPC title

• B08B5/02

  Cleaning by the force of jets, e.g. blowing-out cavities {(airguns or nozzles per se B05B1/005)} · CPC title