Substrate processing system for processing substrates with an electronics module located behind a door in a front wall of the substrate processing system

Patent metadata

Field	Value
Publication number	US-12051602-B2
Application number	US-202117244235-A
Country	US
Kind code	B2
Filing date	Apr 29, 2021
Priority date	May 4, 2020
Publication date	Jul 30, 2024
Grant date	Jul 30, 2024

Abstract

The disclosure relates to a semiconductor processing system for processing semiconductor substrates and provided with a housing formed by a wall. The system may further comprise a processing module and a cassette module, the cassette module located adjacent the processing module. An electronics module may be provided with a support for mounting electronic components, whereby the electronics module is located behind a door in the wall of the system to create access for maintenance. The electronic components have a straight mounting basis for mounting of the electronics components whereby the mounting basis is mounted in the system under an angle between 10 and 80 degrees with respect to the door when the door is closed.

First claim

The invention claimed is:

1. A semiconductor processing system for processing semiconductor substrates, the system further comprising:
a housing including a front wall, a back wall, and side walls;
a processing module provided with a reactor for processing the substrates;
a cassette module provided with a load port for supporting a substrate cassette, the cassette module located adjacent the processing module, wherein the cassette module is located between the front wall and the processing module;
an internal wall separating the cassette module from the processing module;
an electronics module provided with a support for mounting electronic components, whereby the electronics module is located behind a door in the front wall of the housing of the semiconductor processing system to create access to the electronic components, wherein the electronic components have a straight mounting basis in the support for mounting of the electronic components whereby the straight mounting basis is mounted in the semiconductor processing system at an angle about a substantially vertical axis between 5 and 85 degrees from a closed position of the door;
a mounting wall mounted to a frame of the cassette module, said mounting wall is parallel to the front wall and parallel to the door when the door is closed,
wherein the front wall of the housing of the semiconductor processing system is facing a clean room.

2. The semiconductor processing system according to claim 1 , wherein the straight mounting basis of the electronics components is mounted at an angle between 10 and 60 degrees from a closed position of the door.

3. The semiconductor processing system according to claim 1 , wherein the mounting wall of the electronics module is mounted at an angle between 20 and 50 degrees from a closed position of the door.

4. The semiconductor processing system according to claim 1 , wherein the electronic components comprise a circuit breaker in electronic communication with a wafer handling robot configured to transfer semiconductor substrates between a wafer boat of the processing module and a substrate cassette at the load port of the cassette module.

5. The semiconductor processing system according to claim 4 , wherein the electronics components are mounted on the mounting wall at an angle between 5 and 85 degrees with respect to the mounting wall.

6. The semiconductor processing system according to claim 1 , wherein the electronic components comprise a circuit breaker.

7. The semiconductor processing system according to claim 6 , wherein the system comprises a wafer handling robot configured to transfer semiconductor substrates between a wafer boat of the processing module and a substrate cassette at the load port of the cassette module.

8. The semiconductor processing system according to claim 1 , wherein the cassette module further comprises:
a substrate cassette receiving platform, disposed at the front wall of the system;
a cassette handler configured to transport substrate cassettes between the substrate cassette receiving platform and the load port.

Assignees

• Asm Ip Holding Bv

Inventors

• De Jonge Jeroen

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3408

  Docking arrangements · CPC title

• H10P72/3404 Primary

  Storage means · CPC title

• H10P72/3402 Primary

  Mechanical parts of transfer devices · CPC title