Safety container for high power device testing over a range of temperatures

Patent metadata

Field	Value
Publication number	US-12050243-B2
Application number	US-202217750261-A
Country	US
Kind code	B2
Filing date	May 20, 2022
Priority date	May 26, 2021
Publication date	Jul 30, 2024
Grant date	Jul 30, 2024

Abstract

A safety container for high-power, electronic device testing, the safety container including a first shell and first and second ports in the first shell. The first shell is configured to substantially surround a testing chamber sized to accommodate a device-under-test (DUT). The first shell is substantially rigid. The first port is configured to allow a fluid into the testing chamber, the second port configured to allow the fluid to exit the testing chamber.

First claim

We claim:

1. A safety container for high-power, electronic device testing, the safety container comprising:
a first shell configured to substantially surround a testing chamber sized to accommodate a device-under-test (DUT), the first shell being substantially rigid and configured to couple with a support surface, the safety container further comprising a gasket around a rim of the first shell, the gasket configured to form a seal between the first shell and support surface; and
first and second ports in the first shell, the first port configured to allow a fluid into the testing chamber, the second port configured to allow the fluid to exit the testing chamber.

2. The safety container of claim 1 , in which the fluid is air at a predetermined temperature.

3. The safety container of claim 1 , in which the first shell comprises a rectangular dome.

4. The safety container of claim 1 , in which the first shell comprises an electrically non-conductive material.

5. The safety container of claim 1 , in which the first shell comprises one or more side walls and a top surface, the one or more side walls and the top surface formed from a single piece.

6. The safety container of claim 1 , further comprising:
a second shell configured to couple to a support surface, the second shell configured to substantially surround the first shell; and
first and second ports in the second shell, the first port of the second shell aligning with the first port of the first shell to allow the fluid into the testing chamber, the second port of the second shell aligning with the second port of the first shell to allow the fluid to exit the testing chamber.

7. The safety container of claim 6 , further comprising an air gap between the first shell and the second shell.

8. The safety container of claim 6 , in which the second shell comprises one or more side walls and a top surface, the one or more side walls and the top surface of the second shell formed from a single piece.

9. The safety container of claim 6 , in which the second shell comprises a rectangular dome.

10. The safety container of claim 6 , in which a protrusion on either of the first shell or the second shell engages with a receptacle on the other of the first shell or the second shell to align the first shell to the second shell.

11. The safety container of claim 1 , in which the first shell is configured to couple to a support surface comprising a heating element.

12. The safety container of claim 1 , in which the first shell is configured to couple to a support surface through offset pin holes in the first shell and mating pins on the support surface.

13. A method of testing an electronic device-under-test (DUT), the method comprising:
positioning the DUT within a testing chamber, the testing chamber being substantially surrounded by a substantially rigid first shell that is sized to accommodate the DUT and configured to couple with a support surface, the safety container further comprising a gasket around a rim of the first shell, the gasket configured to form a seal between the first shell and support surface, the first shell having first and second ports, the first port configured to allow a fluid into the testing chamber, the second port configured to allow the fluid to exit the testing chamber; and
applying a high-power electrical signal to test the DUT.

14. The method of claim 13 , further comprising introducing air into the first port.

15. The method of claim 13 , further comprising introducing air at a predetermined temperature into the first port.

16. The method of claim 13 , further comprising, before applying the high-power electrical signal to test the DUT:
positioning a second shell to substantially surround the first shell;
aligning a first port of the second shell with the first port of the first shell; and
aligning a second port of the second shell with the second port of the first shell.

17. The method of claim 16 , in which positioning the second shell to substantially surround the first shell comprises engaging a protrusion on either of the first shell or the second shell with a receptacle on the other of the first shell or the second shell to align the first shell to the second shell.

18. The method of claim 13 , in which positioning the DUT within the testing chamber comprises coupling the first shell to a support surface through offset pin holes in the first shell and mating pins on the support surface.

Assignees

• Keithley Instruments

Inventors

• Ferguson Aaron
• Bucci James D
• Sobolewski Gregory
• Smith Brian D
• Trgovich Jeffrey J

Classifications

• G01R1/04

  Housings; Supporting members; Arrangements of terminals · CPC title

• G01R31/2874

  related to temperature · CPC title

• G01R31/261

  for measuring break-down voltage or punch through voltage therefor · CPC title

• G01R31/2623

  for measuring break-down voltage therefor · CPC title

• G01R31/2642

  Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests · CPC title