Multi-piece layered honeycomb extrusion dies and methods of making same

US12049022B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12049022-B2
Application numberUS-202318243929-A
CountryUS
Kind codeB2
Filing dateSep 8, 2023
Priority dateNov 27, 2019
Publication dateJul 30, 2024
Grant dateJul 30, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing an extrusion die, the method comprising: joining a first plate comprising a first upstream surface and a first downstream surface to a second plate comprising a second upstream surface and a second downstream surface, wherein the first plate is formed of a metal having a first elastic modulus and the first plate comprises a plurality of pins formed between a plurality of slots, the plurality of pins and the plurality of slots defining a discharge face for the extrusion die, and wherein the second plate is formed of at least one of a ceramic material or a metal matrix composite material having a second elastic modulus greater than the first elastic modulus and wherein a plurality of feed holes of the extrusion die extend through the second plate. 2. The method of claim 1 , wherein joining the first plate to the second plate comprises a brazing method. 3. The method of claim 2 , wherein the brazing method comprises directly brazing a first upstream surface of the first plate to a second downstream surface of the second plate. 4. The method of claim 2 , wherein the brazing method comprises screen printing a brazing paste in a pattern on the second downstream surface of the second plate. 5. The method of claim 2 , wherein the second plate is formed of the metal matrix composite material, and wherein the metal is a stainless steel. 6. The method of claim 5 , wherein the metal matrix composite material comprises tungsten carbide-cobalt, and wherein the brazing method comprises brazing the metal and the metal matrix composite material together with a first layer of brazing alloy BAg-8, a second layer of brazing alloy BAg-8 and a third layer of a copper brazing material between the first and second layers. 7. The method of claim 1 , wherein joining the first plate to the second plate comprises a mechanical fastening method. 8. The method of claim 1 , wherein the first upstream surface of the first plate is directly joined to the second downstream surface of the second plate. 9. The method of claim 1 , wherein the extrusion die is a honeycomb extrusion die. 10. The method of claim 1 , wherein the second plate is formed of the ceramic material. 11. The method of claim 10 , wherein the ceramic material comprises aluminum oxide. 12. The method of claim 1 , wherein the second plate is formed of the metal matrix composite material. 13. The method of claim 12 , wherein the metal matrix composite material comprises tungsten carbide-cobalt. 14. The method of claim 1 , wherein the extrusion die comprises an effective die modulus of 250 GPa or more. 15. The method of claim 1 , wherein the second elastic modulus is 50% or more greater than the first elastic modulus. 16. The method of claim 1 , wherein a coefficient of thermal expansion of the ceramic material or the metal matrix composite material is from 50% to 150% of a coefficient of thermal expansion of the metal. 17. The method of claim 1 , wherein the plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die and into communication with the plurality of slots of the first plate. 18. The method of claim 1 , wherein the plurality of feed holes comprise first feedhole portions in the first plate and second feedhole portions in the second plate. 19. The method of claim 18 , wherein a first average diameter of the first feedhole portions is larger than a second average diameter of the second feedhole portions. 20. The method of claim 18 , wherein a first average diameter of the first feedhole portions is in a range of 5% to 15% larger than a second average diameter of the second feedhole portions.

Assignees

Inventors

Classifications

  • for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

  • Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

  • taking account of the properties of the materials to be soldered · CPC title

  • specially adapted for particular articles or work · CPC title

  • Stainless steel · CPC title

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What does patent US12049022B2 cover?
Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first down…
Who is the assignee on this patent?
Corning Inc
What technology area does this patent fall under?
Primary CPC classification B28B3/269. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 30 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).