Structural and thermal management of an integrated circuit

Patent metadata

Field	Value
Publication number	US-12046534-B2
Application number	US-202217653633-A
Country	US
Kind code	B2
Filing date	Mar 4, 2022
Priority date	Mar 4, 2022
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.

First claim

What is claimed is:

1. An electronic device, comprising:
a circuit board;
an integrated circuit located on the circuit board;
a first plate;
a second plate, wherein the first plate and the second plate provide a force that maintains a coupling between the integrated circuit and the circuit board;
a thermal component coupled with the first plate;
a module located within the thermal component, the module comprises a holder and a biasing component; and
a heat pipe that passes through the first plate and into the thermal component.

2. The electronic device of claim 1 , further comprising a socket electrically connected to the circuit board, wherein the coupling comprises a mechanical coupling and an electrical coupling between the integrated circuit and the socket.

3. The electronic device of claim 1 , wherein:
the integrated circuit and the circuit board are positioned between the first plate and the second plate, and
the force comprises a compression force.

4. The electronic device of claim 1 , further comprising:
a first thermal component thermally coupled to the integrated circuit; and
a second thermal component thermally coupled to the circuit board.

5. The electronic device of claim 4 , wherein the first thermal component comprises a vapor chamber, and the second thermal component comprises a fin stack.

6. The electronic device of claim 4 , further comprising a voltage regulator, wherein:
the circuit board comprises a first surface and a second surface opposite the first surface,
the integrated circuit is located on the first surface,
the voltage regulator is located on the second surface, and
the second thermal component is thermally coupled to the voltage regulator.

7. An electronic device, comprising:
a first thermal component, comprising:
a holder, and
a biasing component;

a circuit board comprising a socket;
an integrated circuit electrically coupled with the socket, the integrated circuit thermally coupled with the first thermal component;
a plurality of plates coupled with the holder by a fastener, the plurality of plates providing a compression force, based on the fastener and the biasing component, to the integrated circuit and the circuit board; and
a second thermal component thermally coupled to the circuit board, the second thermal component comprises a heat pipe that passes through a plate of the plurality of plates and into the first thermal component.

8. The electronic device of claim 7 , wherein the first thermal component comprises a fin stack.

9. The electronic device of claim 7 , wherein the plurality of plates comprises:
a first plate; and
a second plate, wherein the circuit board and the integrated circuit are positioned between the first plate and the second plate.

10. The electronic device of claim 9 , wherein the first plate is carried by the first thermal component.

11. The electronic device of claim 10 , further comprising a third thermal component positioned between the first thermal component and the first plate.

12. The electronic device of claim 9 , wherein the second plate comprises an opening, and the fastener is positioned in the opening.

13. The electronic device of claim 7 , further comprising a voltage regulator, wherein:
the circuit board comprises a first surface and a second surface opposite the first surface,
the integrated circuit is located on the first surface,
the voltage regulator located on the second surface, and
the second thermal component is thermally coupled to the voltage regulator.

14. An assembly comprising:
a first fin stack, comprising:
a holder,
a fastener, and
a biasing component that surrounds the holder;

a circuit board comprising a socket configured to carry an integrated circuit such that the first fin stack is thermally coupled to the integrated circuit;
a second fin stack thermally coupled to the circuit board;
a plurality of plates configured to provide a compression force, based on the fastener and the biasing component, to the integrated circuit and the circuit board; and
a heat pipe that passes through a plate of the plurality of plates and into the first fin stack.

15. The assembly of claim 14 , wherein the plurality of plates comprises:
a first plate; and
a second plate, wherein the circuit board and the integrated circuit are positioned between the first plate and the second plate.

16. The assembly of claim 14 , further comprising:
a first vapor chamber thermally coupled to the integrated circuit; and
a second vapor chamber thermally coupled to the second fin stack.

17. The assembly of claim 16 , further comprising a voltage regulator carried by the circuit board, wherein the second vapor chamber is thermally coupled to the voltage regulator.

18. The assembly of claim 17 , wherein:
the circuit board comprises a first surface and a second surface opposite the first surface,
the integrated circuit is located on the first surface, and
the voltage regulator located on the second surface.

19. The assembly of claim 16 , wherein:
the plurality of plates comprise a first plate and a second plate, and
the first vapor chamber is positioned between the first plate and the integrated circuit.

Assignees

• Apple Inc

Inventors

• Trivett Simon J
• Degner Brett W
• Hardikar Mahesh S
• Leclerc Michael E
• Prather Eric R
• Ryan Kevin J

Classifications

• H10W40/611 Primary

  Bolts or screws · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/641 Primary

  Snap-on arrangements, e.g. clips · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title