Backing plate with manufactured features on top surface

Patent metadata

Field	Value
Publication number	US-2021193557-A1
Application number	US-201916720599-A
Country	US
Kind code	A1
Filing date	Dec 19, 2019
Priority date	Dec 19, 2019
Publication date	Jun 24, 2021
Grant date	—

Abstract

In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.

First claim

What is claimed is:

1 . An apparatus comprising:
a module lid; a planar structure having a first side and a second side; a device seated in the first side of the planar structure, wherein the module lid is in contact with a top surface of the device; a backing plate having a first side and a second side, wherein the backing plate contains a manufactured features on the first side, and further wherein the first side of the backing plate is in contact with the second side of the planar structure; a plurality of fastening mechanisms, wherein the plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.

2 . The apparatus of claim 1 , wherein the planar structure further comprises:
a printed circuit board (PCB) having a first side and a second side; a land grid array (LGA) connector, wherein the LGA connector is coupled to the first side of the PCB, and further wherein the LGA connector is operative to receive the device therein; and a thin insulating layer interposed between the second side of the PCB and the first side of the backing plate.

3 . The apparatus of claim 2 , wherein a top side of the LGA connector contains an array of springs, and further wherein the array of springs mate with a corresponding array of pads on a bottom surface of the device.

4 . The apparatus of claim 2 , wherein the LGA connector is soldered to the PCB.

5 . The apparatus of claim 3 , wherein the manufactured features on the first side of the backing plate create a height variations to compensate for deformation of a contact surfaces between the top side of the LGA connector and a bottom surface of the device under a coupling force.

6 . The apparatus of claim 5 , wherein the height variations improve contact force uniformity between the array of springs on the top side of the LGA connector and the array of pads on the bottom surface of the device.

7 . The apparatus of claim 1 , wherein a vertical dimension and a lateral dimensions of the manufactured features on the first side of the backing plate permit arbitrary definition of a contact force distribution between a bottom surface of the device and the first side of the planar structure.

8 . The apparatus of claim 1 , wherein the manufactured features on the first side of the backing plate is a single platform at a center of the backing plate.

9 . The apparatus of claim 1 , wherein the manufactured features on the first side of the backing plate are steps of multiple heights, wherein the steps of multiple heights create a customized backing force distribution.

10 . The apparatus of claim 1 , wherein the lid is a heat sink.

11 . The apparatus of claim 1 , wherein the lid is a cold plate.

12 . The apparatus of claim 1 , wherein the fastening mechanisms are selected from the group consisting of screws, nuts and bolts, studs, snaps, and clips.

13 . The apparatus of claim 1 , wherein the backing plate has a height of less than 6 mm.

14 . The apparatus of claim 1 , wherein the backing plate has a height of between 4 mm and 6 mm.

15 . The apparatus of claim 1 , wherein the manufactured features on the first side of the backing plate have a height of less than 0.1 mm.

16 . The apparatus of claim 1 , wherein the manufactured features on the first side of the backing plate have a height of between 0.04 mm and 0.06 mm.

17 . An apparatus coupling integrated circuits to printed circuit boards comprising:
a backing plate having a first side and a second side, wherein a manufactured features on the first side create a height variations to compensate for deformation of a contact surfaces between an LGA connector and a device under coupling force.

18 . The apparatus of claim 17 , wherein a vertical dimension and a lateral dimensions of the manufactured features on the first side of the backing plate permit arbitrary definition of a contact force distribution between a top side of the LGA connector and a bottom surface of the device.

19 . The apparatus of claim 17 , wherein the manufactured features on the first side of the backing plate is a single platform at a center of the backing plate.

20 . The apparatus of claim 17 , wherein the manufactured features on the first side of the backing plate are steps of multiple heights, wherein the steps of multiple heights create a customized backing force distribution between a top side of the LGA connector and a bottom surface of the device.

Assignees

• IBM

Inventors

• Yao Yuan
• Tian Shurong
• Takken Todd Edward

Classifications

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/611 Primary

  Bolts or screws · CPC title

• H05K3/301

  by means of a mounting structure (H05K3/325 takes precedence) · CPC title