Substrate processing apparatus for supplying gas of water repellent agent and substrate processing method

US12042815B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12042815-B2
Application numberUS-202117489045-A
CountryUS
Kind codeB2
Filing dateSep 29, 2021
Priority dateOct 2, 2020
Publication dateJul 23, 2024
Grant dateJul 23, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A substrate processing apparatus includes a processing tank, a holder, an organic solvent supply, a drainage port, a gas supply, and an exhaust port. The processing tank stores an aqueous layer. The holder holds a substrate. The organic solvent supply supplies an organic solvent onto the aqueous layer to form a liquid layer of the organic solvent. The drainage port discharges the aqueous layer from a bottom wall of the processing tank and causes the liquid layer of the organic solvent to descend from above the substrate to below the substrate. The gas supply supplies a gas of a water repellent agent to the liquid layer from above the processing tank while the liquid layer descends. The exhaust port is exposed on a side wall of the processing tank by the descending of the liquid layer and discharges the gas of the water repellent gas.

First claim

Opening claim text (preview).

What is claimed is: 1. A substrate processing apparatus comprising: a processing tank configured to store an aqueous layer in which a substrate is immersed; a holder configured to hold the substrate; an organic solvent supply including an organic solvent nozzle configured to supply an organic solvent onto the aqueous layer, thereby forming a layer of the organic solvent; a drainage port configured to discharge the aqueous layer from a bottom wall of the processing tank and cause the layer of the organic solvent to descend from above the substrate to below the substrate; a gas supply including a gas nozzle positioned above the processing tank, the gas nozzle configured to supply a gas of a water repellent agent to the layer of the organic solvent from above the processing tank while the layer of the organic solvent descends; a first exhaust port positioned on a lower portion of a side wall of the processing tank, an opening of the first exhaust port being exposed due to the descending of the layer of the organic solvent and configured to discharge the gas of the water repellent agent without being connected to a suction source, a second exhaust port provided above the processing tank, wherein the second exhaust port discharges the gas of the water repellent agent at least until the discharge the gas of the water repellent agent by the first exhaust port starts, a liquid level sensor configured to measure a height of the layer of the organic solvent in the processing tank, and a controller controls operation of the substrate processing apparatus; based on the measurement result of the height of the layer of the organic solvent by the liquid level sensor, the controller is configured to stop the exhaust of the gas of the water repellent agent by the second exhaust port; the gas nozzle supplies the gas of the water repellent agent from the gas nozzle positioned above the processing tank, so that the gas of the water repellent agent inside the processing tank is pushed out through the first exhaust port by the gas of the water repellent agent supplied from the gas nozzle positioned above the processing tank. 2. The substrate processing apparatus according to claim 1 , further comprising: an on-off valve in communication with the controller and configured to stop the exhaust by the second exhaust port simultaneously with or after the start of the exhaust by the first exhaust port; and the controller is configured to control the on-off valve based on the measurement result of the liquid level sensor. 3. The substrate processing apparatus according to claim 1 , further comprising: an exhaust line extending from the first exhaust port, wherein a height of an upper end of the exhaust line is greater than a height of an upper end of the processing tank. 4. The substrate processing apparatus according to claim 3 , further comprising: a gas-liquid separator connected to the first exhaust port through the exhaust line, wherein the gas-liquid separator separates and discharges the gas of the water repellent agent and a liquid of the layer of the organic solvent. 5. The substrate processing apparatus according to claim 1 , wherein the first exhaust port is provided on a pair of side walls of the processing tank facing each other.

Assignees

Inventors

Classifications

  • with the semiconductor substrates being dipped in baths or vessels · CPC title

  • Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

  • Process monitoring, e.g. flow or thickness monitoring · CPC title

  • Cleaning during device manufacture · CPC title

  • Vertical transfer of a batch of workpieces · CPC title

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What does patent US12042815B2 cover?
A substrate processing apparatus includes a processing tank, a holder, an organic solvent supply, a drainage port, a gas supply, and an exhaust port. The processing tank stores an aqueous layer. The holder holds a substrate. The organic solvent supply supplies an organic solvent onto the aqueous layer to form a liquid layer of the organic solvent. The drainage port discharges the aqueous layer …
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0414. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).