Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module

Patent metadata

Field	Value
Publication number	US-12041335-B2
Application number	US-202217986436-A
Country	US
Kind code	B2
Filing date	Nov 14, 2022
Priority date	Dec 23, 2016
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

First claim

The invention claimed is:

1. A camera module, characterized by comprising:
at least one optical lens;
at least one photosensitive chip, wherein the at least one optical lens is provided on a photosensitive path of the at least one photosensitive chip;
at least one circuit board, comprising a substrate having a front face and a back face, and wherein the at least one photosensitive chip is electrically connected to the circuit board at the front surface; and
a molding unit, comprising a back molding portion and a molding base, wherein the molding base is integrally bonded to the front face of the substrate at the same time when the back molding portion is integrally bonded to at least a part of an area of the back face of the substrate, and the back molding portion have a mounting space corresponding to the photosensitive chip;
wherein the camera module has at least one dividing side and at least one die releasing side, and the back molding portion has at least a first dividing face and at least a first die releasing face, and the first dividing face of the back molding portion corresponds to the dividing side of the camera module, and the first die releasing face of the back molding portion corresponds to the die releasing side of the camera module, and the molding base has at least a second dividing face and at least a second die releasing face, and the second dividing face of the molding base corresponds to the dividing side of the camera module, and the second die releasing face of the molding base corresponds to the die releasing side of the camera module, and the substrate has at least a dividing edge and at least a die releasing edge, and the dividing edge of the substrate corresponds to the dividing side of the camera module, and the die releasing edge of the substrate corresponds to the die releasing side of the camera module.

2. The camera module of claim 1 , wherein a module connection side of a connection plate is accommodated in the mounting space of the back molding portion after being connected to the substrate on the back face of the substrate.

3. The camera module of claim 2 , wherein the back molding portion embeds a connection position between the module connection side of the connection plate and the substrate.

4. The camera module of claim 2 , wherein at least one electronic component is conductively connected to the substrate on the back face of the substrate.

5. The camera module of claim 4 , wherein a part of the electronic component is embedded by the back molding portion.

6. The camera module of claim 5 , wherein electronic component that is not embedded by the back molding portion is accommodated in the mounting space of the back molding portion.

7. The camera module of claim 6 , wherein a portion of the surface of the electronic components is exposed on the mounting space of the back molding portion.

8. The camera module of claim 2 , wherein when the camera module is mounted to an electronic device, protruding mounting components of a device body of the electronic device is accommodated in the mounting space of the back molding portion.

9. The camera module of claim 2 , wherein the back molding portion of the molding unit is provided with a plurality of the mounting spaces, so that the back molding portion 41 is in the shape of a grid.

10. The camera module of claim 1 , wherein a module connection side of a connection plate is connected to the substrate on the dividing side of the camera module 100 A, or is connected to the substrate on the die releasing side of the camera module 100 A.

11. The camera module of claim 10 , wherein the first dividing face of the back molding portion extends to the dividing edge of the substrate, and the second dividing face of the molding base extends to the dividing edge of the substrate, such that the first dividing face of the back molding portion, the second dividing face of the molding base and the dividing edge of the substrate are aligned with each other.

12. The camera module of claim 11 , wherein the first die releasing side of the back molding portion does not extend to the die releasing side of the substrate to make the first die releasing side of the back molding portion and the die releasing edge of the substrate are displaced from each other, and a distance parameter between the first die releasing side of the back molding portion and the die releasing edge of the substrate is L1, and the value range of the parameter L1 is: 0.1 mm≤L1≤10 mm.

13. The camera module of claim 12 , wherein the value range of the parameter L1 is: 0.2 mm≤L1≤1 mm.

14. The camera module of claim 12 , wherein the second die releasing side of the molding base does not extend to the die releasing side of the substrate to make the second die releasing side of the molding base and the die releasing edge of the substrate are displaced from each other, and a distance parameter between the second die releasing side of the molding base and the die releasing edge of the substrate is L2, and the value range of the parameter L2 is: 0.1 mm≤L2≤10 mm.

15. The camera module of claim 14 , wherein the value range of the parameter L2 is: 0.3 mm≤L2≤2 mm.

16. The camera module of claim 14 , wherein the numerical value of the parameter L2 is not equal to the numerical value of the parameter L1.

17. The camera module of claim 16 , wherein the numerical value of the parameter L2 is greater than the numerical value of the parameter L1.

18. The camera module of claim 1 , wherein the substrate has a mounting space corresponding to the mounting space of the back molding portion, and the mounting space of the substrate is a through hole so as to communicate the front face of the substrate with the back face of the substrate, and the molding base and the back molding portion are connected to each other through the mounting space.

19. An electronic device, comprising:
a device body; and
at least one of the camera modules of claim 1 , wherein the camera module is disposed in the device body.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Guo Nan
• Chen Zhenyu
• Zhao Bojie
• Tanaka Takehiko
• Chen Feifan
• Wu Ye

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04M1/0264

  for a camera module assembly · CPC title

• G03B17/02

  Bodies · CPC title

• G01N15/0656

  using electric, e.g. electrostatic methods or magnetic methods (by investigating individual particles G01N15/1031, G01N15/12) · CPC title