Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module

Patent metadata

Field	Value
Publication number	US-11653079-B2
Application number	US-201716472405-A
Country	US
Kind code	B2
Filing date	Dec 25, 2017
Priority date	Dec 23, 2016
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

First claim

The invention claimed is:

1. A camera module, comprising:
at least one optical lens;
at least one photosensitive chip;
at least one back molding portion;
at least one circuit board, comprising a substrate and at least one electronic component, wherein the photosensitive chip is conductively connected to the substrate, at least one of the electronic components is conductively connected to the substrate on a back face of the substrate, and the back molding portion is integrally bonded to at least a part of an area of the back face of the substrate; and
a molding base, which is integrally bonded to a front face of the substrate by a molding process without a connection medium at the same time when the back molding portion is integrally bonded to the at least a part of an area of the back face of the substrate, wherein the molding base has at least one light window, a photosensitive area of the photosensitive chip corresponds to the light window of the molding base, the optical lens is disposed in a photosensitive path of the photosensitive chip, and the light window of the molding base forms a light path between the optical lens and the photosensitive chip,
wherein the substrate has at least one molding space, and at least one of the at least one molding space is a through hole so as to communicate the front face of the substrate with the back face of the substrate, and the molding base and the back molding portion are connected to each other through the through hole.

2. The camera module of claim 1 , wherein the back molding portion embeds at least a part of at least one of the electronic components.

3. The camera module of claim 1 , wherein the back molding portion forms at least one mounting space.

4. The camera module of claim 3 , wherein at least one of the electronic components is accommodated in the mounting space of the back molding portion.

5. The camera module of claim 1 , wherein the height of the back molding portion is a parameter H, and the height that the electronic component protrudes from the back face of the substrate is a parameter h, wherein the value of the parameter H is greater than or equal to the value of the parameter h.

6. The camera module of claim 1 , wherein the number of the back molding portions is at least one, wherein the back molding portion is integrally molded in at least one corner of the substrate, or the back molding portion is integrally bonded to at least one side portion of the substrate, or the back molding portion is integrally bonded to a center portion of the substrate.

7. The camera module of claim 1 , wherein the number of the back molding portions is at least two, wherein at least one of the back molding portions is integrally molded in at least one corner of the substrate, and the other back molding portion is integrally bonded to least one side portion of the substrate; or at least one of the back molding portions is integrally molded in at least one corner of the substrate, and the other back molding portion is integrally bonded to the center portion of the substrate; or at least one of the back molding portions is integrally bonded to at least one side portion of the substrate, and the other back molding portion is integrally bonded to the center portion of the substrate.

8. The camera module of claim 1 , wherein the circuit board comprises at least one connection plate, wherein a module connection side of the connection plate is connected to the substrate on the back face of the substrate.

9. The camera module of claim 8 , wherein the back molding portion embeds the module connection side of the connection plate.

10. The camera module of claim 1 , wherein the molding base embeds a non-photosensitive area of the photosensitive chip, so that the molding base, the photosensitive chip, the substrate, and the back molding portion are integrally bonded.

11. The camera module of claim 1 , further comprising at least one frame-shaped supporting element, wherein the supporting element is disposed in the non-photosensitive area of the photosensitive chip, or the supporting element is formed in the non-photosensitive area of the photosensitive chip, and the molding base embeds at least a part of the supporting element.

12. The camera module of claim 1 , wherein at least one of the electronic components is conductively connected to the front face of the substrate.

13. The camera module of claim 12 , wherein the molding base embeds at least a part, which is located on the front face of the substrate, of at least one of the electronic components.

14. The camera module of claim 13 , wherein the back molding portion isolates the electronic component from the photosensitive chip that are located on the front face of the substrate.

15. A circuit board assembly, comprising:
at least one back molding portion;
at least one electronic component;
a substrate, wherein at least one of the electronic components is conductively connected to the substrate on a back face of the substrate, and the back molding portion is integrally bonded to at least a portion of an area of the back face of the substrate; and
a molding base, which is integrally bonded to a front face of the substrate by a molding process without a connection medium at the same time when the back molding portion is integrally bonded to the at least a portion of an area of the back face of the substrate, and which has at least one light window, wherein:
a photosensitive area of a photosensitive chip comprised in a camera module comprising the circuit board assembly corresponds to the light window of the molding base, an optical lens comprised in the camera module is disposed in a photosensitive path of the photosensitive chip, and the light window of the molding base forms a light path between the optical lens and the photosensitive chip, and
the substrate has at least one molding space, and at least one of the at least one molding space is a through hole so as to communicate the front face of the substrate with the back face of the substrate, and the molding base and the back molding portion are connected to each other through the through hole.

16. A method for manufacturing a camera module, comprising the following steps:
(a) conductively connecting at least one electronic component on a back face of a substrate;
(b) forming a back molding portion integrally bonded to the substrate on the back face of the substrate;
(c) forming a molding base integrally bonded to a front face of the substrate by a molding process without a connection medium at the same time when the back molding portion is integrally bonded to the back face of the substrate, wherein the substrate has at least one molding space, and at least one of the at least one molding space is a through hole so as to communicate the front face of the substrate with the back face of the substrate, and the molding base and the back molding portion are connected to each other through the through hole;
(d) conductively connecting a photosensitive chip on the front face of the substrate; and
(d) holding an optical lens in a photosensitive path of the photosensitive chip, thereby producing the camera module.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Guo Nan
• Chen Zhenyu
• Zhao Bojie
• Tanaka Takehiko
• Chen Feifan
• Wu Ye

Classifications

• G03B17/02

  Bodies · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• G03B17/28

  Locating light-sensitive material within camera · CPC title

• G01N15/0656

  using electric, e.g. electrostatic methods or magnetic methods (by investigating individual particles G01N15/1031, G01N15/12) · CPC title