Light emitting device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-12040349-B2
Application number	US-202217575088-A
Country	US
Kind code	B2
Filing date	Jan 13, 2022
Priority date	Mar 25, 2021
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A light emitting device includes a printed circuit board (PCB) including a connection pad, a base substrate mounted on the PCB and including a pixel region and a pad region, light emitting structures arranged on the pixel region, a barrier rib structure disposed on the pixel region and disposed at a vertical level different from the light emitting structures, the barrier rib structure including barrier ribs connected with each other to define each of pixel spaces, a phosphor layer filling each pixel space, a dam structure surrounding the barrier rib structure, a pad disposed on the pad region and adjacent to at least one side of an outer boundary of the light emitting structures, a bonding wire connecting the connection pad to the pad, and a molding structure covering the pad, the connection pad, the bonding wire, and at least a portion of the dam structure.

First claim

What is claimed is:

1. A light emitting device comprising:
a printed circuit board (PCB) including a connection pad;
a base substrate mounted on the PCB and including a light emitting pixel region and a pad region;
a plurality of light emitting structures arranged on the light emitting pixel region;
a barrier rib structure disposed on the light emitting pixel region and disposed at a vertical level different from the plurality of light emitting structures,
wherein the barrier rib structure includes a plurality of barrier ribs connected with each other to define each of a plurality of pixel spaces;
a phosphor layer filling an inside of each of the plurality of pixel spaces;
a dam structure surrounding the barrier rib structure;
a pad disposed on the pad region and being adjacent to at least one side of an outer boundary of the plurality of light emitting structures;
a bonding wire connecting the connection pad to the pad; and
a molding structure covering the pad, the connection pad, the bonding wire, and at least a portion of the dam structure.

2. The light emitting device of claim 1 , further comprising:
a first space between the barrier rib structure and the dam structure, and
wherein the molding structure fills at least a portion of the first space.

3. The light emitting device of claim 2 ,
wherein a vertical level of a bottom surface of the first space is equal to or lower than a vertical level of a lower surface of the barrier rib structure.

4. The light emitting device of claim 2 ,
wherein the first space is of a continuous line shape and surrounds the barrier rib structure.

5. The light emitting device of claim 2 ,
wherein the first space surrounds the barrier rib structure, and
wherein a shape of the first space is at least one selected from among a closed shape, a line shape, a rectangle shape, and a circle shape.

6. The light emitting device of claim 1 ,
wherein the barrier rib structure includes substantially the same material as a material of the dam structure, and
wherein a level of an upper surface of the barrier rib structure is substantially the same as a level of an upper surface of the dam structure.

7. The light emitting device of claim 1 ,
wherein the dam structure is positioned between the barrier rib structure and the pad,
wherein the dam structure includes a plurality of dams, and
wherein the plurality of dams are arranged in a direction away from the barrier rib structure.

8. The light emitting device of claim 7 ,
wherein the plurality of dams are positioned to be spaced apart from each other at a substantially equal interval.

9. The light emitting device of claim 1 ,
wherein the bonding wire has a curved portion between the connection pad and the pad,
wherein a level of an uppermost surface of the curved portion of the bonding wire is higher than a level of an uppermost surface of the barrier rib structure, and
wherein the molding structure has a round upper surface and covers the bonding wire entirely.

10. The light emitting device of claim 9 ,
wherein the molding structure covers a side surface of the base substrate and a portion of an upper surface of the PCB.

11. A light emitting device comprising:
a printed circuit board (PCB) including a connection pad;
a base substrate mounted on the PCB and including a light emitting pixel region and a pad region;
a plurality of light emitting structures arranged on the light emitting pixel region;
a barrier rib structure disposed on the light emitting pixel region and disposed at a vertical level different from the plurality of light emitting structures,
wherein the barrier rib structure includes a plurality of barrier ribs connected with each other to define a plurality of pixel spaces;
a phosphor layer filling an inside of each of the plurality of pixel spaces;
a pad disposed on the pad region and being adjacent to at least one side of an outer boundary of the plurality of light emitting structures;
a bonding wire connecting the connection pad to the pad; and
a molding structure covering the pad, the connection pad, the bonding wire, and at least a portion of an outer portion of the barrier rib structure,
wherein the outer portion of the barrier rib structure includes a stepped outer portion, and
wherein the molding structure covers the stepped outer portion.

12. The light emitting device of claim 11 ,
wherein the stepped outer portion is positioned between the phosphor layer and the pad, and
wherein at least a portion of the stepped outer portion of the barrier rib structure contacts the molding structure.

13. The light emitting device of claim 12 , further comprising:
a recessed space provided at an upper surface of the stepped outer portion of the barrier rib structure,
wherein the molding structure fills at least a portion of the recessed space.

14. The light emitting device of claim 11 ,
wherein the bonding wire has a curved portion between the connection pad and the pad,
wherein a level of an uppermost surface of the curved portion of the bonding wire is higher than a level of an uppermost surface of the barrier rib structure, and
wherein the molding structure has a round upper surface and covers the bonding wire entirely.

15. The light emitting device of claim 11 ,
wherein the molding structure covers a side surface of the base substrate and a portion of an upper surface of the PCB.

16. A light emitting device comprising:
a printed circuit board (PCB) including a connection pad;
a base substrate mounted on the PCB and including a light emitting pixel region and a pad region;
a plurality of light emitting structures arranged on the light emitting pixel region;
a barrier rib structure disposed on the light emitting pixel region and disposed at a vertical level different from the light emitting structures,
wherein the barrier rib structure includes a plurality of barrier ribs connected with each other to define a plurality of pixel spaces;
a phosphor layer filling an inside of each of the plurality of pixel spaces;
a pad disposed on the pad region and being adjacent to at least one side of an outer boundary of the plurality of light emitting structures;
a bonding wire connecting the connection pad to the pad; and
a molding structure covering the pad, the connection pad, the bonding wire, and at least a portion of an outer portion of the barrier rib structure,
wherein the outer portion of the barrier rib structure includes a rounded outer portion, and
wherein the molding structure covers the rounded outer portion.

17. The light emitting device of claim 16 ,
wherein the rounded outer portion of the barrier rib structure is positioned between the phosphor layer and the pad, and
wherein at least a portion of the rounded outer portion of the barrier rib structure contacts the molding structure.

18. The light emitting device of claim 17 , further comprising:
a recessed space provided at an upper surface of the rounded outer portion of the barrier rib structure, and
wherein the molding structure fills at least a portion of the recessed space.

19. The light emitting device of claim 16 ,
wherein the bonding wire has a curved portion between the connection pad and the pad,
wherein a level of an uppermost surface of the curved portion of the bonding wire is higher than a level of an uppermost surface of the barrier rib structure, and
wherein the molding structure has a round upper surface and covers the bonding wire entirely.

20. The light emi

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Kiwon
• Kim Hyunsoo
• Park Jinsu
• Lee Suyeol
• LEE Shiyoung
• Lee Chiyoon

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title