Chip package and method for forming the same
US-8952501-B2 · Feb 10, 2015 · US
Chip package
US9209124B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9209124-B2 |
| Application number | US-201313964999-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 12, 2013 |
| Priority date | May 11, 2010 |
| Publication date | Dec 8, 2015 |
| Grant date | Dec 8, 2015 |
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Abstract
Official abstract text for this publication.
An embodiment of the invention provides a chip package including a semiconductor substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A side recess is on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface toward the second surface and across the entire length of the first side. A conducting layer is located on the first surface and electrically connected to the conducting pad, wherein the conducting layer extends to the side recess.
First claim
Opening claim text (preview).
What is claimed is: 1. A chip package, comprising: a semiconductor substrate having a first surface and a second surface opposite thereto; a dielectric layer overlying the first surface of the semiconductor substrate, wherein the dielectric layer comprises an opening exposing a conducting pad; a side recess on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface toward the second surface; an upper recess on at least a f…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9209124B2 cover?
- An embodiment of the invention provides a chip package including a semiconductor substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A side recess is on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface toward the second surface and across the entire length of the fir…
- Who is the assignee on this patent?
- Xintec Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W42/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 08 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).