Processing system

Patent metadata

Field	Value
Publication number	US-12040202-B2
Application number	US-202117242736-A
Country	US
Kind code	B2
Filing date	Apr 28, 2021
Priority date	May 1, 2020
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A processing system capable of increasing an operating time of the processing system is provided. The processing system includes a vacuum transfer module, a plurality of processing modules, a plurality of load-lock modules, and a plurality of atmospheric transfer modules. The vacuum transfer module is configured to transfer a substrate in a pressure lower than an atmospheric pressure. The processing modules are connected to the vacuum transfer module and configured to process the substrate. The load-lock modules are connected to the vacuum transfer module. Each of the atmospheric transfer modules is connected to at least one of the load-lock modules and configured to transfer the substrate in an atmospheric environment.

First claim

The invention claimed is:

1. A system for processing comprising:
a vacuum transfer module configured to transfer a substrate in a pressure lower than an atmospheric pressure;
a plurality of processing modules connected to the vacuum transfer module and configured to process the substrate;
a plurality of load-lock modules connected to the vacuum transfer module; and
a plurality of atmospheric transfer modules each of which is connected to at least one of the load-lock modules and configured to transfer the substrate in an atmospheric environment,
wherein a first load-lock module of the plurality of load-lock modules is connected to a first sidewall of the vacuum transfer module, and a second load-lock module of the plurality of load-lock modules is connected to a second sidewall of the vacuum transfer module, the first sidewall being different from the second sidewall,
wherein a first atmospheric transfer module of the plurality of atmospheric transfer modules is connected to the first load-lock module, and a second atmospheric transfer module of the plurality of atmospheric transfer modules is connected to the second load-lock module, the first atmospheric transfer module being different from the second atmospheric transfer module,
wherein each of the atmospheric transfer modules includes at least one load port for transferring the substrate to and from each of the atmospheric transfer modules so that loading and unloading of the substrate with respect to the vacuum transfer module can be performed by both the first atmospheric transfer module and the second atmospheric transfer module,
wherein a container for accommodating multiple substrates is connected to each of the atmospheric transfer modules, and
wherein each of the atmospheric transfer modules transfers the substrate accommodated in the container into the load-lock module and transfers the substrate that has been transferred from the vacuum transfer module into the load-lock module into the container.

2. The processing system of claim 1 , wherein the vacuum transfer module has an outer shape of polygon in plan view,
the first load-lock module is connected to the first sidewall of the vacuum transfer module corresponding to one side of the polygon,
the second load-lock module is connected to the second sidewall of the vacuum transfer module corresponding to another side of the polygon,
the first atmospheric transfer module is connected to the first load-lock module connected to the first sidewall of the vacuum transfer module corresponding to said one side, and
the second atmospheric transfer module is connected to the second load-lock module connected to the second sidewall of the vacuum transfer module corresponding to said another side.

3. The processing system of claim 1 , wherein the vacuum transfer module has an outer shape of polygon in plan view,
the first load-lock module is connected to the first sidewall of the vacuum transfer module corresponding to one short side of the polygon,
the second load-lock module is connected to the second sidewall of the vacuum transfer module corresponding to another short side of the polygon,
the first atmospheric transfer module is connected to the first load-lock module connected to the first sidewall of the vacuum transfer module corresponding to said one short side, and
the second atmospheric transfer module is connected to the second load-lock module connected to the second sidewall of the vacuum transfer module corresponding to said another short side.

4. The processing system of claim 1 , wherein the plurality of atmospheric transfer modules are connected to each of the load-lock modules, and
each of the plurality of atmospheric transfer modules transfers the substrate to and from each of the load-lock modules.

5. The processing system of claim 1 , wherein the plurality of atmospheric transfer modules are connected to each of the load-lock modules, and
each of the plurality of atmospheric transfer modules transfers the substrate to and from each of the load-lock modules.

6. The processing system of claim 1 , wherein multiple second transfer robots that transfer the substrate and operate independently of each other are disposed in at least one of the plurality of atmosphere transfer modules.

Assignees

• Tokyo Electron Ltd

Inventors

• Amikura Norihiko
• Hirose Jun

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0454 Primary

  surrounding a central transfer chamber · CPC title

• H10P72/0461 Primary

  characterised by the presence of two or more transfer chambers · CPC title

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title