Display module

US12033995B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12033995-B2
Application numberUS-202318134908-A
CountryUS
Kind codeB2
Filing dateApr 14, 2023
Priority dateNov 25, 2020
Publication dateJul 9, 2024
Grant dateJul 9, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

First claim

Opening claim text (preview).

The invention claimed is: 1. A display module including a plurality of pixels, the display module comprising: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages, wherein each micro pixel package of the plurality of micro pixel packages comprises: a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices based on the driving signal transmitted from the driver IC. 2. The display module of claim 1 , wherein each pixel of the plurality of pixels comprises at least two inorganic light emitting devices of the plurality of inorganic light emitting devices, and wherein the plurality of inorganic light emitting devices form at least two pixels of the plurality of pixels. 3. The display module of claim 1 , wherein each micro pixel package of the plurality of micro pixel packages is electrically connected to the first substrate by at least one solder ball. 4. The display module of claim 3 , wherein the at least one solder ball has a height that is greater than a thickness of the micro pixel controller. 5. The display module of claim 1 , wherein the micro pixel controller is further configured to switch the plurality of inorganic light emitting devices and apply a driving current to the plurality of inorganic light emitting devices. 6. The display module of claim 1 , wherein the micro pixel controller comprises: a third substrate; and at least one thin film transistor disposed on the third substrate, and wherein the at least one thin film transistor is configured to switch the plurality of inorganic light emitting devices and apply a driving current to the plurality of inorganic light emitting devices. 7. The display module of claim 6 , wherein the at least one thin film transistor comprises a low temperature polycrystalline silicon (LTPS) thin film transistor. 8. The display module of claim 7 , wherein the second substrate comprises a glass substrate, and wherein the third substrate comprises a silicon substrate. 9. The display module of claim 1 , wherein the plurality of pixels have gaps of a same size between neighboring pixels of the plurality of pixels. 10. The display module of claim 9 , wherein at least some of the plurality of inorganic light emitting devices and a portion of the micro pixel controller overlap each other in a vertical direction. 11. The display module of claim 1 , wherein the plurality of micro pixel packages are arranged so that gaps between neighboring pixels of the plurality of pixels are the same. 12. The display module of claim 1 , wherein each pixel of the plurality of pixels comprises at least three sub-pixels which are configured to output different color of light, respectively. 13. The display module of claim 1 , wherein each pixel of the plurality of pixels comprises a red inorganic light emitting device, a green inorganic light emitting device, and a blue inorganic light emitting device of the plurality of inorganic light emitting devices. 14. The display module of claim 1 , wherein the micro pixel controller is electrically connected to the plurality of inorganic light emitting devices through at least one of a via hole wire and a side wire provided on the second substrate. 15. The display module of claim 1 , further comprising: a black matrix layer provided on the upper surface of the first substrate; and a black matrix layer provided on the upper surface of the second substrate. 16. A display including a plurality of pixels, the display comprising: a plurality of display modules; a housing configured to present the plurality of display modules in a two-dimensional array; and a timing controller configured to send a display signal to the plurality of display modules, wherein each of the plurality of display modules comprises: a first substrate, a plurality of micro pixel packages disposed on an upper surface of the first substrate, and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages, and wherein each micro pixel package of the plurality of micro pixel packages comprises: a second substrate, a plurality of inorganic light emitting devices disposed on an upper surface of the second substrate, and a micro pixel controller disposed on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices based on the driving signal transmitted from the driver IC. 17. The display of claim 16 , wherein the micro pixel controller comprises: a third substrate; and at least one thin film transistor disposed on the third substrate, wherein the at least one thin film transistor is configured to switch the plurality of inorganic light emitting devices and apply a driving current to the plurality of inorganic light emitting devices. 18. The display of claim 17 , wherein the at least one thin film transistor comprises a low temperature polycrystalline silicon (LTPS) thin film transistor. 19. The display of claim 18 , wherein the second substrate comprises a glass substrate, and wherein the third substrate comprises a silicon substrate. 20. The display of claim 16 , wherein each pixel of the plurality of pixels comprises a red inorganic light emitting device, a green inorganic light emitting device, and a blue inorganic light emitting device of the plurality of inorganic light emitting devices.

Assignees

Inventors

Classifications

  • H10W90/00Primary

    Package configurations · CPC title

  • Polycrystalline or microcrystalline silicon · CPC title

  • characterised by multiple TFTs · CPC title

  • Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

  • forming a memory circuit, e.g. a dynamic memory with one capacitor · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12033995B2 cover?
A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emi…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).