Automatic system calibration for wafer handling

Patent metadata

Field	Value
Publication number	US-12027400-B2
Application number	US-202117326533-A
Country	US
Kind code	B2
Filing date	May 21, 2021
Priority date	May 26, 2020
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

A method for automatically calibrating the position of a wafer handling robot relative to a wafer carrier. The method comprises providing a semiconductor processing assembly comprising the wafer carrier and the wafer handling robot having an end effector, placing a wafer on a wafer support surface of the end effector, moving the end effector to an end position adjacent the wafer carrier, determining a displacement of the wafer on the wafer support surface, repeating these steps until the magnitude of the displacement meets a set end criterion, and storing the latest used end position as a calibrated end position.

First claim

The invention claimed is:

1. Method for automatically calibrating the position of a wafer handling robot relative to a wafer carrier, the method comprising:
i) providing a semiconductor processing assembly comprising:
a wafer handling robot having an end effector having a wafer support surface configured to carry a wafer;
a wafer center finder configured to determine the center of a wafer which is placed on the end effector;
a wafer carrier relative to which the position of the wafer handling robot has to be calibrated, the wafer carrier having wafer slots; and,
an electronic controller for controlling at least the wafer handling robot and the wafer center finder and having a system memory;

wherein for calibrating the wafer handling robot relative to the wafer carrier in a horizontal plane, the following method steps are automatically performed under control of the electronic controller of the semiconductor processing assembly:
ii) placing a wafer in a start position on the wafer support surface of the end effector such that the wafer can be displaced over the wafer support surface when a lateral force is exerted on the wafer;
iii) moving the end effector with the wafer to the wafer center finder and determine with the wafer center finder a determined position of the wafer relative to the end effector;
iv) repeating the following horizontal calibration cycle of steps a) to d) until a set end criterion is met at least a number of cycles:
a) determine on the basis of the determined position of the wafer relative to the end effector a defined entry angle of a movement path and a defined end position of the movement path of the end effector, wherein the defined end position is adjacent the wafer carrier;
b) move the end effector with the wafer on its wafer support surface to the defined end position along the movement path with the defined entry angle;
c) determine with the wafer center finder the position of the wafer relative to the end effector; and,
d) check whether, due to the movement of the end effector along the movement path to the defined end position, the position of the wafer relative to the end effector has been displaced and whether a magnitude of the displacement meets the set end criterion, wherein, if the magnitude does not meet the set criterion, a subsequent cycle of steps a) to d) is performed, and wherein, if the magnitude does meet the set criterion at least a number of cycles, the method is continued at v);

v) storing the entry angle and the end position which has been determined in the last cycle in the system memory as calibrated entry angle and calibrated end position for a calibrated movement path of the wafer handling robot relative to the respective wafer carrier.

2. The method according to claim 1 , wherein when step d) is performed and it is established that a subsequent horizontal calibration cycle has to be performed, the method comprises before the next horizontal calibration cycle of steps a) to d) is performed:
repositioning the wafer on the end effector in the start position and,
moving the end effector with the wafer to the wafer center finder to determine with the wafer center finder a determined position of the wafer relative to the end effector.

3. The method according to claim 1 , wherein the wafer slots of the wafer carrier are substantially horizontal, wherein the defined end position of the movement path adjacent the wafer carrier is at a vertical level of the wafer carrier wherein no wafer slots are present and wherein the calibrated end position is a first calibrated end position and the calibrated entry angle is a first calibrated entry angle which are related to the exact position of the wafer carrier relative to the wafer handling robot.

4. The method according to claim 3 , wherein, after calibrating the wafer handling robot relative to the wafer carrier in the horizontal plane, a vertical level of a first wafer slot is determined by means of the following:
vi) placing a wafer in a start position on the wafer support surface of the end effector such that the wafer can be displaced over the wafer support surface when a lateral force is exerted on the wafer;
vii) moving the end effector with the wafer to the wafer center finder and determine with the wafer center finder a determined position of the wafer relative to the end effector;
viii) moving the end effector with the wafer placed on it to a vertical level in which is slightly below an estimated vertical level of a first wafer slot while the end effector is horizontally spaced apart from the wafer carrier;
ix) repeating the following vertical calibration cycle until the vertical level of the first wafer slot is determined:
e) move the end effector with the wafer on its wafer support surface along the movement path with the first calibrated entry angle beyond the first calibrated end position;
f) move the end effector with the wafer on it to the wafer center finder and determine with the wafer center finder the position of the wafer relative to the end effector; and
g) check whether, due to the movement of the end effector along the movement path beyond the first calibrated end position, the position of the wafer relative to the end effector has been displaced, wherein, if the wafer has been displaced, the end effector with the wafer placed on it is moved over an incremental vertical distance to a vertical level which is slightly higher than the previous vertical level of the end effector and subsequently repeat the vertical calibration cycle of steps e) to g), and wherein, if the wafer has not been displaced, the method is continued at x);

x) storing a vertical level for the end effector which is slightly higher than the vertical level which has been established in the last vertical calibration cycle in the system memory as a first calibrated vertical level of the first wafer slot.

5. The method according to claim 4 , wherein when step g) is performed and it is established that a subsequent vertical calibration cycle has to be performed, the method comprises before the next vertical calibration cycle of steps e) to g) is performed:
repositioning the wafer is on the end effector in the start position; and,
moving the end effector with the wafer to the wafer center finder to determine with the wafer center finder a determined position of the wafer relative to the end effector.

6. The method of claim 4 , wherein after the first calibrated vertical level has been stored in the system memory, steps ii), iii), iv) a) to e), and step v) are repeated, wherein the calibrated end position established during that repetition is a second calibrated end position and the calibrated entry angle is a second calibrated entry angle which are related to the exact position of the first wafer slot relative to the wafer handling robot.

7. The method according to claim 4 , wherein the end effector has a vacuum clamp including a vacuum plenum in the wafer support surface which vacuum plenum is connectable to a vacuum source, wherein the vacuum clamp can be switched on so as to connect the vacuum plenum with the vacuum source and can be switched off so that the vacuum plenum is disconnected from the vacuum source, wherein for calibrating the vertical position of the wafer handling robot relative to a wafer in the wafer carrier the method comprises:
xi) placing a wafer in the first wafer slot of the wafer carrier;
xii) performing the following steps automatically under control of the electronic controller of the semiconductor processing assembly:
moving the end effector to a start vertical level which is below the first calibrated vertical level and below the wafer in the first wafer slot;
subsequently moving the end effector in an upwards direction while vacuum clamp i

Assignees

• Asm Ip Holding Bv

Inventors

• Oosterlaken Theodorus G M

Classifications

• H10P72/0606 Primary

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/34 Primary

  the wafers being stored in a carrier, involving loading and unloading · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• G05B2219/39024

  Calibration of manipulator · CPC title