Plating apparatus and recording medium recording program thereon
US-2018363161-A1 · Dec 20, 2018 · US
the wafers being stored in a carrier, involving loading and unloading
the wafers being stored in a carrier, involving loading and unloading · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/34 |
| Official title | {the wafers being stored in a carrier, involving loading and unloading} |
| Display label | the wafers being stored in a carrier, involving loading and unloading |
| Total patents | 314 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 14 |
| 2017 | 17 |
| 2018 | 34 |
| 2019 | 34 |
| 2020 | 31 |
| 2021 | 32 |
| 2022 | 41 |
| 2023 | 36 |
| 2024 | 31 |
| 2025 | 27 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate processing device, method for controlling substrate processing device, and storage medium storing programs
US-2018286730-A1 · Oct 4, 2018 · US
Processing apparatus
US-10079166-B2 · Sep 18, 2018 · US
Front opening ring pod
US-10062590-B2 · Aug 28, 2018 · US
Processing apparatus
US-2018218931-A1 · Aug 2, 2018 · US
Exposure apparatus and method
US-2018203358-A1 · Jul 19, 2018 · US
Substrate processing apparatus
US-2018190521-A1 · Jul 5, 2018 · US
Apparatus And Methods For Wafer Rotation To Improve Spatial ALD Process Uniformity
US-2018190535-A1 · Jul 5, 2018 · US
Sealed substrate carriers and systems and methods for transporting substrates
US-2018138068-A1 · May 17, 2018 · US
Equipment front end module and semiconductor manufacturing apparatus including the same
US-2018114710-A1 · Apr 26, 2018 · US
Container Storage Facility
US-2018076073-A1 · Mar 15, 2018 · US
Container Storage Facility
US-2018076074-A1 · Mar 15, 2018 · US
Front Opening Ring Pod
US-2018068879-A1 · Mar 8, 2018 · US
Sealed substrate carriers and systems and methods for transporting substrates
US-9905447-B2 · Feb 27, 2018 · US
Front Opening Ring Pod
US-2018040492-A1 · Feb 8, 2018 · US
Front opening ring pod
US-9881820-B2 · Jan 30, 2018 · US
Front Opening Ring Pod
US-2018019142-A1 · Jan 18, 2018 · US
Clamp apparatus, substrate carry-in/out apparatus using the same, and substrate processing apparatus
US-9857124-B2 · Jan 2, 2018 · US
Methods and apparatus for semiconductor sample workflow
US-2017363549-A1 · Dec 21, 2017 · US
Wafer processing system
US-2017358465-A1 · Dec 14, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/34?
- CPC H10P72/34 is the Cooperative Patent Classification code for “the wafers being stored in a carrier, involving loading and unloading.”
- How many patents are filed under CPC H10P72/34 (the wafers being stored in a carrier, involving loading and unloading)?
- Our database includes 314 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/34 growing?
- Publication counts under this code: 31 in 2024 vs 27 in 2025 (latest complete years).