Camera module, and photosensitive component thereof and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-12021097-B2
Application number	US-202217847569-A
Country	US
Kind code	B2
Filing date	Jun 23, 2022
Priority date	Mar 12, 2016
Publication date	Jun 25, 2024
Grant date	Jun 25, 2024

Abstract

A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

First claim

What is claimed is:

1. An array camera module, comprising:
at least two camera modules, wherein each of the camera modules is independent from others, and the at least two camera modules coordinate with each other to conduct the image capturing of the array camera module, wherein each of the camera modules comprises:
a photosensitive unit, comprising:
an encapsulation portion;
a photosensitive portion, including a main circuit board and a photosensitive sensor, wherein the encapsulation portion is encapsulated to form on the main circuit board and the photosensitive sensor and has a window defined by an inclined inner wall of the encapsulation portion and positioned above the photosensitive sensor to provide a light path of the photosensitive sensor; and
a protective layer arranged on the main circuit board around an area of the photosensitive sensor; and

a camera lens, located in the photosensitive path of the photosensitive sensor of the photosensitive unit;

wherein the encapsulation portions of the at least two camera modules are integrally connected, so as to form a conjoined encapsulation portion.

2. The array camera module, as recited in claim 1 , wherein the at least two camera modules are integrally assembled through an external frame.

3. The array camera module, as recited in claim 2 , wherein the at least two camera modules are connected to each other.

4. The array camera module, as recited in claim 2 , wherein the at least two camera modules are not connected to each other.

5. The array camera module, as recited in claim 1 , wherein the main circuit boards of the at least two camera modules are interconnected, so as to form an integral main circuit board.

6. The array camera module, as recited in claim 1 , wherein the frames of the at least two camera modules are integrally connected, so as to form a conjoined frame.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Tanaka Takehiko
• Luan Zhongyu
• Chen Zhenyu
• Huang Zhen

Classifications

• H10W72/075

  of bond wires · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W76/60 Primary

  Seals · CPC title

• H10F39/8053

  Colour filters · CPC title

• H10F39/028

  performed after manufacture of the image sensors, e.g. annealing, gettering of impurities, short-circuit elimination or recrystallisation · CPC title