Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods

US11996289B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11996289-B2
Application numberUS-202117141360-A
CountryUS
Kind codeB2
Filing dateJan 5, 2021
Priority dateApr 16, 2020
Publication dateMay 28, 2024
Grant dateMay 28, 2024

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  2. Abstract

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Abstract

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Methods and systems for forming structures including one or more layers comprising silicon germanium and one or more layers comprising silicon are disclosed. Exemplary methods can include using a surfactant, using particular precursors, and/or using a transition step to improve an interface between adjacent layers comprising silicon germanium and comprising silicon.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming a structure, the method comprising the steps of: providing a substrate within a reaction chamber; forming a first layer comprising silicon and germanium overlying a surface of the substrate; and forming a second layer comprising silicon overlying the first layer, wherein the step of forming the first layer comprises providing a surfactant precursor to the reaction chamber only during the last twenty-five percent of the step of forming the first layer, and wherein the second layer consists essentially of silicon and is in direct contact with the first layer. 2. The method of claim 1 , wherein the surfactant precursor comprises one or more of gallium, tellurium, antimony, indium, tin, and aluminum. 3. The method of claim 1 , wherein the surfactant precursor comprises a halogen. 4. The method of claim 3 , wherein the surfactant precursor comprises a chloride, bromide, or iodine. 5. The method of claim 1 , wherein the surfactant precursor is selected from one or more of the group consisting of GaCl 3 , SnCl 4 , SbCl 3 , AlCl 3 , and InCl 3 . 6. The method of claim 1 , wherein an etchant is provided during the step of forming the first layer. 7. The method of claim 1 , wherein the step of forming the first layer comprises flowing two or more silicon precursors.

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What does patent US11996289B2 cover?
Methods and systems for forming structures including one or more layers comprising silicon germanium and one or more layers comprising silicon are disclosed. Exemplary methods can include using a surfactant, using particular precursors, and/or using a transition step to improve an interface between adjacent layers comprising silicon germanium and comprising silicon.
Who is the assignee on this patent?
Asm Ip Holding Bv
What technology area does this patent fall under?
Primary CPC classification H10P14/24. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 28 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).