Injection molded caps or closures, and methods thereof

US11975466B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11975466-B2
Application numberUS-202017603456-A
CountryUS
Kind codeB2
Filing dateMay 29, 2020
Priority dateJun 11, 2019
Publication dateMay 7, 2024
Grant dateMay 7, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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An injection molded cap or closure having a weld line, wherein the injection molded cap or closure is formed from an ethylene-based resin comprising a high molecular weight component and a low molecular weight component.

First claim

Opening claim text (preview).

We claim: 1. An injection molded cap or closure having a weld line, wherein the injection molded cap or closure is formed from an ethylene-based resin comprising: a high molecular weight component, wherein the high molecular weight component comprises an ethylene/alpha-olefin copolymer having a density of from 0.915 g/cc to 0.940 g/cc and a high load melt index (I21.6) of from 3.0 g/10 min to 12.0 g/10 min; and a low molecular weight component; wherein the ethylene-based resin comprises 50 wt. % to 60 wt. % of the high molecular weight component; and wherein the ethylene-based resin has: a density of from 0.945 g/cc to 0.958 g/cc; a melt index (I2.16) of from 1.0 g/10 min to 3.0 g/10 min; a molecular weight distribution (Mw/Mn) of from 5.0 to 8.0, where Mw is the weight average molecular weight and Mn is the number average molecular weight; and a cross-over relaxation time of less than 80 ms. 2. The cap or closure of claim 1 , wherein the high molecular weight has a molecular weight distribution (Mw/Mn) of from 3.5 to 5.5. 3. The cap or closure of claim 1 , wherein the high molecular weight component has a density of from 0.920 g/cc to 0.939 g/cc. 4. The cap or closure of claim 1 , wherein the low molecular weight component has a calculated density of at least 0.950 g/cc as calculated according to the following equation: 1 Density ⁢ ( PE ) = Weight ⁢ Fraction ⁢ ( A ) Density ⁢ ( A ) + Weight ⁢ Fraction ⁢ ( B ) Density ⁢ ( B ) where “PE” is the ethylene-based resin, “A” is the high molecular weight component and “B” is the low molecular weight component. 5. The cap or closure of claim 1 , wherein the ethylene-based resin has a melt index (I2.16) ranging from 1.2 g/10 min to 2.7 g/10 min. 6. The cap or closure of claim 1 , wherein the ethylene-based resin comprises 50 wt. % to 57 wt. % of the high molecular weight component. 7. The cap or closure of claim 1 , wherein the ethylene-based resin has a high load melt index (I21.6) ranging from 50 g/10 min to 110 g/10 min. 8. The cap or closure of claim 1 , wherein the ethylene-based resin has an Mz of greater than or equal to 450,000 g/mol. 9. The cap or closure of claim 1 , wherein the ethylene-based resin has an Mw/Mn of 5.0 to 7.5. 10. The cap or closure of claim 1 , wherein the ethylene-based resin has an Mz/Mw of 4.1 to 5.2. 11. The cap or closure of claim 1 , wherein the ethylene-based resin has a zero shear viscosity ratio of less than or equal to 1.25. 12. The cap or closure of claim 1 , wherein the ethylene-based resin has an environmental stress crack resistance (ESCR) F50, as measured according to ASTM D-1693-01, condition B at 50° C. using 10% Tergitol NP-9 or equivalent, of 30 to 200 hours.

Assignees

Inventors

Classifications

  • characterised by the choice of material · CPC title

  • Producing closure members for containers, e.g. closure caps or stoppers · CPC title

  • HDPE, i.e. high density polyethylene · CPC title

  • Copolymers of ethylene (B29K2023/16 takes precedence) · CPC title

  • Density · CPC title

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Frequently asked questions

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What does patent US11975466B2 cover?
An injection molded cap or closure having a weld line, wherein the injection molded cap or closure is formed from an ethylene-based resin comprising a high molecular weight component and a low molecular weight component.
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification B29C45/0001. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 07 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).