Package structure and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11970388-B2
Application number	US-202117550607-A
Country	US
Kind code	B2
Filing date	Dec 14, 2021
Priority date	Dec 14, 2020
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.

First claim

What is claimed is:

1. A package structure, comprising:
a substrate having a recess;
a first microelectromechanical system (MEMS) chip formed on the substrate, wherein the first MEMS chip has a through-substrate via, a lower surface of the first MEMS chip has a first sensor or a microactuator formed on the through-substrate via, and the first sensor or the microactuator is located in the recess;
a first intermediate chip formed on the first MEMS chip, wherein the first intermediate chip has a through-substrate via, the first intermediate chip comprises a signal conversion unit, a logic operation unit, a control unit, or a combination thereof;
a second MEMS chip formed on the first intermediate chip, wherein the second MEMS chip has a through-substrate via, an upper surface of the second MEMS chip has a second sensor or a microactuator formed on the through-substrate via, and the package structure comprises at least one of the first sensor and the second sensor, and
a first capping plate formed on the second MEMS chip, wherein the first capping plate provides a receiving space, and the second sensor or the microactuator located on the upper surface of the second MEMS chip is located in the receiving space.

2. The package structure as claimed in claim 1 , further comprising:
a second intermediate chip formed between the first MEMS chip and the second MEMS chip, wherein the second intermediate chip has a through-substrate via, and the second intermediate chip comprises a memory unit, an antenna unit, or a combination thereof.

3. The package structure as claimed in claim 2 , further comprising:
a third intermediate chip formed between the first MEMS chip and the second MEMS chip, wherein the third intermediate chip has a through-substrate via, and the third intermediate chip comprises a memory unit, an antenna unit, or a combination thereof.

4. The package structure as claimed in claim 3 , wherein the third intermediate chip and the second intermediate chip are horizontally arranged.

5. The package structure as claimed in claim 2 , wherein the second intermediate chip and the first intermediate chip are horizontally arranged.

6. The package structure as claimed in claim 2 , wherein the second intermediate chip is formed between the first MEMS chip and the first intermediate chip.

7. The package structure as claimed in claim 2 , wherein the second intermediate chip is formed between the second MEMS chip and the first intermediate chip.

8. The package structure as claimed in claim 1 , further comprising:
a third MEMS chip formed on the first intermediate chip, and arranged horizontally with the second MEMS chip, wherein an upper surface of the third MEMS chip has a third sensor or a microactuator; and
a second capping plate formed on the third MEMS chip, wherein the third sensor or the microactuator located on the upper surface of the third MEMS chip is located in a receiving space provided by the second capping plate.

9. The package structure as claimed in claim 1 , further comprising:
a third MEMS chip formed between the first intermediate chip and the second MEMS chip, wherein an upper surface of the third MEMS chip has a third sensor or a microactuator; and
a second capping plate formed on the third MEMS chip, wherein the third sensor or the microactuator located on the upper surface of the third MEMS chip is located in a receiving space provided by the second capping plate.

10. The package structure as claimed in claim 9 , wherein a sidewall of the second capping plate has an opening.

11. The package structure as claimed in claim 1 , further comprising:
a first redistribution layer formed between the first MEMS chip and the first intermediate chip;
a second redistribution layer formed between the first intermediate chip and the second MEMS chip; and
a filling medium formed in at least one of the recess and the receiving space.

12. The package structure as claimed in claim 1 , wherein the upper surface of the first capping plate has an opening, so that the receiving space becomes an open space.

13. The package structure as claimed in claim 1 , further comprising a molding compound layer, wherein the molding compound layer covers the substrate and the first MEMS chip.

14. The package structure as claimed in claim 13 , wherein an upper surface of the first MEMS chip and an upper surface of the molding compound layer are coplanar.

15. The package structure as claimed in claim 2 , wherein a size of the second intermediate chip is smaller than a size of the first intermediate chip.

16. The package structure as claimed in claim 3 , wherein a size of the third intermediate chip is smaller than a size of the first intermediate chip.

17. The package structure as claimed in claim 3 , wherein a size of the second MEMS chip is larger than a sum of the size of the first intermediate chip, the size of the second intermediate chip, and the size of the third intermediate chip.

18. The package structure as claimed in claim 14 , wherein the recess is a closed space, and a filling medium is formed in the recess.

19. The package structure as claimed in claim 11 , wherein the bottom surface of the first sensor is lower than the top surface of the first MEMS chip.

20. The package structure as claimed in claim 19 , wherein the upper surface of the second sensor is higher than the top surface of the second MEMS chip.

Assignees

• Winbond Electronics Corp

Inventors

• Wu Jin-Neng

Classifications

• B81B3/0018 Primary

  Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators · CPC title

• B81C3/001

  Bonding of two components · CPC title

• B81B2201/0214

  Biosensors; Chemical sensors · CPC title

• B81B2201/03

  Microengines and actuators · CPC title

• B81B2203/033

  Trenches · CPC title