Techniques for adhesive control between a substrate and a die

Patent metadata

Field	Value
Publication number	US-10056294-B2
Application number	US-201414325573-A
Country	US
Kind code	B2
Filing date	Jul 8, 2014
Priority date	Dec 2, 2013
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

Semiconductor devices are described that employ techniques configured to control adhesive application between a substrate and a die. In an implementation, a sacrificial layer is provided on a top surface of the die to protect the surface, and bonds pads thereon, from spill-over of the adhesive. The sacrificial layer and spill-over adhesive are subsequently removed from the die and/or chip carrier. In an implementation, the die includes a die attach film (DAF) on a bottom surface of the die for adhering the die to the cavity of the substrate. The die is applied to the cavity with heat and pressure to cause a portion of the die attach film (DAF) to flow from the bottom surface of the die to a sloped surface of the substrate cavity.

First claim

What is claimed is:

1. A method for fabricating a packaging structure, the method comprising:
forming at least one cavity in a substrate;
singulating a second substrate to form a plurality of die;
affixing at least one bond pad on a surface of a die of the plurality of die;
depositing a sacrificial layer of material directly on the surface of the die, the sacrificial layer of material including a resist layer, the sacrificial layer of material covering at least a portion of a bond pad of the at least one bond pad;
introducing an adhesive to a cavity of the at least one cavity;
placing the die into the cavity and in contact with the adhesive, the sacrificial layer of material configured to protect the at least a portion of a bond pad of the at least one bond pad from spill-over adhesive; and
removing the sacrificial layer of material from the surface of the die after placing the die in contact with the adhesive.

2. The method of claim 1 , wherein removing the sacrificial layer of material includes introducing a solvent to the sacrificial layer of material.

3. The method of claim 2 , wherein the solvent includes N-Methyl-2-pyrrolidone (NMP).

4. The method of claim 1 , further comprising at least partially curing the adhesive prior to removing the sacrificial layer of material.

5. The method of claim 1 , further comprising treating the die with a pressurized fluid to remove spill-over adhesive previously in contact with the sacrificial layer before the sacrificial layer was removed.

6. The method of claim 1 , wherein the sacrificial layer includes poly(p-phenylene-2,6-benzobisoxazole) (PBO).

7. The method of claim 1 , further comprising depositing a second sacrificial layer of material on a surface of the substrate adjacent the cavity of the at least one cavity.

8. The method of claim 7 , further comprising removing the second sacrificial layer of material from the surface of the substrate after placing the die in contact with the adhesive.

9. The method of claim 1 , wherein the adhesive contacts a sidewall of the die after the die is placed in contact with the adhesive, and wherein the adhesive contacts the sidewall at the surface of the die.

10. The method of claim 1 , wherein the adhesive contacts a sidewall of the die at a location between the surface of the die and the cavity after the die is placed in contact with the adhesive.

Assignees

• Maxim Integrated Products

Inventors

• Sridharan Vivek S
• Kulkarni Srikanth
• Tran Khanh

Classifications

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W72/9413

  on encapsulations · CPC title