Fabric-based items with electrical component arrays

Patent metadata

Field	Value
Publication number	US-11967561-B2
Application number	US-202318330276-A
Country	US
Kind code	B2
Filing date	Jun 6, 2023
Priority date	Aug 20, 2015
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.

First claim

What is claimed is:

1. An apparatus comprising:
a support structure having first and second opposing surfaces;
an electronic component mounted to the first surface of the support structure;
a first bead of polymer that is formed on the first surface of the support structure, wherein the first bead of polymer conforms to the electronic component; and
a second bead of polymer that is formed on the second surface of the support structure, wherein the electronic component overlaps the second bead of polymer.

2. The apparatus defined in claim 1 , wherein the support structure comprises a layer of fabric, wherein the first bead of polymer directly contacts both the electronic component and the support structure, wherein the first bead of polymer encapsulates the electronic component and adheres the electronic component to the support structure, wherein the first bead of polymer is a light-diffusing bead of polymer, and wherein the second bead of polymer is an opaque bead of polymer.

3. The apparatus defined in claim 1 , wherein the support structure comprises a layer of fabric.

4. The apparatus defined in claim 1 , wherein the support structure comprises a flexible printed circuit layer having an array of openings.

5. The apparatus defined in claim 1 , wherein the first bead of polymer is a light-diffusing bead of polymer.

6. The apparatus defined in claim 5 , wherein the second bead of polymer is an opaque bead of polymer.

7. The apparatus defined in claim 1 , wherein the first bead of polymer comprises a polymer with light scattering particles.

8. The apparatus defined in claim 7 , wherein the second bead of polymer comprises a light-absorbing polymer.

9. The apparatus defined in claim 1 , wherein the first bead of polymer directly contacts both the electronic component and the support structure.

10. The apparatus defined in claim 1 , wherein the first bead of polymer diffuses light emitted by the electronic component in a first direction and wherein the second bead of polymer blocks stray light from propagating in a second direction that is opposite the first direction.

11. The apparatus defined in claim 1 , wherein the first bead of polymer both encapsulates the electronic component and adheres the electronic component to the support structure.

12. The apparatus defined in claim 1 , further comprising:
a layer that conforms to the first bead of polymer.

13. The apparatus defined in claim 12 , wherein the layer comprises a material selected from the group consisting of: silicone, polyurethane, and acrylic.

14. The apparatus defined in claim 12 , wherein the layer is formed from an elastomeric material.

15. An apparatus comprising:
a fabric support structure having first and second opposing surfaces;
a light-emitting component mounted to the first surface of the fabric support structure; and
an opaque bead of polymer that is formed on the second surface of the fabric support structure, wherein the light-emitting component overlaps the opaque bead of polymer.

16. The apparatus defined in claim 15 , further comprising:
a light-diffusing bead of polymer that both encapsulates the light-emitting component and adheres the light-emitting component to the fabric support structure.

17. The apparatus defined in claim 15 , further comprising:
an additional bead of polymer that conforms to the light-emitting component.

18. The apparatus defined in claim 17 , wherein the additional bead of polymer is a light-diffusing bead of polymer.

19. The apparatus defined in claim 17 , wherein the additional bead of polymer comprises a polymer with light scattering particles.

20. An apparatus comprising:
a flexible printed circuit having an array of openings and first and second opposing surfaces;
a light-emitting component mounted to the first surface of the flexible printed circuit;
a light-diffusing bead of polymer that encapsulates the light-emitting component; and
an elastomeric layer that conforms to the light-diffusing bead of polymer.

Assignees

• Apple Inc

Inventors

• Sunshine Daniel D
• Drzaic Paul S
• Podhajny Daniel A
• Kindlon David M
• Kim Hoon Sik
• Crews Kathryn P
• Hsu Yung-Yu

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title