Fabric-based items with electrical component arrays

Patent metadata

Field	Value
Publication number	US-10553540-B2
Application number	US-201615752480-A
Country	US
Kind code	B2
Filing date	Aug 17, 2016
Priority date	Aug 20, 2015
Publication date	Feb 4, 2020
Grant date	Feb 4, 2020

Abstract

A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.

First claim

What is claimed is:

1. A fabric-based item comprising:
an array of electrical components mounted on a fabric substrate;
a polymer layer in which the array of electrical components and the fabric substrate are embedded;
a fabric layer to which the polymer layer is attached; and
a layer of adhesive interposed between the fabric layer and the polymer layer.

2. The fabric-based item defined in claim 1 wherein each of the electrical components comprises an interposer to which multiple semiconductor dies are mounted.

3. The fabric-based item defined in claim 1 wherein the fabric substrate has contact pads to which the electrical components are electrically coupled.

4. The fabric-based item defined in claim 3 wherein the contact pads of the fabric substrate are formed from conductive yarn in the fabric substrate and wherein the fabric-based item further comprises solder with which the contact pads of the fabric substrate are soldered to solder pads in the electrical component.

5. A fabric-based item comprising:
an array of light-emitting diodes mounted on a flexible substrate;
a clear polymer layer in which the array of light-emitting diodes and flexible substrate are embedded;
a fabric layer to which the clear polymer layer is attached; and
a bead of translucent polymer covering each light-emitting diode, wherein the beads of translucent polymer are embedded within the clear polymer layer.

6. The fabric-based item defined in claim 5 further comprising opaque beads of polymer each of which is overlapped by a respective one of the light-emitting diodes.

7. The fabric-based item defined in claim 5 wherein the flexible substrate comprises a flexible printed circuit having an array of openings.

8. Apparatus, comprising:
an array of electrical components mounted on a substrate that has an array of openings; and
a fabric layer attached to the substrate, wherein the substrate comprises a flexible printed circuit having portions to which the electrical components are attached and having serpentine segments extending between the portions to which the electrical components are attached.

9. The apparatus defined in claim 8 wherein the electrical components include light-emitting diodes.

10. The apparatus defined in claim 9 further comprising translucent polymer covering the light-emitting diodes.

11. The apparatus defined in claim 10 further comprising a layer of adhesive interposed between the fabric layer and the substrate with the array of openings.

12. The apparatus defined in claim 8 wherein the electrical components comprise actuators.

13. The apparatus defined in claim 8 wherein the electrical components comprise sensors.

14. The apparatus defined in claim 8 wherein the electrical components are soldered to the portions to which the electrical components are attached.

15. A fabric-based item, comprising:
a first fabric layer;
a second fabric layer;
electrical components, wherein each of the electrical components comprises an interposer to which multiple semiconductor dies are mounted;
a flexible printed circuit to which the electrical components are attached, wherein the flexible printed circuit has an array of openings and is mounted between the first fabric layer and the second fabric layer;
a first layer of adhesive between the first fabric layer and the flexible printed circuit; and
a second layer of adhesive between the second fabric layer and flexible printed circuit.

16. The fabric-based item defined in claim 15 wherein the electrical components are soldered to the flexible printed circuit and include sensors, the fabric-based item further comprising:
polymer that contains light-scattering particles and that overlaps the electrical components.

Assignees

• Apple Inc

Inventors

• Sunshine Daniel D
• Drzaic Paul S
• Podhajny Daniel A
• Kindlon David M
• Kim Hoon Sik
• Crews Kathryn P
• Hsu Yung-Yu

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title