Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device
US-2019369496-A1 · Dec 5, 2019 · US
Maleimide resin, curable resin composition, and cured product thereof
US11958940B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11958940-B2 |
| Application number | US-201917254850-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2019 |
| Priority date | Sep 12, 2018 |
| Publication date | Apr 16, 2024 |
| Grant date | Apr 16, 2024 |
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Abstract
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Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N′-(phenylene-di-(2,2,-propylidene)-di-p-phenylene) bismaleimide content is 90 area % or less. (In formula (1), n is the number of repetitions, and 1<n<5.)
First claim
Opening claim text (preview).
What is claimed is: 1. A maleimide resin represented by following Formula (1) and in which a content (A1) of the component having n=1 in formula (1) as determined by GPC analysis, a content (A2) of N,N′-(phenylene-di-(2,2-propylidene)-di-p-phenylene)bismaleimide in the component having n=1 as determined by HPLC analysis, a content of N,N′-(phenylene-di-(2,2-propylidene)-di-p-phenylene)bismaleimide from the calculation formula of (A1)×(A2) is 90 area % or less: in Formula (1), n represents the number of repetitions, and 1≤n<5. 2. The maleimide resin according to claim 1 , wherein a content of a component having n=1 in Formula (1) is 98 area % or less. 3. A maleimide resin represented by following Formula (2) and in which a content of N,N′-(1,3-phenylene-di-(2,2-propylidene)-di-p-phenylene)bismaleimide is 90 area % or less: in Formula (2), n represents a number of repetitions, and 1≤n<5. 4. The maleimide resin according to claim 3 , wherein a content of a component having n=1 in Formula (2) is 98 area % or less. 5. A curable resin composition containing the maleimide resin according to claim 1 . 6. The curable resin composition according to claim 5 , further comprising a curing agent. 7. A cured product obtained by curing the curable resin composition according to claim 5 . 8. A curable resin composition containing the maleimide resin according to claim 2 . 9. A curable resin composition containing the maleimide resin according to claim 3 . 10. A curable resin composition containing the maleimide resin according to claim 4 . 11. The curable resin composition according to claim 9 , further comprising a curing agent. 12. A cured product obtained by curing the curable resin composition according to claim 6 . 13. A cured product obtained by curing the curable resin composition according to claim 9 . 14. A cured product obtained by curing the curable resin composition according to claim 11 .
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Classifications
- C08G73/128Primary
the unsaturated precursors containing heterocyclic moieties in the main chain · CPC title
- C07D207/452Primary
with hydrocarbon radicals, substituted by hetero atoms, directly attached to the ring nitrogen atom · CPC title
- C08G73/12Primary
Unsaturated polyimide precursors · CPC title
the unsaturated precursors being wholly aromatic · CPC title
Preparatory processes from unsaturated precursors and polyamines · CPC title
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- What does patent US11958940B2 cover?
- Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N′-(phenylene-di-(2,2,-propylidene)-di-p-phenylene) bismaleimide content is 90 area % or less. (In formu…
- Who is the assignee on this patent?
- Nipponkayaku Kk, Nippon Kayaku Kk
- What technology area does this patent fall under?
- Primary CPC classification C08G73/128. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).