Modular automated test system

Patent metadata

Field	Value
Publication number	US-11953519-B2
Application number	US-202017077834-A
Country	US
Kind code	B2
Filing date	Oct 22, 2020
Priority date	Oct 22, 2020
Publication date	Apr 9, 2024
Grant date	Apr 9, 2024

Abstract

An example test system includes packs. The packs include test sockets for testing devices under test (DUTs) and at least some test electronics for performing tests on the DUTs in the test sockets. Different packs are configured to have different configurations. The different configurations include at least different numbers of test sockets arranged at different pitches.

First claim

What is claimed is:

1. A test system comprising:
packs, each pack comprising:
test sockets for testing devices under test (DUTs); and
at least some test electronics for performing tests on the DUTs in the test sockets, the test electronics being different from the DUTs;
where the at least some test electronics comprises at least one of: pin electronics, a parametric measurement unit, logic circuitry, or a processing device, and
where different packs are configured to have different configurations, the different configurations comprising at least different numbers of test sockets arranged at different pitches.

2. The test system of claim 1 , further comprising:
pick-and-place automation configured to move the DUTs into and out of the test sockets, the pick-and-place automation being configured at least to service the packs having different configurations.

3. The test system of claim 2 , wherein the pick-and-place automation is configurable to transport different types of DUTs.

4. The test system of claim 2 , wherein the pick-and-place automation is configurable based on test time and throughput.

5. The test system of claim 2 , wherein each of the packs is modular and can be moved into and out of the test system during operation of the pick-and-place automation on test sockets contained on a different pack.

6. The test system of claim 1 , wherein a pack comprises one or more rows, each row containing one or more test sockets; and
wherein each test socket is associated with an actuator to place a lid over the test socket or to remove the lid from the test socket.

7. The test system of claim 1 , wherein a pack comprises multiple rows, at least two of the rows being configurable to hold different types of DUTs; and
wherein the pack is configured to test the different types of DUTs.

8. A test system comprising:
packs comprising:
test sockets for testing devices under test (DUTs); and
at least some test electronics for performing tests on the DUTs in the test sockets, where different packs are configured to have different configurations, the different configurations comprising at least different numbers of test sockets arranged at different pitches;

a cool atrium that houses the test sockets and that is supplied with cooled air; and
a warm atrium arranged to receive air from the cool atrium that has been warmed as a result of testing the DUTs.

9. The test system of claim 8 , wherein the warm atrium is one of multiple warm atriums, each warm atrium being for a different pack.

10. The test system of claim 8 , further comprising:
an air-to-liquid heat exchanger to produce the cooled air from circulated warm air from the warm atrium; and
one or more fans to move the cooled air into the cool atrium.

11. A test system comprising:
packs comprising:
test sockets for testing devices under test (DUTs); and
at least some test electronics for performing tests on the DUTs in the test sockets, where different packs are configured to have different configurations, the different configurations comprising at least different numbers of test sockets arranged at different pitches;

an ionized air supply; and
one or more fans to move ionized air from the ionized air supply over at least some of the test sockets.

12. The test system of claim 1 , further comprising:
a thermal control system to independently and asynchronously control a temperature of individual test sockets.

13. The test system of claim 1 , further comprising:
pick-and-place automation configured to move the DUTs into and out of the test sockets, the pick-and-place automation being configured at least to service the different configurations of the packs,
wherein the pick-and-place automation system comprises:
pickers for picking DUTs from the test sockets or placing the DUTs in the test sockets; and
a gantry on which the pickers are mounted, the gantry being configured to move the pickers relative to the test sockets to position the pickers for picking the DUTs from the test sockets or placing the DUTs into the test sockets.

14. The test system of claim 13 , wherein the pickers are operable independently and simultaneously.

15. The test system of claim 13 , wherein the pickers and the gantry comprise robotics for the test system arranged in a layer above the test sockets.

16. The test system of claim 13 , wherein the pickers and gantry comprise the only robotics for the test system that are arranged in a layer above the test sockets.

17. The test system of claim 13 , further comprising:
trays comprising cells for holding at least one of DUTs to be tested or DUTs that have been tested;
wherein the pickers are configured to pick the DUTs to be tested from the trays and to place the DUTs to be tested in the test sockets, and to pick the DUTs that have been tested from the test sockets and to place the DUTs that have been tested into the trays.

18. The test system of claim 13 , further comprising:
a housing in which the pickers and the gantry are mounted and in which the packs are held, a pack being movable into or out of the housing during operation of the pick-and-place automation on a different one of the packs.

19. The test system of claim 13 , wherein the pickers are operable independently in four degrees of freedom.

20. The test system of claim 1 , wherein testing performed on the DUTs comprises system-level tests.

21. The test system of claim 8 , wherein a first one of the packs comprises one or more test sockets and a second one of the packs comprises two or more test sockets.

22. The test system of claim 1 , wherein the different configurations accommodate different types of DUTs in the test system at a same time.

23. The test system of claim 1 , wherein the different configurations support different types of DUTs having different form factors in the test system at a same time.

24. The test system of claim 1 , wherein the different configurations support different types of DUTs having different electrical interfaces in the test system at a same time.

25. The test system of claim 1 , wherein the different configurations support different types of DUTs having different thermal requirements in the test system at a same time.

26. The test system of claim 1 , wherein the different configurations support different types of DUTs having different physical interfaces in the test system at a same time.

27. The test system of claim 1 , wherein the different configurations support different types of DUTs having different wireless functionalities in the test system at a same time.

28. The test system of claim 1 , wherein the different configurations support different types of DUTs having different electro-mechanical interfaces in the test system at a same time.

Assignees

• Teradyne Inc

Inventors

• Bruno Christopher James
• Campbell Philip Luke
• Khalid Adnan
• Polyakov Evgeny
• Toscano John Patrick

Classifications

• G01R1/0458 Primary

  related to environmental aspects, e.g. temperature · CPC title

• G01R1/045

  Sockets or component fixtures for RF or HF testing · CPC title

• G01R31/2893

  Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00) · CPC title

• G01R31/2863 Primary

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R31/2886

  Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06) · CPC title