Electronic assembly test system

Patent metadata

Field	Value
Publication number	US-9459312-B2
Application number	US-201313860423-A
Country	US
Kind code	B2
Filing date	Apr 10, 2013
Priority date	Apr 10, 2013
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

An example system for testing electronic assemblies (EAs) may include carriers for holding EAs and slots for testing at least some of the EAs in parallel. Each slot may be configured to receive a corresponding carrier containing an EA and to test the EA. An example carrier in the system may include a first part and a second part. At least one of the first part and the second part include a first structure, and the first structure is movable to enable electrical connection between an EA and an electrical connector.

First claim

What is claimed is:

1. A system for testing electronic assemblies (EAs) comprising:
carriers for holding EAs; and
slots for testing at least some of the EAs in parallel, each slot being configured to receive a corresponding carrier containing an EA and to test the EA;
wherein a carrier comprises a first part and a second part, at least one of the first part or the second part comprising a first structure;
wherein the first structure is movable to enable electrical connection between the EA and an electrical interface; and
wherein the first part is configured to move towards the second part to enclose the EA in the carrier and to cause the electrical connection between the EA and the electrical interface through the first structure, wherein motion of the first part towards the second part comprises a first motion in which the first part moves angularly relative to a surface of the EA until the first part is substantially parallel to the second part and separated from the second part, and a second motion in which the first part moves towards the EA in a direction that is substantially perpendicular to a surface of the EA.

2. The system of claim 1 , wherein at least one of the first part or the second part comprises a second structure, and
wherein the second structure is moveable to enable electrical connection between the EA and a second electrical interface.

3. The system of claim 1 , wherein the first part comprises a frame that is connected to a hinge, the first motion being a pivot about the hinge.

4. The system of claim 1 , further comprising:
guides between the first part and the second part;
wherein, in a first position, the guides separate the first part from the second part so that the first part and the second part are substantially parallel to each other; and
wherein, in a second position, the guides are moved within at least one of the first part or the second part so that the first part and the second part move closer together.

5. The system of claim 1 , wherein the EA has localized heat sources; and
wherein at least one of the first part or the second part comprises:
thermally-conductive objects at locations corresponding to the localized heat sources, the thermally-conductive objects to conduct, convect, or radiate heat from the localized heat sources.

6. The system of claim 5 , wherein the thermally-conductive objects comprise pins that are thermally conductive and that are arranged at a location of the first structure or a second structure that corresponds to a location of the localized heat sources.

7. The system of claim 5 , wherein the thermally-conductive objects comprise fins that are thermally conductive and that are arranged at a location of the first structure or a second structure that corresponds to a location of the localized heat sources.

8. The system of claim 1 , wherein the carrier comprises circuitry configured to emulate a power source that is usable in a product for which the EA is intended.

9. The system of claim 1 , wherein each carrier comprises one or more air pathways, through which air is able to flow through the carrier; and
wherein each slot comprises an air mover for blowing air through the slot and through air pathways in a carrier in the slot.

10. The system of claim 9 , wherein the air is below 25° C.

11. The system of claim 9 , wherein the air is above 25° C.

12. The system of claim 1 , wherein the first structure comprises:
first pins that can pass through the first structure; and
a third structure comprising circuit traces, the first pins for effecting electrical connection between the EA and the circuit traces on the third structure.

13. The system of claim 12 , wherein the first part comprises the first structure and the second part comprises a second structure,
wherein the second structure is moveable to enable electrical connection with an electrical interface; and
wherein the second part comprises:
second pins that can pass through the second structure; and
a fourth structure comprising circuit traces, the second pins for effecting electrical connection between the EA and the circuit traces on the fourth structure.

14. The system of claim 1 , wherein the system comprises a heat source for providing heat to an interior of the carrier.

15. The system of claim 1 , further comprising:
radio frequency (RF) shielding for each carrier.

16. The system of claim 1 , further comprising:
automation to move the carriers into, and out of, the slots during a testing process.

17. The system of claim 16 , wherein the automation comprises:
a device transporter to move carriers between a shuttle and slots;
a feeder to provide carriers containing untested EAs and to receive carriers containing tested EAs; and
the shuttle to receive a carrier containing an untested EA from the feeder and to provide the carrier containing the untested EA to the device transporter, and to receive a carrier containing a tested EA from the device transporter and to provide the carrier containing the tested EA to the feeder.

18. The system of claim 1 , wherein at least some of the slots comprise a pack for receiving corresponding carriers, a carrier and a pack each having beveled edges that are configured to interact to force motion of the first structure.

19. The system of claim 1 , wherein the carrier comprises:
a first interior region that includes the EA;
a second interior region;
RF shielding material between the first interior region and the second interior region;
an antenna for communicating with an RF test system; and
RF control circuitry, which is communicatively coupled to the EA and the antenna, to enable wireless RF testing of the EA.

20. The system of claim 1 , wherein the carrier comprises a cable having RF shielding that is in electrical communication with the EA for wired RF testing of the EA.

21. A method for use in a system comprising:
carriers for holding EAs; and
slots for testing at least some of the EAs in parallel, each slot being configured to receive a corresponding carrier containing an EA and to test the EA;
wherein a carrier comprises:
a first part and a second part;
wherein at least one of the first part or the second part is configured to enable electrical connection between an EA and an electrical interface;

wherein method comprises:
moving the first part away from the second part, wherein moving the first part away from the second part comprises a first motion in which the first part moves away from the second part in a direction that is substantially perpendicular to a surface of the second part;
moving the first part to expose an area for receiving an EA, wherein moving the first part to expose the area comprises a second motion in which the first part moves angularly relative to a surface of the second part;
inserting an EA into the area; and
moving the first part towards the second part so as to contact the EA and thereby enclose the EA in the carrier and cause an electrical connection between the EA and the electrical interface, wherein motion of the first part towards the second part comprises a third motion in which the first part moves angularly relative to a surface of the EA until the first part is substantially parallel to the second part and separated from the second part, and a fourth motion in which the first part moves towards the EA in a direction that is substantially perpendicular to the surface of the EA.

Assignees

• Teradyne Inc

Inventors

• Arena John Joseph
• Suto Anthony J

Classifications

• G01R1/18

  Screening arrangements against electric or magnetic fields, e.g. against earth's field · CPC title

• G01R31/2808 Primary

  Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards (probe, multiprobe, probe manipulator or probe fixture G01R1/067) · CPC title