Large radius probe

US11953517B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11953517-B2
Application numberUS-202217948743-A
CountryUS
Kind codeB2
Filing dateSep 20, 2022
Priority dateMar 26, 2018
Publication dateApr 9, 2024
Grant dateApr 9, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A large radius probe for a surface analysis instrument such as an atomic force microscope (AFM). The probe is microfabricated to have a tip with a hemispherical distal end or apex. The radius of the apex is the range of about a micron making the probes particularly useful for nanoindentation analyses, but other applications are contemplated. In particular, tips with aspect ratios greater than 2:1 can be made for imaging, for example, semiconductor samples. The processes of the preferred embodiments allow such large radius probes to be batch fabricated to facilitate cost and robustness.

First claim

Opening claim text (preview).

What is claimed is: 1. An AFM probe microfabricated by a process comprising the steps of: providing a substrate; forming an array of cylindrical posts from the substrate; depositing tip material on the posts so as to create a hemispherical cap on each post; removing the tip material around the cap to form a tip wherein the hemispherical cap has a radius greater than ¼ μm; and forming a cantilever for each cap, wherein the tip is a high aspect ratio tip with a height to width ratio of at least 2:1. 2. The probe of claim 1 , wherein the forming step includes patterning an array of cylindrical photoresist features on the substrate, etching the substrate using the array of cylindrical photoresist features as a mask and then removing the photoresist features so as to reveal the array of posts. 3. The probe of claim 2 , wherein the posts are substantially cylindrical with or without a pointed apex, and further comprising narrowing a width of the posts. 4. The probe of claim 3 , wherein the narrowing step includes isotropically etching the posts or consuming the post material by oxidation and etch. 5. The probe of claim 2 , wherein parameters of the substrate etch are selected so as to form the posts with a flared base. 6. The probe of claim 1 , wherein the cap defines a tip of the probe, and a radius of the tip is at least ¼ micron. 7. The probe of claim 1 , wherein the aspect ratio is greater than 4:1. 8. The probe of claim 1 , wherein the tip material is any material that can be conformally deposited. 9. The probe of claim 8 , wherein the tip material is silicon nitride. 10. The probe of claim 1 , wherein the depositing step is LPCVD. 11. The probe of claim 1 , wherein the substrate is a silicon wafer. 12. The probe of claim 1 , wherein the cantilever is formed either from the tip material itself or from the silicon material underneath the cap. 13. The probe of claim 1 , wherein the tips are tilted to accommodate mounting the probe in the surface analysis instrument. 14. The probe of claim 1 , wherein the removing step includes leaving a portion of the tip material so as to form a base between the cantilevers and the caps.

Assignees

Inventors

Classifications

  • G01Q60/38Primary

    Probes, their manufacture, or their related instrumentation, e.g. holders · CPC title

  • by cleaning or etching · CPC title

  • Silicon nitride · CPC title

  • characterised by the method of coating (C23C16/04 takes precedence) · CPC title

  • After-treatment · CPC title

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Frequently asked questions

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What does patent US11953517B2 cover?
A large radius probe for a surface analysis instrument such as an atomic force microscope (AFM). The probe is microfabricated to have a tip with a hemispherical distal end or apex. The radius of the apex is the range of about a micron making the probes particularly useful for nanoindentation analyses, but other applications are contemplated. In particular, tips with aspect ratios greater than 2…
Who is the assignee on this patent?
Bruker Nano Inc
What technology area does this patent fall under?
Primary CPC classification G01Q60/38. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).