Feedthrough system

Patent metadata

Field	Value
Publication number	US-11944830-B2
Application number	US-202117240430-A
Country	US
Kind code	B2
Filing date	Apr 26, 2021
Priority date	Apr 28, 2020
Publication date	Apr 2, 2024
Grant date	Apr 2, 2024

Abstract

One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.

First claim

The invention claimed is:

1. A feedthrough system comprising:
a) a feedthrough comprising
i) an insulating body,
ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body,

b) an electrical contact element comprising a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, and wherein the electrical contact element is configured for connecting a wire to the electrically conductive pathway of the feedthrough.

2. The feedthrough system according to claim 1 , wherein the insulating body is a multi-layer ceramic body.

3. The feedthrough system according to claim 1 , wherein the electrically conductive pathway is a cermet pathway, and optionally wherein the cermet pathway comprises one or both of:
(i) a metal selected from the group consisting of platinum, gold, iridium, niobium, molybdenum, titanium, cobalt, zirconium, chromium, tantalum, tungsten, and alloys of each one of these metals, and preferably the metal is platinum or a platinum alloy, and
(ii) a ceramic component selected from the group consisting of aluminum oxide, magnesium oxide, silicon oxide, zirconium dioxide, zirconium oxide-toughened aluminum oxide, yttrium-toughened zirconium oxide, aluminum nitride, piezoceramic materials, barium(Zr, Ti) oxide, barium(CE, Ti) oxide, and sodium-potassium-niobate, and preferably the ceramic component is aluminum oxide.

4. The feedthrough system according to claim 1 , wherein the electrical contact element comprises a biocompatible metal,
preferably selected from the group consisting of platinum, gold, iridium, steel, titanium, hafnium, niobium, tantalum, cobalt, chromium, zirconium, rhenium, tungsten, molybdenum, and alloys of each one of these metals, and mixtures thereof,
and more preferably from the group consisting of platinum and platinum/iridium alloys.

5. The feedthrough system according to claim 1 , wherein the electrical contact element comprises a first component consisting of a first metal, and second component consisting of a second metal being different to the first metal,
wherein the first component is attached to attached to the electrically conductive feedthrough, and
wherein the second component is attached to the first component.

6. The feedthrough system according to claim 1 , wherein the electrical contact element has the three dimensional form of a hollow body, preferably the form of a blind hole or a through hole, and optionally wherein the hollow body comprises on its inner surface a fixing element.

7. The feedthrough system according to claim 1 , wherein the electrical contact element has a height of in the range of from 10 μm to 5 mm, and optionally wherein the electrical contact element has a width in the range of from 10 μm to 10 mm.

8. The feedthrough system according to claim 1 , wherein the electrical contact element and the joint microstructure is obtained by a metal additive manufacturing process, and optionally wherein the metal additive manufacturing process is a selective laser melting process.

9. The feedthrough system according to claim 1 , wherein the feedthrough system is a feedthrough system for an implantable medical device.

10. The feedthrough system according to claim 1 , wherein the electrical contact element is suitable for connecting a wire to the electrically conductive pathway of the feedthrough by brazing, soldering or melting the wire to the contact element.

11. A feedthrough system comprising:
a) a feedthrough comprising
i) an insulating body,
ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body,
iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway,

b) an electrical contact element comprising a metal, wherein the electrical contact element is attached to the electrically conductive pad by a joint microstructure, and wherein the electrical contact element is configured for connecting a wire to the electrically conductive pathway of the feedthrough.

12. The feedthrough system according to claim 11 , wherein the insulating body is a multi-layer ceramic body.

13. The feedthrough system according to claim 11 , wherein the electrically conductive pathway is a cermet pathway, and optionally wherein the cermet pathway comprises one or more of:
(i) a metal selected from the group consisting of platinum, gold, iridium, niobium, molybdenum, titanium, cobalt, zirconium, chromium, tantalum, tungsten, and alloys of each one of these metals, and preferably the metal is platinum or a platinum alloy, and
(ii) a ceramic component selected from the group consisting of aluminum oxide, magnesium oxide, silicon oxide, zirconium dioxide, zirconium oxide-toughened aluminum oxide, yttrium-toughened zirconium oxide, aluminum nitride, piezoceramic materials, barium(Zr, Ti) oxide, barium(CE, Ti) oxide, and sodium-potassium-niobate, and preferably the ceramic component is aluminum oxide.

14. The feedthrough system according to claim 11 , wherein the electrical contact element comprises a biocompatible metal,
preferably selected from the group consisting of platinum, gold, iridium, steel, titanium, hafnium, niobium, tantalum, cobalt, chromium, zirconium, rhenium, tungsten, molybdenum, and alloys of each one of these metals, and mixtures thereof,
and more preferably from the group consisting of platinum and platinum/iridium alloys.

15. The feedthrough system according to claim 11 , wherein the electrical contact element comprises a first component consisting of a first metal, and second component consisting of a second metal being different to the first metal,
wherein the first component is attached to electrically conductive pad, and
wherein the second component is attached to the first component.

16. The feedthrough system according to claim 11 , wherein the electrical contact element has the three dimensional form of a hollow body, preferably the form of a blind hole or a through hole, and optionally wherein the hollow body comprises on its inner surface a fixing element.

17. The feedthrough system according to claim 11 , wherein the electrical contact element has a height of in the range of from 10 μm to 5 mm, and optionally wherein the electrical contact element has a width in the range of from 10 μm to 10 mm.

18. The feedthrough system according to claim 11 , wherein the electrically conductive pad is a cermet pad.

19. The feedthrough system according to claim 11 , wherein the electrically conductive pad has a first component being a cermet pad and a second component being a metal pad, wherein the first component is attached to the electrically conductive pathway, and wherein at least the second component is attached to the electrical contact element.

20. The feedthrough system according to claim 11 , wherein the electrical contact element is suitable for connecting a wire to the electrically conductive pathway of the feedthrough by brazing, soldering or melting the wire to the contact element.

Assignees

• Heraeus Deutschland Gmbh & Co Kg
• Heraeus Additive Mfg Gmbh

Inventors

• Kilic Beytullah Yasin
• Wilhelm Leoni
• Fischer Jakob
• Trötzschel Jens

Classifications

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• H01B17/303

  Sealing of leads to lead-through insulators · CPC title

• H01R13/5224

  for medical use · CPC title

• H01L23/481

  Electricity · mapped topic