Electrical contacting device for an implantable medical device, and method for production

Patent metadata

Field	Value
Publication number	US-2019201699-A1
Application number	US-201816233427-A
Country	US
Kind code	A1
Filing date	Dec 27, 2018
Priority date	Jan 2, 2018
Publication date	Jul 4, 2019
Grant date	—

Abstract

One aspect relates to an electrical contacting device for a medical implantable device, including an electrically insulating base body with a first and a second surface. The base body includes a ceramics, an electrically conductive conducting element that extends from the first surface of the base body through the base body. The conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection, a contact element including a metal. The contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure. The contacting device includes an adhesion element. The adhesion element is connected to the contact element in firmly bonded manner and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.

First claim

What is claimed is:

1 . An electrical contacting device for a medical implantable device, comprising:
an electrically insulating base body with a first and a second surface; wherein the base body includes a ceramics; an electrically conductive conducting element that extends, at least in part, from the first surface of the base body through the base body; wherein the conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection; a contact element including a metal, wherein the contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure; wherein the contacting device comprises an adhesion element, wherein the adhesion element is connected to the contact element in firmly bonded manner; and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.

2 . The electrical contacting device according to claim 1 , wherein the adhesion element comprises a first layer, wherein the first layer includes a metal.

3 . The electrical contacting device according to claim 1 , wherein the adhesion element comprises a first layer, wherein the first layer includes a metal and extends through a second layer to the conducting element, wherein the second layer includes a dielectric material and is connected in firmly bonded manner to at least the first layer and the first surface of the base body.

4 . The electrical contacting device according to claim 1 , wherein the adhesion promoter includes a ceramics, an amorphous glass, a recrystallizable glass or a combination of at least two thereof.

5 . The electrical contacting device according to claim 1 , wherein the first layer includes a cermet.

6 . The electrical contacting device according to claim 4 , wherein the amorphous glass includes at least 45% by weight silicon oxide (SiO 2 ).

7 . The electrical contacting device according to claim 4 , wherein the recrystallizable glass includes at least 25% by weight aluminum oxide (Al 2 O 3 ) and no more than 30% by weight silicon oxide (SiO 2 ).

8 . The electrical contacting device according to claim 1 , wherein the adhesion element and the base body form an oxidic mixed crystal layer.

9 . The electrical contacting device according to claim 1 , wherein the conducting element extends from the first surface of the base body through the base body to the second surface of the base body.

10 . A medical implantable device, comprising a contacting device according to claim 1 .

11 . A cardiac pacemaker, defibrillator, neurostimulator, cochlear implant, glucose monitor or implantable infusion pump comprising an electrical contacting device according to claim 1 .

12 . A method for the production of an electrical contacting device for a medical implantable device, wherein the method comprises:
a. providing an electrically insulating base body having a first and a second surface, wherein the base body comprises a ceramics, and wherein the base body includes an electrically conductive conducting element that extends, at least in part, from the first surface of the base body through the base body, wherein the conducting element includes a cermet and is connected in firmly bonded manner to the ceramics of the base body through a sintered connection; b. generating an adhesion element comprising an adhesion promoter on the base body through a sintering step 1 from an adhesion element precursor while forming a firmly bonded connection at least between the adhesion element and the first surface of the base body; and c. generating a contact element including a metal on the adhesion element through a sintering step 2 from a contact element precursor while forming an electrical connection between the contact element and the conducting element and a firmly bonded connection between the contact element and the adhesion element.

13 . The method according to claim 12 , wherein the adhesion element precursor includes at least one paste 1 , wherein paste 1 includes at least a metal, an adhesion promoter, and a binding agent.

14 . The method according to claim 12 , wherein the adhesion element precursor includes a paste 2 , wherein paste 2 includes at least an adhesion promoter and a binding agent.

15 . The method according to claim 13 , wherein, in sintering step 1 , paste 1 is being applied to the base body and sintered, wherein the adhesion element is formed while forming a firmly bonded connection to the conducting element and to the first surface of the base body.

16 . The method according to claim 14 , wherein, in sintering step 1 , paste 2 is initially applied appropriately to the base body and sintered such that at least a part of an exposed surface of the conducting element is not covered by paste 2 , and subsequently paste 1 is applied onto the sintered paste 2 and sintered, wherein the adhesion element is formed while forming a firmly bonded connection to the conducting element and to the first surface of the base body.

17 . An electrical contacting device for a medical implantable device, obtainable through a method according to claim 12 .

18 . The use of an electrical contacting device according to claim 1 .

Assignees

• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Dittmer Robert
• Hausch Ulrich
• Nikolaidis Ilias
• Trötzschel Jens

Classifications

• A61L27/10

  Ceramics or glasses · CPC title

• H05K5/069

  Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft · CPC title

• A61N1/3752 Primary

  Details of casing-lead connections · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• A61L27/04

  Metals or alloys · CPC title