Electrical bushing with contact element and method for the production

Patent metadata

Field	Value
Publication number	US-10212836-B2
Application number	US-201815875014-A
Country	US
Kind code	B2
Filing date	Jan 19, 2018
Priority date	Jan 23, 2017
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.

First claim

What is claimed is:

1. An electrical bushing for a medically implantable device comprising:
an electrically insulating base body and an electrical conducting element, wherein the conducting element includes a cermet, and wherein the base body and the conducting element are connected by a substance-to-substance sintered bond, so that the conducing element is hermetically sealed against the base body;
the conducting element extending from a first surface of the base body through the base body to a second surface of the base body, wherein the conducting element has a first electrically conductive area within the first surface of the base body and a second electrically conductive area within the second surface of the base body, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, which includes a metal, so that the conducting element can be connected in an electroconductive manner via the contact element;
characterized in that the contact element is an electrochemically created layer, and the contact element has a porous structure, wherein the porosity of the contact element is not more than 20%.

2. The electrical bushing of claim 1 , wherein the contact element completely superimposes the conductive area.

3. The electrical bushing of claim 1 , wherein the amount of the surface of the layer-like contact element is not more than 25% larger than the amount of the surface of the superimposed conductive area.

4. The electrical bushing of claim 1 , wherein the contact element has an average layer thickness of between 1 μm and 50 μm.

5. The electrical bushing of claim 1 , wherein the contact element has a porosity of 0.1 to 10% by volume.

6. The electrical bushing of claim 1 , wherein the contact element has a porosity gradient.

7. The electrical bushing of claim 6 , wherein the average porosity of the area adjacent to the conducting element is lowest and that the average porosity increases as the distance from the area adjacent the conducting element increases.

8. The electrical bushing of claim 1 , wherein the averaged roughness depth Rz of the layer-like contact element is between 0.2 μm and 20 μm.

9. A method for applying contact elements to electrical bushings comprising:
a) providing an electrical bushing, wherein the bushing
i. has an electrically insulating base body and an electrical conducting element, wherein the conducting element includes a cermet,
ii. the base body and the conducting element are connected by a substance-to-substance sintered connection, so that the conducting element is hermetically sealed against the base body,
iii. the conducting element extends from a first surface of the base body through the base body to a second surface of the base body,
iv. the conducting element has a first electrically conductive area within the first surface of the base body and a second electrically conductive area within the second surface of the base body,

b) applying an electroconductive electrode layer to the first surface of the base body, so that a conductive connection is formed between the first conductive area of the conducting element and the electrode layer,
c) introducing the bushing into a metal-electrolyte solution and forming a metallic contact element in the second electrically conductive area of the conducting element by means of electrochemical deposition by reducing cations of the metal-electrolyte solution,
d) removing the electrode layer.

10. The method of claim 9 , wherein an insulating layer, which superimposes the electrode layer, is applied in a further step b-1) after b), so that an electrochemical deposition of a metal does not take place in the area of the electrode layer.

11. The method of claim 9 , wherein the electrical bushing is immersed into an alkaline solution in a further step b-2) prior to carrying out c), whereby the electrode layer is connected to a direct-current source and is connected as a cathode, in order to clean the surfaces of the electrical bushing.

12. The method of claim 11 , wherein the alkaline solution includes sodium hydroxide and/or potassium hydroxide and optionally includes an addition of a cyanide salt.

13. The method of claim 9 , wherein the application of the electrically conductive electrode layer in b) takes place by pressing an electrically conductive polymer against the second surface.

14. The method of claim 9 , wherein the electrode layer is multi-layered, wherein the multi-layer design includes a conductive paste and a conductive film, which superimposes the conductive paste.

15. The method of claim 9 , wherein the current density in response to the electrochemical deposition according to c), based on the surface of the electrically conductive area, is 0.1 to 100 A/dm 2 .

16. The method of claim 9 , wherein the current density in response to the electrochemical deposition according to c), based on the surface of the electrically conductive area, is 0.5 to 30 A/dm2.

17. The method of claim 9 , wherein the current density in response to the electrochemical deposition according to c), based on the surface of the electrically conductive area, is 1 to 15 A/dm2.

18. An electrical bushing for a medically implantable device that is obtained by the method of claim 9 .

Assignees

• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Dittmer Robert
• Krüger Frank

Classifications

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• A61N1/3754

  Feedthroughs · CPC title

• C25D7/00 Primary

  Electroplating characterised by the article coated · CPC title

• H05K5/0247 Primary

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• C25D5/34

  Pretreatment of metallic surfaces to be electroplated · CPC title