Electronic assembly including a compression assembly for cable connector modules

Patent metadata

Field	Value
Publication number	US-11943886-B2
Application number	US-202117509574-A
Country	US
Kind code	B2
Filing date	Oct 25, 2021
Priority date	Nov 11, 2020
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

An electronic assembly includes an electronic package having an integrated circuit component and interposer assemblies with compressible interposer contacts electrically connected thereto. Cable connector modules are coupled to the interposer assemblies. A cover assembly is coupled to the upper surface of the electronic package over the cable connector modules. The cover assembly includes bridge assemblies having plates in a plate stack that are independently movable. A load plate engages upper edges of the plates of the bridge assemblies and press against the plates to drive the bridge assemblies into the cable connector modules using compression hardware. The cable connector modules compress the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.

First claim

What is claimed is:

1. An electronic assembly comprising:
an electronic package including a package substrate having an upper surface and a lower surface, the electronic package including an integrated circuit component electrically connected to the package substrate, the electronic package includes lower package contacts electrically connected to the integrated circuit component and configured to be electrically connected to a host circuit board, the electronic package includes upper package contacts electrically connected to the integrated circuit component;
interposer assemblies electrically connected to the electronic package, each interposer assembly including an array of interposer contacts, the interposer contacts being compressible, each interposer contact having an upper mating interface and a lower mating interface, the lower mating interfaces of the interposer contacts are mated with the corresponding upper package contacts, the interposer assemblies defining separable interfaces with the electronic package;
cable connector modules coupled to the interposer assemblies, each cable connector module including a cable connector housing holding a connector module substrate, wherein the cable connector module is configured to have a cable communicatively coupled to the connector module substrate and extend from the cable connector housing, the connector module substrate having cable connector module contacts, the cable connector module contacts being mated with the upper mating interfaces of the corresponding interposer contacts;
at least one cover assembly coupled to the upper surface of the electronic package, the cover assembly including a cover having a plate and walls extending from the plate to form at least one connector module cavity configured to receive the corresponding cable connector module, the plate including at least one window associated with the at least one connector module cavity, the cover assembly including at least one bridge assembly received in the corresponding connector module cavity and extending through the corresponding window, each bridge assembly having a plurality of plates arranged in a plate stack, the plates including upper edges and lower edges, the lower edges engaging the cable connector module housing; and
a load plate coupled to the cover assembly, the load plate having a bottom surface engaging the upper edges of the plates of the bridge assemblies, wherein the load plate presses against the plates of the bridge assemblies to drive the bridge assemblies into the cable connector modules, the cable connector modules compressing the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.

2. The electronic assembly of claim 1 , wherein the plates of the bridge assemblies are thermally conductive, the plates transferring heat from the cable connector modules to the load plate.

3. The electronic assembly of claim 1 , wherein the load plate is a cold plate having cooling channels, the bridge assemblies being thermally coupled between the cable connector modules and the cold plate.

4. The electronic assembly of claim 3 , wherein the cold plate includes an outer cold plate and an inner cold plate received in the outer cold plate and movable relative to the outer cold plate, the inner cold plate being compressible against the integrated circuit component, the outer cold plate holding the bridge assemblies and being compressible against the cable connector modules.

5. The electronic assembly of claim 4 , wherein the inner cold plate and the outer cold plate have different compressive forces.

6. The electronic assembly of claim 4 , wherein the inner cold plate and the outer cold plate are operable at different temperatures.

7. The electronic assembly of claim 1 , wherein the load plate is a heatsink having heat dissipating fins, the bridge assemblies being thermally coupled between the cable connector modules and the heat sink.

8. The electronic assembly of claim 1 , wherein the cable connector module comprises a cable, the cable being a fiber optic cable, the cable connector module including an optical engine to communicatively couple the fiber optic cable and the connector module substrate.

9. The electronic assembly of claim 1 , wherein the cable connector module comprises a cable, the cable being a copper conductor cable, multiple copper conductor cables being terminated to the connector module substrate.

10. The electronic assembly of claim 1 , wherein each bridge assembly includes a frame holding the corresponding plates in the plate stack, the frame being mounted to the plate of the cover, the plates being movable relative to the frame and the cover.

11. The electronic assembly of claim 1 , further comprising a bolster plate, the electronic package being coupled to the bolster plate, the cover being coupled to the bolster plate by fasteners with the interposer assemblies and the cable connector modules sandwiched between the package substrate and the cover.

12. The electronic assembly of claim 1 , wherein the interposer contacts include conductive polymer contacts held in the array by a support plate, the upper mating interfaces be located above the support plate, the lower mating interfaces being located below the support plate.

13. The electronic assembly of claim 1 , wherein the upper mating interfaces are compressible and the lower mating interfaces are compressible, the compression forces being transferred to the interposer contacts from the load plate through the bridge assemblies and the cable connector modules.

14. The electronic assembly of claim 1 , wherein the interposer assembly includes an interposer frame holding a support plate, the support plate holding the interposer contacts in the array, the interposer frame including lower locating pins engaging the package substrate to locate the interposer assembly relative to the upper package contacts, the interposer frame including upper locating features engaging the cable connector module to locate the cable connector module relative to the interposer contacts.

15. The electronic assembly of claim 14 , wherein the upper locating features include locating walls, the cable connector housing including locating slots receiving the locating walls to position the cable connector module in the interposer frame.

16. The electronic assembly of claim 1 , wherein the package substrate includes edges around a perimeter of the package substrate, the package substrate including mounting areas between the integrated circuit component and the edges, each mounting area receiving one of the cover assemblies, each cover assembly receiving a plurality of the cable connector modules and a plurality of the interposer assemblies, the load plate engaging each of the cover assemblies.

17. The electronic assembly of claim 1 , wherein each cover includes multiple cable contact cavities and holds multiple bridge assemblies for mating with multiple interposer assemblies.

18. The electronic assembly of claim 1 , wherein the plates of the bridge assembly include upper plates and lower plates movable relative to each other.

19. A compression assembly for an electronic package of a communication system, the compression assembly comprising:
at least one cover assembly configured to be coupled to an upper surface of the electronic package over interposer assemblies and cable connector modules coupled to the upper surface of the electronic package, each cover assembly including a cover having a pla

Assignees

• TE Connectivity Services Gmbh
• Te Connectivity Solutions Gmbh

Inventors

• Blackburn Christopher William
• Costello Brian Patrick
• Sharf Alex Michael

Classifications

• H05K7/1084 Primary

  pin grid array package carriers · CPC title

• H01R12/52

  connecting to other rigid printed circuits or like structures · CPC title

• H01R13/11

  Resilient sockets (carrying separate resilient parts H01R13/15) · CPC title

• H01R13/24

  resilient; resiliently-mounted · CPC title

• H05K3/368

  parallel to each other (H05K3/361 takes precedence) · CPC title