Radio frequency silicon on insulator structure with superior performance, stability, and manufacturability

Patent metadata

Field	Value
Publication number	US-11942360-B2
Application number	US-202318182823-A
Country	US
Kind code	B2
Filing date	Mar 13, 2023
Priority date	Jul 13, 2018
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

A semiconductor-on-insulator (e.g., silicon-on-insulator) structure having superior radio frequency device performance, and a method of preparing such a structure, is provided by utilizing a single crystal silicon handle wafer sliced from a float zone grown single crystal silicon ingot.

First claim

What is claimed is:

1. A method of preparing a multilayer structure, the method comprising:
providing a single crystal semiconductor handle substrate comprising two major, generally parallel surfaces, one of which is a front surface of the single crystal semiconductor handle substrate and the other of which is a back surface of the single crystal semiconductor handle substrate, a circumferential edge joining the front and back surfaces of the single crystal semiconductor handle substrate, and a central plane of the single crystal semiconductor handle substrate between the front and back surfaces of the single crystal semiconductor handle substrate, wherein the single crystal semiconductor handle substrate has a bulk resistivity of at least about 5000 ohm-cm, an interstitial oxygen concentration of less than about 1×10 16 atoms/cm 3 , a nitrogen concentration of at least about 1×10 13 atoms/cm 3 , and an excess thermal donor concentration of less than 1×10 11 donors/cm 3 ;
depositing a trap rich layer on the front surface of the single crystal semiconductor handle substrate;
bonding a front surface of a single crystal semiconductor donor substrate to the trap rich layer to thereby form a bonded structure, wherein the single crystal semiconductor donor substrate comprises two major, generally parallel surfaces, one of which is the front surface of the semiconductor donor substrate and the other of which is a back surface of the semiconductor donor substrate, a circumferential edge joining the front and back surfaces of the semiconductor donor substrate, and a central plane between the front and back surfaces of the semiconductor donor substrate; and
annealing the bonded structure.

2. The method of claim 1 , wherein the annealing the bonded structure is performed at a temperature between 200° C. and 400° C.

3. The method of claim 1 , wherein the annealing the bonded structure is performed at a pressure between 0.5 MPa and 200 MPa and a temperature between 300° C. and 700° C.

4. The method of claim 1 , further comprising:
forming a dielectric layer on the trap rich layer;
bonding the front surface of the single crystal semiconductor donor substrate to the dielectric layer to thereby form the bonded structure; and
annealing the bonded structure.

5. The method of claim 1 , wherein the single crystal semiconductor donor substrate comprises a dielectric layer in interfacial contact with the front surface of the single crystal semiconductor donor substrate, the method further comprising:
bonding the dielectric layer of the single crystal semiconductor donor substrate to the trap rich layer to thereby form the bonded structure; and
annealing the bonded structure.

6. The method of claim 1 , wherein the single crystal semiconductor donor substrate comprises a donor cleave plane, wherein the annealing the bonded structure is performed at a temperature and for a duration sufficient to thermally activate the donor cleave plane.

7. The method of claim 6 , further comprising cleaving the bonded structure at the thermally activated donor cleave plane to thereby prepare a cleaved structure comprising the single crystal semiconductor handle substrate, the trap rich layer, and a single crystal semiconductor device layer.

8. The method of claim 7 , further comprising annealing the cleaved structure.

9. The method of claim 8 , wherein the annealing the cleaved structure is performed at a temperature between 1000° C. and 1200° C.

10. The method of claim 7 , further comprising depositing an epitaxial layer on the single crystal semiconductor device layer of the cleaved structure.

11. The method of claim 10 , wherein the epitaxial layer comprises a material selected from a group consisting of silicon, silicon carbide, silicon germanium, gallium arsenide, gallium nitride, indium phosphide, indium gallium arsenide, germanium, and combinations thereof.

12. The method of claim 10 , wherein the epitaxial layer comprises at least one electrically active dopant selected from a group consisting of boron, gallium, aluminum, indium, phosphorus, antimony, and arsenic.

13. The method of claim 10 , wherein the epitaxial layer has a resistivity of from 1 to 1050 Ohm-cm.

14. The method of claim 1 wherein the single crystal semiconductor handle substrate has a bulk resistivity of at least about 10,000 ohm-cm.

15. The method of claim 1 wherein the single crystal semiconductor handle substrate has the excess thermal donor concentration of less than 5×10 10 donors/cm 3 .

16. The method of claim 1 wherein the single crystal semiconductor handle substrate comprises a p-type dopant at a concentration of less than 1×10 12 atoms/cm 3 and further wherein a concentration of oxygen thermal double donors, new donors, and excess thermal donors, or any combination thereof is at least an order of magnitude less than the concentration of the p-type dopant.

17. The method of claim 1 wherein the single crystal semiconductor handle substrate comprises a p-type dopant at a concentration of less than 1×10 11 atoms/cm 3 and further wherein a concentration of oxygen thermal double donors, new donors, and excess thermal donors, or any combination thereof is at least an order of magnitude less than the concentration of the p-type dopant.

18. The method of claim 1 wherein the single crystal semiconductor handle substrate comprises an n-type dopant at a concentration of less than 1×10 12 atoms/cm 3 and further wherein a concentration of oxygen thermal double donors, new donors, and excess thermal donors, or any combination thereof is at least an order of magnitude less than the concentration of the n-type dopant.

19. The method of claim 1 wherein the single crystal semiconductor handle substrate comprises an n-type dopant at a concentration of less than 1×10 11 atoms/cm 3 and further wherein a concentration of oxygen thermal double donors, new donors, and excess thermal donors, or any combination thereof is at least an order of magnitude less than the concentration of the n-type dopant.

20. The method of claim 1 wherein the single crystal semiconductor handle substrate has the interstitial oxygen concentration of less than about 1×10 15 atoms/cm 3 .

21. The method of claim 1 wherein the single crystal semiconductor handle substrate has the nitrogen concentration of at least about 1×10 14 atoms/cm 3 .

22. The method of claim 1 wherein the single crystal semiconductor handle substrate has the nitrogen concentration of less than about 3×10 15 atoms/cm 3 .

23. The method of claim 1 wherein the single crystal semiconductor handle substrate has the nitrogen concentration of less than about 1×10 15 atoms/cm 3 .

24. The method of claim 1 wherein the single crystal semiconductor handle substrate has the nitrogen concentration of less than about 7×10 14 atoms/cm 3 .

25. The method of claim 1 wherein the single crystal semiconductor handle substrate has the nitrogen concentration between about 5×10 14 atoms/cm 3 and about 2×10 15 atoms/cm 3 .

26. The method of claim 1 wherein the trap rich layer comprises one or more polycrystalline semiconductor layers, wherein each of the one or more polycrystalline semiconductor layers comprises a material selected from a group consisting of silicon, SiGe, SiC, and Ge.

27. The method of claim 1 wherein the trap rich layer comprises one or more amorphous semiconductor layers, wherein each

Assignees

• Globalwafers Co Ltd

Inventors

• Seacrist Michael R
• Standley Robert W
• Libbert Jeffrey L
• Sreedharamurthy Hariprasad
• Jensen Leif

Classifications

• H10P90/1914

  using bonding · CPC title

• H10P36/07

  of silicon-on-insulator structures · CPC title

• H10W10/181

  Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers · CPC title

• H10W44/241

  for passive devices or passive elements · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title