Methods and apparatus for obtaining diagnostic information relating to an industrial process

US11940740B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11940740-B2
Application numberUS-202217836099-A
CountryUS
Kind codeB2
Filing dateJun 9, 2022
Priority dateOct 2, 2013
Publication dateMar 26, 2024
Grant dateMar 26, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method comprising: obtaining measurement data of a substrate; obtaining a plurality of fingerprint components from historic measurement data comprising values of a parameter measured at a plurality of positions on from previous substrates similar to the substrate; determining a linear combination of the fingerprint components that fits the measurement data best; reconstructing, by a hardware computer, a fingerprint of the parameter across the substrate based on the determined linear combination; and based on the reconstructed fingerprint associated with the substrate information, outputting electronic data for configuration or modification of an industrial process or of a measurement process of substrates subjected to the industrial process. 2. The method of claim 1 , wherein the measurement data is based on a sparse sampling scheme in comparison to a sampling scheme used in obtaining the historic measurement data. 3. The method of claim 1 , wherein the measurement data is one or more selected from: critical dimension data, overlay data, focus data or other monitoring data associated with a process used in patterning the substrate and previous substrates. 4. The method of claim 1 , wherein the plurality of fingerprints components are obtained using a method of multivariate analysis applied to the historic measurement data. 5. The method of claim 4 , wherein the multivariate analysis is based on Principal Component Analysis (PCA). 6. The method of claim 1 , wherein the plurality of fingerprint components are stored in a library. 7. The method of claim 6 , wherein the library further comprises context data associated with the previous substrates. 8. The method of claim 7 , wherein the determining of the linear combination of the fingerprints components is further based on context data associated with the substrate to ensure that a relevant subset of fingerprint components is selected. 9. The method of claim 1 , wherein the determining of the linear combination of the fingerprints components is further based on selecting only fingerprint components having a coefficient surpassing a level associated with a mere introduction of noise. 10. The method of claim 1 , further comprising decomposing the measurement data into a vector within a basis of at least a subset of the plurality of fingerprint components. 11. The method of claim 10 , wherein the decomposing uses a method of Principal Component Analysis (PCA). 12. The method of claim 1 , further comprising using the reconstructed fingerprint for monitoring and/or correcting a process. 13. The method of claim 1 , further comprising smoothing the reconstructed fingerprint. 14. A computer program product comprising a non-transitory computer-readable medium having instructions therein, the instructions, when executed, configured to cause a computer system to at least: obtain measurement data of a substrate; obtain a plurality of fingerprint components from historic measurement data comprising values of a parameter measured at a plurality of positions on from previous substrates similar to the substrate; determine a linear combination of the fingerprint components that fits the measurement data best; reconstruct a fingerprint of the parameter across associated with the substrate based on the determined linear combination; and based on the reconstructed fingerprint associated with the substrate information, output electronic data for configuration or modification of an industrial process or of a measurement process of substrates subjected to the industrial process. 15. The computer program product of claim 14 , wherein the plurality of fingerprint components are stored in a library. 16. The computer program product of claim 15 , wherein the library further comprises context data associated with the previous substrates. 17. The computer program product of claim 16 , wherein the instructions configured to cause the computer system to determine the linear combination of the fingerprints components are further configured to cause the computer system to select, based on context data associated with the substrate, a relevant subset of fingerprint components. 18. The computer program product of claim 14 , wherein the plurality of fingerprints components are obtained using a method of multivariate analysis applied to the historic measurement data. 19. The computer program product of claim 18 , wherein the multivariate analysis is based on Principal Component Analysis (PCA). 20. The computer program product of claim 14 , wherein the instructions configured to cause the computer system to determine the linear combination of the fingerprints components are further configured to cause the computer system to select only fingerprint components having a coefficient surpassing a level associated with a mere introduction of noise.

Assignees

Inventors

Classifications

  • Signal processing · CPC title

  • Visual data mining; Browsing structured data · CPC title

  • Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis · CPC title

  • Focus · CPC title

  • Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching · CPC title

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What does patent US11940740B2 cover?
In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each uni…
Who is the assignee on this patent?
Asml Netherlands Bv
What technology area does this patent fall under?
Primary CPC classification G03F7/706837. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 26 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).