Molecular resist composition and patterning process

US11940728B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11940728-B2
Application numberUS-202117484333-A
CountryUS
Kind codeB2
Filing dateSep 24, 2021
Priority dateSep 28, 2020
Publication dateMar 26, 2024
Grant dateMar 26, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A molecular resist composition and a pattern forming process. A molecular resist composition comprising a sulfonium salt having a cation of specific structure and an organic solvent has a high sensitivity and forms a resist film with improved resolution and LWR, when processed by EB or EUV lithography. The molecular resist composition does not contain a base polymer. The molecular resist composition comprising a sulfonium salt having a cation of specific partial structure has a high sensitivity and forms a resist film with improved resolution and LWR, so that the resist composition is quite useful for precise micropatterning.

First claim

Opening claim text (preview).

The invention claimed is: 1. A molecular resist composition comprising a sulfonium salt having the formula (1) and an organic solvent, wherein the molecular resist composition does not contain a base polymer, wherein Ar 1 , Ar 2 and Ar 3 are each independently a C 6 -C 20 aryl group in which some or all of the hydrogen atoms on its aromatic ring may be substituted by halogen or a C 1 -C 20 hydrocarbyl group which may contain a heteroatom, at least one of Ar 1 , Ar 2 and Ar 3 is substituted with a group having the formula (1a), (1b) or (1c), any two of Ar 1 , Ar 2 and Ar 3 may bond together to form a ring with the sulfur atom to which they are attached, wherein R a1 , R a2 and R a3 are each independently hydrogen or a C 1 -C 10 hydrocarbyl group; R b1 , R b2 and R b3 are each independently a C 1 -C 10 hydrocarbyl group, R b1 and R b2 may bond together to form a ring with the carbon atom to which they are attached; R c1 and R c2 are each independently hydrogen or a C 1 -C 10 hydrocarbyl group, R c3 , R c4 and R c5 are each independently a C 1 -C 10 hydrocarbyl group, R c3 and R c4 may bond together to form a ring with the carbon atom to which they are attached; the broken line designates a valence bond, and X − is an anion, exclusive of a halide ion, BF 4 − , PF 6 − , SbF 6 − and anions having the following formulae (ex1) to (ex4): wherein R ex1 is halogen or a C 1 -C 40 hydrocarbyl group which may contain a heteroatom; R ex2 , R ex3 , R ex4 , R ex5 and R ex6 are each independently fluorine or a C 1 -C 40 hydrocarbyl group which may contain a heteroatom, R ex2 and R ex3 may bond together to form a ring with the carbon atoms to which they are attached and intervening atoms, R ex4 and R ex5 may bond together to form a ring with the carbon atoms to which they are attached and intervening atoms; R ex7 is halogen, hydroxy or a C 1 -C 40 hydrocarbyl group which may contain a heteroatom; R ex8 and R ex9 are each independently fluorine or trifluoromethyl. 2. The molecular resist composition of claim 1 wherein Ar 1 , Ar 2 and Ar 3 are a group having the formula (2), (3) and (4), respectively: wherein R 1 to R 21 are each independently hydrogen, hydroxy, cyano, halogen, a C 1 -C 20 hydrocarbyl group which may contain a heteroatom, or a group having any one of formulae (1a) to (1c), at least one of R 1 to R 21 being a group having any one of formulae (1a) to (1c), p, q and r are each independently 0 or 1, the broken line designates a valence bond. 3. The molecular resist composition of claim 1 wherein X − is nitrate ion, hydrogensulfate ion, hydrogencarbonate ion, tetraphenylborate ion, or an anion having any one of the formulae (5) to (8): wherein R 31 is a C 1 -C 40 hydrocarbyl group which may contain a heteroatom, exclusive of a hydrocarbyl group in which hydrogen on α-carbon relative to the carboxy group is substituted by fluorine or trifluoromethyl, R 41 and R 42 are each independently a C 1 -C 40 hydrocarbyl group which may contain a heteroatom, exclusive of a hydrocarbyl group in which hydrogen on α-carbon relative to the sulfonyl group is substituted by fluorine or trifluoromethyl, R 41 and R 42 may bond together to form a ring with the sulfur atoms to which they are attached and intervening atom, R 51 , R 52 and R 53 are each independently a C 1 -C 40 hydrocarbyl group which may contain a heteroatom, exclusive of a hydrocarbyl group in which hydrogen on α-carbon relative to the sulfonyl group is substituted by fluorine or trifluoromethyl, R 51 and R 52 may bond together to form a ring with the sulfur atoms to which they are attached and intervening atom, R 61 is fluorine or a C 1 -C 10 fluorinated hydrocarbyl group which may contain a hydroxy moiety, ether bond or ester bond, R 62 is hydrogen or a C 1 -C 20 hydrocarbyl group which may contain a hydroxy moiety, ether bond or ester bond, R 61 and R 62 may bond together to form a ring with the atoms to which they are attached. 4. The molecular resist composition of claim 1 , further comprising a radical trapping agent. 5. The molecular resist composition of claim 1 , further comprising a surfactant. 6. A pattern forming process comprising the steps of applying the molecular resist composition of claim 1 onto a substrate to form a resist film thereon, exposing the resist film to high-energy radiation, and developing the exposed resist film in a developer. 7. The process of claim 6 wherein the high-energy radiation is EB or EUV. 8. A molecular resist composition comprising a sulfonium salt selected from the group consisting of the following formulae, and an organic solvent, wherein the molecular resist composition does not contain a base polymer,

Assignees

Inventors

Classifications

  • G03F7/0045Primary

    with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

  • containing six membered aromatic rings · CPC title

  • having sulfur atoms of esterified sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings · CPC title

  • Sulfonium compounds · CPC title

  • The ring being saturated · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11940728B2 cover?
A molecular resist composition and a pattern forming process. A molecular resist composition comprising a sulfonium salt having a cation of specific structure and an organic solvent has a high sensitivity and forms a resist film with improved resolution and LWR, when processed by EB or EUV lithography. The molecular resist composition does not contain a base polymer. The molecular resist compos…
Who is the assignee on this patent?
Shinetsu Chemical Co
What technology area does this patent fall under?
Primary CPC classification G03F7/0045. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 26 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).